公开(公告)号：EP1704593A4

公开(公告)日：2010-06-23

申请号：EP05722439

申请日：2005-01-12

Applicant: IBM

Inventor： REDDY SRINIVASA N ,  FAROOQ MUKTA G ,  PRETTYMAN KEVIN M

IPC: H01L23/06 ,  H01L23/10 ,  H01L23/15 ,  H01L23/498 ,  H05K1/00 ,  H05K1/03 ,  H05K1/11

CPC classification number: H01L23/49811 ,  H01L23/49822 ,  H01L23/49827 ,  H01L2924/0002 ,  H01L2924/09701 ,  H05K1/0298 ,  H05K1/0306 ,  H05K1/113 ,  H05K2201/096 ,  H01L2924/00

公开(公告)号：WO2005067539A2

公开(公告)日：2005-07-28

申请号：PCT/US2005001367

申请日：2005-01-12

Applicant: IBM ,  REDDY SRINIVASA N ,  FAROOQ MUKTA G ,  PRETTYMAN KEVIN M

Inventor： REDDY SRINIVASA N ,  FAROOQ MUKTA G ,  PRETTYMAN KEVIN M

IPC: H01L23/06 ,  H01L23/10 ,  H01L23/15 ,  H01L23/498 ,  H05K1/00 ,  H05K1/03 ,  H05K1/11

CPC classification number: H01L23/49811 ,  H01L23/49822 ,  H01L23/49827 ,  H01L2924/0002 ,  H01L2924/09701 ,  H05K1/0298 ,  H05K1/0306 ,  H05K1/113 ,  H05K2201/096 ,  H01L2924/00

Abstract: A multilayer ceramic substrate in which an outer metal pad is anchored to the substrate by a single metal-filled via in the first ceramic layer adjacent to the metal pad. In turn, this single metal-filled via is anchored to the substrate by a larger, single metal-filled, via in the next ceramic layer adjacent to the first ceramic layer. Preferably, the metal filled vies and metal pad are 100 volume percent metal.

Abstract translation: 一种多层陶瓷基板，其中外金属焊盘通过与金属焊盘相邻的第一陶瓷层中的单个金属填充通孔锚定到基板。 反过来，这个单个金属填充的通孔在与第一陶瓷层相邻的下一个陶瓷层中通过更大的单个金属填充的通孔锚固到基底。 优选地，金属填充的金属和金属垫是100体积％的金属。

公开(公告)号：SG83119A1

公开(公告)日：2001-09-18

申请号：SG1999001619

申请日：1997-09-15

Applicant: IBM

Inventor： FASANO BENJAMIN V ,  PRETTYMAN KEVIN M

IPC: H01R12/57 ,  H01R24/50 ,  H01R43/00 ,  H05K1/02 ,  H05K1/14 ,  H05K3/32 ,  H05K3/34 ,  H05K3/40 ,  H01B13/20

Abstract: A surface mounted electronic interconnect device. The device includes a coaxial electrical pad comprising a plurality of conductive surfaces on a substrate corresponding to the conductor arrangement of a coaxial connector; and, a coaxial connector comprising a dielectric material having a center opening and isolated electrically conductive interior and exterior surfaces that are planar with the ends of the connector. The dielectric separates the inner conductive surface from the outer conductive surface and is tubularly shaped having an inner wall for the electrically conductive interior surface. The coaxial connector inner and outer conductors may alternatively be comprised of microsprings. The coaxial connector has first and second ends, the first end for attachment to an electronic package and the second end for pluggable attachment to a PC board. A socket for mating with the coaxial connector second end is demonstrated, comprising a body and inner and outer conductors and configured so as to contact the interior and exterior surfaces of the coaxial connector at different times. The inner conductor of the socket is adapted to be received within the electrically conductive interior surface of the coaxial connector.

公开(公告)号：SG64445A1

公开(公告)日：1999-04-27

申请号：SG1997003419

申请日：1997-09-15

Applicant: IBM

Inventor： FASANO BENJAMIN V ,  PRETTYMAN KEVIN M

IPC: H01R12/57 ,  H01R24/50 ,  H01R43/00 ,  H05K1/02 ,  H05K1/14 ,  H05K3/32 ,  H05K3/34 ,  H05K3/40 ,  H01R23/68 ,  H01R23/302 ,  H01R13/11 ,  H01R13/301 ,  H05K1/11

Abstract: A surface mounted electronic interconnect device. The device includes a coaxial electrical pad comprising a plurality of conductive surfaces on a substrate corresponding to the conductor arrangement of a coaxial connector; and, a coaxial connector comprising a dielectric material having a center opening and isolated electrically conductive interior and exterior surfaces that are planar with the ends of the connector. The dielectric separates the inner conductive surface from the outer conductive surface and is tubularly shaped having an inner wall for the electrically conductive interior surface. The coaxial connector inner and outer conductors may alternatively be comprised of microsprings. The coaxial connector has first and second ends, the first end for attachment to an electronic package and the second end for pluggable attachment to a PC board. A socket for mating with the coaxial connector second end is demonstrated, comprising a body and inner and outer conductors and configured so as to contact the interior and exterior surfaces of the coaxial connector at different times. The inner conductor of the socket is adapted to be received within the electrically conductive interior surface of the coaxial connector.