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公开(公告)号：JPH08130049A
公开(公告)日：1996-05-21
申请号：JP17636695
申请日：1995-07-12
Applicant: IBM
Inventor： POORU UIRIAMU KOTEASU , ARUFUONSO FUIRITSUPU RANZETSUT
Abstract: PROBLEM TO BE SOLVED: To provide a pad-on-pad type contact for electronic devices. SOLUTION: A contact includes a spring member 10 which comprises: a support segment 11, a spring segment 12 having a part which has the same direction and the angle as the support segment 11, and a compressed segment 13 which is almost equal in size to a pad face and substantially parallel to the pad face. By virtue of a shape and a material of the spring member 10, when contacts 14 and 15 come in contact with each other, pad surfaces 16 and 17 get into wiping with each other, and subsequently both members are secured under a permanent compressive force through a period of use.
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2.发明专利
公开(公告)号：JPH04233245A
公开(公告)日：1992-08-21
申请号：JP13509291
申请日：1991-06-06
Applicant: IBM
Inventor： TOOMASU MARIO SHIPORA , POORU UIRIAMU KOTEASU , GUREN UORUDEN JIYONSON , FUIRITSUPU MAAFUII , KURISUTOFUAA UORUTAA OODEN
Abstract: PURPOSE: To improve precision by making the image of a connecting electrode pattern coincide with the image of bonding parts of a lead frame, detecting position attitude difference between two models, adjusting the position attitudes of the thermode, and a gripper, and making the connecting electrode pattern coincide with the bonding parts of the lead frame. CONSTITUTION: By comparing the picked up image of a lead frame with the model of bonding parts, abnormal lead frames are detected and classified. A TAB tape can be adjustably moved in the X-dimension, but cannot be moved adjustably in the Y-dimension. A plurality of elements of chip positioning/ bonding system have dimensions which the elements cannot make freely adjustable. While position control functions are shared among various elements of the system, adjustable position control functions overlap can be avoided.
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