-
1.发明专利
公开(公告)号：JP2005115942A
公开(公告)日：2005-04-28
申请号：JP2004283520
申请日：2004-09-29
Applicant: Internatl Business Mach Corp
, インターナショナル・ビジネス・マシーンズ・コーポレーションInternational Business Maschines Corporation Inventor： VON GUTFELD ROBERT JACOB
CPC classification number: F25B27/02 , F25B15/02 , F25B2333/002 , G06F1/20 , G06F1/206
Abstract: PROBLEM TO BE SOLVED: To provide a method and an apparatus which recirculate a portion of heat generated in the apparatus or a system to cause local refrigeration. SOLUTION: This cooling apparatus includes a chamber for receiving at least a portion of the heat, the chamber containing a refrigerant therein; a condenser for receiving the refrigerant heated in the chamber, the refrigerant is pressurized and cooled in the condenser; and at least one coil coupled to the condenser and leading to a region to be cooled. The at least one coil includes a first portion coupled to the condenser, a second portion downstream from the first portion and a third portion downstream of the second portion. The second downstream portion contains an orifice for free expansion to cause cooling of the region and the third downstream portion leads from the region to be cooled back to the chamber. COPYRIGHT: (C)2005,JPO&NCIPI
Abstract translation: 要解决的问题：提供一种方法和装置，其使在装置或系统中产生的一部分热量再循环以引起局部制冷。 解决方案：该冷却装置包括用于容纳至少一部分热量的室，其中容纳有制冷剂的室; 用于接收在室内加热的制冷剂的冷凝器，制冷剂在冷凝器中被加压和冷却; 以及至少一个线圈，其联接到冷凝器并通向待冷却的区域。 所述至少一个线圈包括联接到所述冷凝器的第一部分，所述第一部分下游的第二部分和所述第二部分下游的第三部分。 第二下游部分包含用于自由膨胀以使区域冷却并且第三下游部分从要冷却的区域引导回到室的孔口。 版权所有（C）2005，JPO＆NCIPI
-
公开(公告)号：DE3060691D1
公开(公告)日：1982-09-16
申请号：DE3060691
申请日：1980-03-27
Applicant: IBM
Inventor： MELCHER ROBERT LEE , ROMANKIW LUBOMYR TARAS , VON GUTFELD ROBERT JACOB
IPC: H05K3/06 , B23K26/12 , C23F1/02 , C23F4/00 , C25F3/14 , H01L21/306 , H01L21/3213 , H05K3/22 , B23K26/00
Abstract: A method for high resolution maskless chemical and electrochemical machining is described. Preferential etching results from exposing those regions where machining is sought to an energy beam. Such exposures can increase the ething rate in the case of electrochemical machining by a factor of 103 to 104. Such enhancement is sufficient to make masking unnecessary.
-
公开(公告)号：DE3060612D1
公开(公告)日：1982-08-19
申请号：DE3060612
申请日：1980-03-27
Applicant: IBM
Inventor： BLUM SAMUEL EMIL , KOVAC ZLATA , VON GUTFELD ROBERT JACOB
Abstract: A method for high resolution maskless electroless plating is described. Preferential plating results from exposing those regions where plating is sought to an energy beam to increase the plating rate by a factor of 103 to 104. This enhancement is sufficient to make masking unnecessary.
-
公开(公告)号：DE3467779D1
公开(公告)日：1988-01-07
申请号：DE3467779
申请日：1984-05-21
Applicant: IBM
Inventor： GELCHINSKI MORDECHAI HIRSH , ROMANKIW LUBOMYR TARAS , VIGLIOTTI DONALD RICHARD , VON GUTFELD ROBERT JACOB
IPC: H01L21/306 , C23C18/16 , C23F1/00 , C23F1/02 , C25D5/02 , C25D5/08 , C25F3/14 , H05K3/06 , H05K3/24
Abstract: An intense laser beam is focused at a jet nozzle through which an electrolyte is directed towards a substrate, so that the laser beam travels with the jet to the substrate. The laser beam heats the site of the substrate on which it falls, and thereby enhances the etching or plating process being carried out in the substrate.
-
公开(公告)号：IT1165447B
公开(公告)日：1987-04-22
申请号：IT2608679
申请日：1979-09-28
Applicant: IBM
Inventor： PRAVEEN CHAUDHARI , KIESSLING JOHN BRADFORD , PERLAMN DAVID JACOB , TYNAN EUGENE EDWARD , VON GUTFELD ROBERT JACOB
Abstract: 1. A method for bonding a metallic wire (13) to a microcircuit conductor (11), characterized in that it includes the steps of : a. applying said wire to the conductor, b. maintaining said wire in close contact with said conductor, c. applying a focussed energy beam (14) directed towards a point at least tangentially in contact with said wire, and forming a hole in said conductor, and d. applying additional energy to portions of said wire adjacent to said point for melting the wire metal so that the metal flows into said hole (15) to form an electrical contact between the wire and the conductor.
