公开(公告)号：JPH04238693A

公开(公告)日：1992-08-26

申请号：JP13162491

申请日：1991-05-08

Applicant: IBM

Inventor： MAATEIN JIYOZEFU GOORUDOBAAGU ,  HIROSHI ITOU ,  KARORAIN AN KOBATSUKU ,  MAIKURU JIYON PAAMAA ,  ROJIYAA ARAN PORAKU ,  PEIJI ADAMUZU PUA

IPC: B23K1/00 ,  B23K35/22 ,  B23K35/34 ,  B23K101/40 ,  H05K3/10 ,  H05K3/34

Abstract: PURPOSE: To provide a chemical soldering technique with which a good metallurgical effect is obtained using low temperature and metal is formed upon heating. CONSTITUTION: A chemical solder composition including an organometallic which thermally degrades to a metal and volatile compounds and a polymeric matrix that decomposes to volatile fractions leaving only the metal, both within a predetermined temperature range, is selected and the bonding method utilizing it is comprised.