公开(公告)号：JPH02165647A

公开(公告)日：1990-06-26

申请号：JP27733789

申请日：1989-10-26

Applicant: IBM

Inventor： HARII RANDERU BIITSUKUFUOODO ,  MAAKU FUIIRUDENGU BUREGUMAN ,  TOOMASU MARIO SHIPORA ,  JIYON GOU SAADO ,  PIIITAA JIERAADO REDAAMAN ,  EKEHAADO FURITSUTSU MIIICHI ,  REONAADO SEODOORE ORUSON ,  DEBUIDO PIIITAA PAGUNANI ,  TEIMOSHIII KURAAKU REIREI ,  UUPO ERITSUKU SOU ,  WARUTAA BUARERIAN BUIRUKERIISU

IPC: H01L21/60 ,  H01L23/495 ,  H01L23/498

Abstract: PURPOSE: To obtain a metallic structure electrically and mutually connecting an electronic device suited to tape automated bonding to a substrate by projecting a beam lead into an opening in cantilever and positioning the internal tip of the lead substantially within the same flat surface so as to bond to a contact position on IC. CONSTITUTION: A tape automated bonding TAB tape with one metallic layer and one insulated layer is provided with a flexible carrier 12. Plural conductors 14 are prepared on a carrier 12, each conductor is provided with one internal lead bonding tip 16 and one external lead bonding tip 18, and the plural conductors are projected in cantilever inside toward an opening 20 in a carrier in general. The internal tip of the beam lead 14 is bonded to a contact butt on a device 22. The external tip 18 of the beam lead 14 is extended across an opening 24 and as the opening 24 exists, the external tip 18 is bonded to a substrate such as a printed circuit board to electrically connect the device 22 to the substrate.

公开(公告)号：JPH04277639A

公开(公告)日：1992-10-02

申请号：JP28980791

申请日：1991-11-06

Applicant: IBM

Inventor： TOOMASU MARIO SHIPORA ,  POORU UIRIAMU KOTEUSU ,  ROBAATO HENRII KATEIRU ,  ROBAATO JIYOSEFU KERUHAA ,  POORU ANDORIYUU MOSUKOUITSUTSU

IPC: H01L21/60 ,  H01L23/485

Abstract: PURPOSE: To provide a mount structure which connects conductors fitted to a carrier at difference height positions to contact places on a flat substrate. CONSTITUTION: On a surface 1 of the substrate, connection parts 5, 6, and 7 in a swelled shape are formed and made tall enough to reach the height position of individual conductors 15, 17, and 19 to which their connection parts fitted to the carrier 11 are bonded. In the extension plane of the conductors, the conductor and connection parts are bonded. To form the connection part in the swelled shape, sticking bodies of solder are stuck and formed on a pad formed on the surface of the substrate and the connection parts are made spherical by surface tension by performing a reflow process for the sticking bodies. The heights of the connection parts after the reflow process can be controlled by the area of the pad and the volumetric amount of the solder which is stuck and formed.

公开(公告)号：JPH04233246A

公开(公告)日：1992-08-21

申请号：JP13541091

申请日：1991-04-17

Applicant: IBM

Inventor： TOOMASU MARIO SHIPORA ,  REIMONDO ROBAATO HOOTON ,  ARUFUONSO FUIRITSUPU RANZETSUT ,  MAIKERU JIYON PARUMAA ,  MAAKU BII RITSUTAA

IPC: H01L21/60 ,  H01L21/00

Abstract: PURPOSE: To move a tape without bringing a lead frame into contact with a circuit on a tape, and enable the suitable positioning of a chip on a TAB lead frame. CONSTITUTION: A stationary jaw assembly 12 is provided with facing jaws 122, 124 which clamp the end portion of a tape 22, when closed and release the end portion, when opened. A movable gripping assembly 10 is provided with a lower movable gripper 72 positioned below a tape and an upper movable gripper 100 positioned above the tape. Both grippers move in the directions of approaching and leaving to and from the tape 22. In the case of approaching, the grippers clamp the tape. By a tape feeder, the movable gripper assembly is made to reciprocate so that it approaches the stationary jaw assembly and leaves away from it along the length of the tape.

公开(公告)号：JPH08264690A

公开(公告)日：1996-10-11

申请号：JP5013896

申请日：1996-03-07

Applicant: IBM

Inventor： TOOMASU MARIO SHIPORA ,  POURU UIRIAMU KOTEYUUSU

IPC: H01L23/367 ,  H01L23/40

Abstract: PROBLEM TO BE SOLVED: To provide a heat sink which is suitable for an electronic device of high density and improved so as to be detachable. SOLUTION: Posst-type fasteners 7A to 7C which are provided with one ends that are inserted in a circuit card 2 and frictionally coupled to it and other ends that extend penetrating through a heat sink 3 and press the heat sink against the heat sink 3 are employed. The post-type fasteners 7A to 7C are arranged around a chip package 1, hold the heat sink in parallel with the circuit card 2, and apply a pressure to the chip package 1. This packaging structure comes into contact such as compressive thermal conduction contact with the chip package only in a radiation shield region, and the heat sink 3 larger in area than a chip package region supported by the circuit card 2 can be realized.

公开(公告)号：JPH04233245A

公开(公告)日：1992-08-21

申请号：JP13509291

申请日：1991-06-06

Applicant: IBM

Inventor： TOOMASU MARIO SHIPORA ,  POORU UIRIAMU KOTEASU ,  GUREN UORUDEN JIYONSON ,  FUIRITSUPU MAAFUII ,  KURISUTOFUAA UORUTAA OODEN

IPC: H01L21/60 ,  H01L21/00 ,  H01L21/66 ,  H01L21/68

Abstract: PURPOSE: To improve precision by making the image of a connecting electrode pattern coincide with the image of bonding parts of a lead frame, detecting position attitude difference between two models, adjusting the position attitudes of the thermode, and a gripper, and making the connecting electrode pattern coincide with the bonding parts of the lead frame. CONSTITUTION: By comparing the picked up image of a lead frame with the model of bonding parts, abnormal lead frames are detected and classified. A TAB tape can be adjustably moved in the X-dimension, but cannot be moved adjustably in the Y-dimension. A plurality of elements of chip positioning/ bonding system have dimensions which the elements cannot make freely adjustable. While position control functions are shared among various elements of the system, adjustable position control functions overlap can be avoided.