公开(公告)号：JPS63116379A

公开(公告)日：1988-05-20

申请号：JP16994887

申请日：1987-07-09

Applicant: IBM

Inventor： BIRENDORA NASU AGARUWARA ,  POORU HARII PAAMATEIA ,  DAAYUAN SHII

IPC: H01L21/48 ,  H01L23/498 ,  H01L23/50 ,  H01R12/04 ,  H01R12/55 ,  H05K1/18 ,  H05K3/34

公开(公告)号：JPS57112973A

公开(公告)日：1982-07-14

申请号：JP18562781

申请日：1981-11-20

Applicant: IBM

Inventor： NOOMAN JIYOOJI EINSURII ,  JIEEMUZU EDOWAADO KURUZANOOSUK ,  POORU HARII PAAMATEIA

IPC: B23K1/00 ,  B23K35/00 ,  B23K35/14 ,  B23K35/26 ,  B23K35/30 ,  H01L21/48

公开(公告)号：JPS58107295A

公开(公告)日：1983-06-25

申请号：JP18222282

申请日：1982-10-19

Applicant: IBM

Inventor： NOOMAN JIYOOJI EINSURII ,  JIYOSEFU MASHIYUU HAABIRUCHIYA ,  MARIO JIYON INTARANTE ,  UIRIAMU JIYOSEFU KINGU JIYUNIA ,  POORU HARII PAAMATEIA ,  JIYON FURANSHISU SARIBUAN

IPC: C22C5/02 ,  B23K1/00 ,  B23K35/00 ,  B23K35/20 ,  B23K35/30 ,  H01L21/48

公开(公告)号：JPS58119663A

公开(公告)日：1983-07-16

申请号：JP18221782

申请日：1982-10-19

Applicant: IBM

Inventor： RAJI NABUINCHIYANDORA MASUTA ,  MAABUIN SUTANREE PITSUTORAA ,  POORU ANSONII TOTSUTA ,  NOOMAN JIYOOJI EINSURII ,  POORU HARII PAAMATEIA

IPC: B23K1/20 ,  H01L21/48 ,  H01L23/498 ,  H01L23/50 ,  H05K3/24 ,  H05K3/34

Abstract: In the process for joining metallic coated connector pins (20) to a multilayer ceramic substrate (10), contact areas on the substrate are formed by sequential coatings of molybdenum (12) and nickel (14), which are heated to diffuse the nickel. A pure gold paste is applied by screen printing, for example, followed by the step of firing to burn out the paste binder and to sinter the pure gold particles onto a dense low porosity structure. The sintering operation converts the Ni film (14) into a continuous Au-Ni solid solution. During pin braze, Ni-Sn intermetallics are dispersed in a gold rich matrix of the Au-Ni solid solution.