公开(公告)号：CA2044573A1

公开(公告)日：1992-01-07

申请号：CA2044573

申请日：1991-06-13

Applicant: IBM

Inventor： DAVIS CHARLES R ,  GOLDBLATT RONALD D ,  PARK JAE M

IPC: B29C41/12 ,  B29K79/00 ,  B29L7/00 ,  B32B27/06 ,  B32B27/34 ,  C08G73/10 ,  C08J5/18 ,  C09D179/08 ,  H01B3/30 ,  H05K1/03 ,  B29C39/14 ,  B29C39/38 ,  B32B31/12 ,  H05K1/05

Abstract: A structure comprising a free-standing polyamic acid film substantially free of phthalic acids. A method of fabricating such a structure which comprises applying a polyamic acid solution to a substrate, partially or substantially completely removing the solvent from the polyamic acid solution by heating the same, removing the free-standing polyamic acid film which is free from phthalic acids, laminating the film to a substrate at elevated temperature and pressure and thermally curing the laminated, free-standing polyamic acid film to the corresponding polyimide. A structure comprising one or a plurality of such free-standing polyamic acid films with electrically conducting layers therebetween is also disclosed as is a method of fabricating such a structure. Further disclosed is the use of a thermoplastic polyimide adhesive precursor which permits 2nd level multilayer packaging applications and a method for forming such packaging.

公开(公告)号：DE69115996T2

公开(公告)日：1996-07-11

申请号：DE69115996

申请日：1991-04-30

Applicant: IBM

Inventor： DAVIS CHARLES R ,  HSIAO RICHARD ,  LOOMIS JAMES R ,  PARK JAE M ,  REID JONATHAN D

IPC: H01R43/02 ,  B23K35/00 ,  B23K35/30 ,  H01R4/02 ,  H05K3/28 ,  H05K3/32 ,  H05K3/40 ,  H05K3/46

Abstract: A method is disclosed of simultaneously laminating circuitized dielectric layers to form a multilayer high performance circuit board and making interlevel electrical connections. The method selects two elements which will form a eutectic at one low temperature and will solidify to form an alloy which will only remelt at a second temperature higher than any required by any subsequent lamination. The joint is made using a transient liquid bonding technique and sufficient Au and Sn to result in a Au-Sn20wt% eutectic at the low temperature. Once solidified, the alloy formed remains solid throughout subsequent laminations. As a result, a composite, mulilayer, high performance circuit board is produced, electrically joined at selected lands by the solid alloy.

公开(公告)号：DE68922523T2

公开(公告)日：1996-01-18

申请号：DE68922523

申请日：1989-02-13

Applicant: IBM

Inventor： HODGSON SUSAN A ,  PARK JAE M ,  THOMAS RICHARD R

IPC: C08G69/48 ,  C08G59/14 ,  C08G59/40 ,  C08G59/42 ,  C08G59/44 ,  C08G73/10 ,  C08G85/00 ,  C23C18/16 ,  C23C18/20 ,  C23C18/30 ,  H05K1/03 ,  H05K3/18 ,  H01K3/18

Abstract: A reaction product of a beta -diketone and a polymer having groups that are reactive with the beta -diketone can be complexed with a metal. The reaction product having the complex metal can be activated to provide a substrate suitable for plating from an electroless metal plating bath.

公开(公告)号：DE69115996D1

公开(公告)日：1996-02-15

申请号：DE69115996

申请日：1991-04-30

Applicant: IBM

Inventor： DAVIS CHARLES R ,  HSIAO RICHARD ,  LOOMIS JAMES R ,  PARK JAE M ,  REID JONATHAN D

IPC: H01R43/02 ,  B23K35/00 ,  B23K35/30 ,  H01R4/02 ,  H05K3/28 ,  H05K3/32 ,  H05K3/40 ,  H05K3/46

Abstract: A method is disclosed of simultaneously laminating circuitized dielectric layers to form a multilayer high performance circuit board and making interlevel electrical connections. The method selects two elements which will form a eutectic at one low temperature and will solidify to form an alloy which will only remelt at a second temperature higher than any required by any subsequent lamination. The joint is made using a transient liquid bonding technique and sufficient Au and Sn to result in a Au-Sn20wt% eutectic at the low temperature. Once solidified, the alloy formed remains solid throughout subsequent laminations. As a result, a composite, mulilayer, high performance circuit board is produced, electrically joined at selected lands by the solid alloy.

公开(公告)号：DE68922523D1

公开(公告)日：1995-06-14

申请号：DE68922523

申请日：1989-02-13

Applicant: IBM

Inventor： HODGSON SUSAN A ,  PARK JAE M ,  THOMAS RICHARD R

IPC: C08G69/48 ,  C08G59/14 ,  C08G59/40 ,  C08G59/42 ,  C08G59/44 ,  C08G73/10 ,  C08G85/00 ,  C23C18/16 ,  C23C18/20 ,  C23C18/30 ,  H05K1/03 ,  H05K3/18 ,  H01K3/18

Abstract: A reaction product of a beta -diketone and a polymer having groups that are reactive with the beta -diketone can be complexed with a metal. The reaction product having the complex metal can be activated to provide a substrate suitable for plating from an electroless metal plating bath.