公开(公告)号：US3805160A

公开(公告)日：1974-04-16

申请号：US24748972

申请日：1972-04-25

Applicant: IBM

Inventor： PHILBRICK J ,  PILLUS C ,  POPONIAK M ,  SCHNEIDER C

IPC: G01R27/00 ,  G01N27/02 ,  G01R27/02 ,  H01L21/66 ,  G01R31/26

CPC classification number: G01R27/02 ,  G01N27/023

Abstract: The apparatus and technique discloses a method for measuring the resistivity of semiconductor material over several decades by varying the inductance of a RF energized coil and where the method is significantly independent of operating frequency, type of semiconductor material and the nature of the sample surface and surface and surface condition or preparation.

Abstract translation: 该装置和技术公开了一种通过改变RF激励线圈的电感来测量半导体材料的电阻率的方法，其中该方法显着地独立于工作频率，半导体材料的类型和样品表面和表面的性质 和表面状况或制备。

公开(公告)号：US3767304A

公开(公告)日：1973-10-23

申请号：US3767304D

申请日：1972-07-03

Applicant: IBM

Inventor： KEENAN W ,  POPONIAK M ,  YEH T

IPC: H01L21/66 ,  G01N21/95 ,  G01R31/265 ,  G01N21/16 ,  G01N21/32

CPC classification number: G01N21/9505 ,  G01R31/2656

Abstract: An apparatus for detecting the presence of inclusions in semiconductor material having a polychromatic light source, a support for a semiconductor body, a light sensing means positioned to operate on light transmitted through the body from the light source, the sensing means including a substrate of the same type of semiconductor materials as the material of the semiconductor body, and having at least a PN junction in the substrate with means to backbias the junction, a means to indicate the relative amounts of light transmitted through the semiconductor body that is sensed by the sensing means. A method for detecting internal inclusion in a semiconductor body by directing through the body a beam of polychromatic light, sensing the light energy transmitted to the body with a light sensing element of the same type semiconductor material as the body being investigated.

Abstract translation: 一种用于检测具有多色光源的半导体材料中的夹杂物的存在的装置，用于半导体本体的支撑件，定位成对从光源透射通过本体的光进行操作的光感测装置，所述感测装置包括： 与半导体本体的材料相同类型的半导体材料，并且在衬底中具有至少一个PN结的装置，其具有用于反向连接的装置，用于指示透射通过半导体主体的光的相对量的装置，其通过感测感测 手段。