公开(公告)号：JPH02190475A

公开(公告)日：1990-07-26

申请号：JP30229589

申请日：1989-11-22

Applicant: IBM

Inventor： ARUFURETSUDO BIIBETSUKU ,  SUTEIIBUN RESURII BUTSUKUUOORU ,  UIRIAMU AASAA DONSON ,  JIYON JIYOZEFU GURENINGU ,  MAATEIN JIYOZEFU GOORUDOBAAGU ,  KUATO RUUDORUFU GURIIBU ,  KARORAIN AN KOBATSUKU ,  RINDA KARORIN MASHIYUU ,  UOORUTAA POORU PAUROUSUKII ,  MAAKU JIEFURII SHIYATSUTO ,  MAIKURU ROI SHIYOIAAMAN ,  SUTEIIBUN RIIOU TEISUDEIRU

IPC: C23C18/20 ,  C08J5/12 ,  C08J7/00 ,  C23C18/16 ,  C23C18/28 ,  H05K3/38

公开(公告)号：JPH06322547A

公开(公告)日：1994-11-22

申请号：JP21022593

申请日：1993-08-25

Applicant: IBM

Inventor： ARUFURETSUDO BIIBETSUKU ,  SUTEIIBUN RESURII BUTSUKUUOORU ,  UIRIAMU AASAA DONSON ,  JIYON JIYOSEFU GURENINGU ,  MAATEIN JIYOZEFU GOORUDOBAAGU ,  KUATO RUUDORUFU GURIIBU ,  KARORAIN AN KOBATSUKU ,  RINDA KARORIN MASHIYUU ,  UOORUTAA POORU PAUROUSUKII ,  MAAKU JIEFURII SHIYATSUTO ,  MAIKURU ROI SHIYOIAAMAN ,  SUTEIIBUN RIIOU TEISUDEIRU

IPC: C23C18/20 ,  C08J5/12 ,  C08J7/00 ,  C23C18/16 ,  C23C18/28 ,  H05K3/38

公开(公告)号：JPH04238693A

公开(公告)日：1992-08-26

申请号：JP13162491

申请日：1991-05-08

Applicant: IBM

Inventor： MAATEIN JIYOZEFU GOORUDOBAAGU ,  HIROSHI ITOU ,  KARORAIN AN KOBATSUKU ,  MAIKURU JIYON PAAMAA ,  ROJIYAA ARAN PORAKU ,  PEIJI ADAMUZU PUA

IPC: B23K1/00 ,  B23K35/22 ,  B23K35/34 ,  B23K101/40 ,  H05K3/10 ,  H05K3/34

Abstract: PURPOSE: To provide a chemical soldering technique with which a good metallurgical effect is obtained using low temperature and metal is formed upon heating. CONSTITUTION: A chemical solder composition including an organometallic which thermally degrades to a metal and volatile compounds and a polymeric matrix that decomposes to volatile fractions leaving only the metal, both within a predetermined temperature range, is selected and the bonding method utilizing it is comprised.