公开(公告)号：MY127260A

公开(公告)日：2006-11-30

申请号：MYPI20015266

申请日：2001-11-16

Applicant: IBM

Inventor： ALESSANDRO CESARE CALLEGARI ,  KEI-HSIUNG YANG ,  FUAD ELIAS DOANY ,  PRAVEEN CHAUDHARI ,  JAMES P DOYLE ,  EILEEN A GALLIGAN ,  JAMES H GLOWNIA ,  GARETH G HOUGHAM ,  JAMES A LACEY ,  SHUI-CHIH (ALAN) LIEN ,  MINHUA LU ,  ALAN E ROSENBLUTH

IPC: C07C1/00 ,  B01J19/12 ,  C01B31/02 ,  C23C14/48 ,  C23C14/58 ,  G02F1/133 ,  G02F1/1337

Abstract: A METHOD FOR PREPARING AN ALIGNMENT LAYER SURFACE PROVIDES A SURFACE ON THE ALIGNMENT LAYER (104). THE SURFACE (112) IS BOMBARDED WITH IONS (110), AND REACTIVE GAS IS INTRODUCED TO THE ION BEAM TO SATURATE DANGLING BONDS ON THE SURFACE. ANOTHER METHOD FOR PREPARING AN ALIGNMENT LAYER SURFACE PROVIDES A SURFACE ON THE ALIGNMENT LAYER. THE SURFACE IS BOMBARDED WITH IONS (116) AND QUENCHED WITH A REACTIVE COMPONENT TO SATURATE DANGLING BONDS ON THE SURFACE .(FIG. 7)

公开(公告)号：IT1165447B

公开(公告)日：1987-04-22

申请号：IT2608679

申请日：1979-09-28

Applicant: IBM

Inventor： PRAVEEN CHAUDHARI ,  KIESSLING JOHN BRADFORD ,  PERLAMN DAVID JACOB ,  TYNAN EUGENE EDWARD ,  VON GUTFELD ROBERT JACOB

IPC: H01R43/00 ,  B23K26/22 ,  H01L21/60 ,  H01R43/02 ,  H05K3/32 ,  B23K

Abstract: 1. A method for bonding a metallic wire (13) to a microcircuit conductor (11), characterized in that it includes the steps of : a. applying said wire to the conductor, b. maintaining said wire in close contact with said conductor, c. applying a focussed energy beam (14) directed towards a point at least tangentially in contact with said wire, and forming a hole in said conductor, and d. applying additional energy to portions of said wire adjacent to said point for melting the wire metal so that the metal flows into said hole (15) to form an electrical contact between the wire and the conductor.