-
Patent Agency Ranking
公开(公告)号：DE69919429T2
公开(公告)日：2005-09-08
申请号：DE69919429
申请日：1999-02-25
Applicant: IBM
Inventor： KANE WILLIAM FRANCIS , VON GUTFELD ROBERT JACOB
IPC: B60K15/06 , B60S5/02 , F02D33/00 , F02M37/00 , G06Q10/04 , G06Q10/08 , G06Q30/02 , G06Q50/06 , B41J2/14
Abstract: A management system for a vehicle having a commodity storage region and traveling along a path having a plurality of geographically-distributed commodity replenishing stations, includes a sensor for measuring a level of the commodity in the storage region and providing commodity level data. A global positioning system (GPS) determines a location of the vehicle along the path. A controller stores a record of current geographical locations of the commodity replenishing stations and current commodity prices thereat, and calculates commodity replenishing schedules of the vehicle at the replenishing stations based on an output from each of the GPS and the sensor, and a commodity price at least some of the replenishing stations.
-
公开(公告)号：DE69106537D1
公开(公告)日：1995-02-23
申请号：DE69106537
申请日：1991-01-18
Applicant: IBM
Inventor： CHEN CHENGJUN JULIAN , VON GUTFELD ROBERT JACOB
Abstract: The invention comprises a two step method for the repair of "opens" (4) in an electronic circuit wherein initially the open is contacted with a plating solution (5) and a high frequency current is passed through the ends of the open in the circuit with the plating solution enabling the current to complete the path. Metal growth commences between the ends of the open to form a near open. Then the repair is completed by contacting the site with a high speed plating solution and applying a low frequency current.
-
公开(公告)号：AT31087T
公开(公告)日：1987-12-15
申请号：AT84105749
申请日：1984-05-21
Applicant: IBM
Inventor： GELCHINSKI MORDECHAI HIRSH , ROMANKIW LUBOMYR TARAS , VIGLIOTTI DONALD RICHARD , VON GUTFELD ROBERT JACOB
IPC: H01L21/306 , C23C18/16 , C23F1/00 , C23F1/02 , C25D5/02 , C25D5/08 , C25F3/14 , H05K3/06 , H05K3/24
Abstract: An intense laser beam is focused at a jet nozzle through which an electrolyte is directed towards a substrate, so that the laser beam travels with the jet to the substrate. The laser beam heats the site of the substrate on which it falls, and thereby enhances the etching or plating process being carried out in the substrate.
-
公开(公告)号：CA2168919A1
公开(公告)日：1997-02-25
申请号：CA2168919
申请日：1996-02-06
Applicant: IBM
Inventor： SCHKOLNICK MARIO , VON GUTFELD ROBERT JACOB
IPC: B62B3/00 , B62B5/00 , G06Q20/20 , G06Q20/34 , G07F7/02 , G07G1/00 , G08B13/24 , H04B5/02 , G09F3/00 , G06K19/073
Abstract: The present apparatus is a mobile shopping cart that can automatically keep track of objects selected and carried in the cart and provide a customer using the cart information like the total price of the items carried. The cart has a radio frequency cart base station with a cart antenna connected to a radio frequency cart transceiver. Various novel embodiments of the invention produce a radio frequency field within the shopping cart that is used to communicate with radio frequency tags on objects carried in the cart. The tags contain information about the respective carried object to which the tags are attached. A program function executed by the cart circuit and/or computer controls the cart transceiver to interrogate radio frequency tags within the radio frequency field, i.e. inside the cart to gain information about the carried objects. Tags on objects external to the cart are not interrogated.
-
公开(公告)号：DE69106537T2
公开(公告)日：1995-07-06
申请号：DE69106537
申请日：1991-01-18
Applicant: IBM
Inventor： CHEN CHENGJUN JULIAN , VON GUTFELD ROBERT JACOB
Abstract: The invention comprises a two step method for the repair of "opens" (4) in an electronic circuit wherein initially the open is contacted with a plating solution (5) and a high frequency current is passed through the ends of the open in the circuit with the plating solution enabling the current to complete the path. Metal growth commences between the ends of the open to form a near open. Then the repair is completed by contacting the site with a high speed plating solution and applying a low frequency current.
-
-
-
-
-
-
-
-
-
Search Results
14
records
(took 0.019 seconds)
