公开(公告)号：JPH0888581A

公开(公告)日：1996-04-02

申请号：JP19213195

申请日：1995-07-27

Applicant: IBM

Inventor： MIKAERU JIYON BURADEI ,  TOOMASU KOFUINO ,  HAAREI KENTO HAINRITSUHI ,  GUREN UORUDEN JIYONSON ,  POORU ANDORIYUU MOSUKOUITSUCHI ,  JIYOOJI FUREDERITSUKU UOOKAA

IPC: H01Q1/40 ,  G01V15/00 ,  G06K19/077 ,  H01Q1/22 ,  H01Q7/00 ,  H01Q9/16 ,  H01Q21/26 ,  H01Q21/28 ,  H04B1/38 ,  H04B1/59

Abstract: PROBLEM TO BE SOLVED: To provide a radio frequency(RF) identification tag device with which mass production is enabled at reduced cost by providing an antenna element with a wire, connected through a wire bond connection to a connecting part on a semiconductor, and encapsulating it with a cover made of an organic substance. SOLUTION: An antenna 133 connected to a semiconductor circuit 111 on a substrate 141 is formed of 1st and 2nd wires 131 and 132 having connecting terminals connected to and opening terminals disconnected from 1st and 2nd connecting parts 121 and 122 by wire bond connections. Then, lengths 162 and 163 of wires 131 and 132 are determined corresponding to the frequency of RF signal to be transmitted. Besides, the circuit 111, the antenna 133 and the substrate 141 are encapsulated by a cover made of an organic substance 151. Thus, an RF identification tag device 100 can be produced from daily utensil materials at reduced cost while enable mass production. In this case, it is preferable that the lengths of wires 131 and 132 are equal and a wavelength is the 1/4 wavelength of the frequency of a signal.

公开(公告)号：JPH04233245A

公开(公告)日：1992-08-21

申请号：JP13509291

申请日：1991-06-06

Applicant: IBM

Inventor： TOOMASU MARIO SHIPORA ,  POORU UIRIAMU KOTEASU ,  GUREN UORUDEN JIYONSON ,  FUIRITSUPU MAAFUII ,  KURISUTOFUAA UORUTAA OODEN

IPC: H01L21/60 ,  H01L21/00 ,  H01L21/66 ,  H01L21/68

Abstract: PURPOSE: To improve precision by making the image of a connecting electrode pattern coincide with the image of bonding parts of a lead frame, detecting position attitude difference between two models, adjusting the position attitudes of the thermode, and a gripper, and making the connecting electrode pattern coincide with the bonding parts of the lead frame. CONSTITUTION: By comparing the picked up image of a lead frame with the model of bonding parts, abnormal lead frames are detected and classified. A TAB tape can be adjustably moved in the X-dimension, but cannot be moved adjustably in the Y-dimension. A plurality of elements of chip positioning/ bonding system have dimensions which the elements cannot make freely adjustable. While position control functions are shared among various elements of the system, adjustable position control functions overlap can be avoided.

公开(公告)号：JPH0661606A

公开(公告)日：1994-03-04

申请号：JP11746793

申请日：1993-05-19

Applicant: IBM

Inventor： TOMASU MARIO SAIPOORA ,  POORU UIRIAMU KOTEUSU ,  IOANISU DAMIANAKISU ,  GUREN UORUDEN JIYONSON ,  PIITAA JIERARUDO REDAAMAN ,  RINDA KARORIN MASHIYUU ,  ROORENSU SHIYANGUUEI MOTSUKU

IPC: H01L25/18 ,  H01L25/065 ,  H01L25/07 ,  H05K1/14 ,  H05K1/18 ,  H05K3/32 ,  H05K3/34 ,  H05K3/36 ,  H05K3/40

Abstract: PURPOSE: To form a cubic structure by laminating integrated circuit chips to make a three-dimensional packaging. CONSTITUTION: A first substrate 14 to which a chip 11 is mounted has conductors, one end of each conductor is electrically connected to a chip contact 206 and the other end forms pin-like electric connection mounts 444. The pin-like structure may be formed by a protrusion of the first substrate 14 having the conductors extending to the surface, or otherwise formed as a structure having parts extending like a cantilever from both faces of the end of the first substrate and solder charged in the space therebetween. The pin-like structure may be soldered directly to the conductors on the surface of a second substrate 21 or inserted and coupled in a hole of this substrate.

公开(公告)号：JPH0540214A

公开(公告)日：1993-02-19

申请号：JP11769391

申请日：1991-05-22

Applicant: IBM

Inventor： MAAKU FUIIRUDEINGU BURETSUGUMA ,  UIRIAMU DEIIN BUREWAA ,  MITSUCHIERU SHIMONZU KOOHEN ,  GUREN UORUDEN JIYONSON ,  ISUMAIRU SEBUDETSUTO NOYAN ,  MODESUTO MAIKERU OPURISUKO ,  MAAKU BII RITSUTAA ,  DENISU RII ROJIYAAZU ,  JIININ MADERIN TOREUERA

IPC: G02B6/42 ,  G02B6/43 ,  H01L31/12 ,  H01L31/167 ,  H04B10/00

Abstract: PURPOSE: To provide an electrooptical connector which copes with high-density applications and meets positioning requests in a wide range and has a high optical crosstalk immunity. CONSTITUTION: A connector provided with an upper half part and a low half part 201 is provided, and each half part is provided with an LED chip 202 or 204 and a detector chip 203 or 205, and a small lens array 210 acting as an energy transfer medium is provided between two half parts to form optical connection.