公开(公告)号：JP2000357874A

公开(公告)日：2000-12-26

申请号：JP2000149183

申请日：2000-05-22

Applicant: IBM

Inventor： FASANO BENJAMIN V ,  INDYK RICHARD F ,  KAMATH SUNDAR M ,  KNICKERBOCKER JOHN U ,  LANGENTHAL SCOTT I ,  O'CONNOR DANIEL P ,  REDDY SRINIVASA S N

IPC: H05K1/11 ,  B32B18/00 ,  H01L23/12 ,  H01L23/498 ,  H05K1/03 ,  H05K3/24 ,  H05K3/40 ,  H05K3/46

Abstract: PROBLEM TO BE SOLVED: To provide a ceramic substrate of low thermal-expansion factor by providing a plurality of layers of a multi-layer ceramic material comprising a sealing layer and a via hole which, filled with a metal material, comprises no ceramic material. SOLUTION: At a via hole part 24 of a first layer 12, a via hole 26 which, filled with a metal material, comprises no ceramic material is formed. A via hole 28 comprising a mixture of metal material and ceramic material is inserted in a second layer 14, and the via hole 28 so seals a ceramic substrate 10 not to penetrate deeper than the first layer 12. For a third layer 16, a via hole 30 comprising no ceramic material is formed related to the via hole 26 in the first layer 12. Thus, the via holes 26, 28, and 30 of the plurality of layers 12, 14, and 16 allows transmission of electric signal and power between layers, sealing an outside part layer 20 with a via hole 38.

公开(公告)号：JPH0925167A

公开(公告)日：1997-01-28

申请号：JP33144795

申请日：1995-12-20

Applicant: IBM ,  CARBORUNDUM CO

Inventor： CASEY JON A ,  CORDERO CARLA N ,  FASANO BENJAMIN V ,  GOLAND DAVID B ,  HANNON ROBERT ,  HARRIS JONATHAN H ,  HERRON LESTER W ,  JOHNSON GREGORY M ,  PATEL NIRANJAN M ,  REITTER ANDREW M ,  SHINDE SUBHASH L ,  VALLABHANENI RAO V ,  YOUNGMAN ROBERT A

IPC: B32B18/00 ,  B22F7/02 ,  C04B35/581 ,  C04B37/02 ,  C04B41/51 ,  C04B41/52 ,  C04B41/88 ,  C04B41/89 ,  C22C29/16 ,  H01L21/48 ,  H01L23/373 ,  H05K1/03 ,  H05K3/24 ,  H05K3/40 ,  H05K3/46

公开(公告)号：SG34299A1

公开(公告)日：1996-12-06

申请号：SG1995001804

申请日：1995-11-10

Applicant: IBM ,  CARBORUNDUM CO

Inventor： CASEY JON A ,  CORDERO CARLA N ,  FASANO BENJAMIN V ,  GOLAND DAVID B ,  HANNON ROBERT ,  HARRIS JONATHAN H ,  HERRON LESTER W ,  JOHNSON GREGORY M ,  PATEL NIRANJAN M ,  REITTER ANDREW M ,  SHINDE SUBHASH L ,  VALLABHANENI RAO V ,  YOUNGMAN ROBERT A

IPC: B22F7/02 ,  B32B18/00 ,  C04B35/581 ,  C04B37/02 ,  C04B41/51 ,  C04B41/52 ,  C04B41/88 ,  C04B41/89 ,  C22C29/16 ,  H01L21/48 ,  H01L23/373 ,  H05K1/03 ,  H05K3/24 ,  H05K3/40 ,  H05K3/46

Abstract: Disclosed is an aluminum nitride body having graded metallurgy and a method for making such a body. The aluminum nitride body has at least one via and includes a first layer in direct contact with the aluminum nitride body and a second layer in direct contact with, and that completely encapsulates, the first layer. The first layer includes 30 to 60 volume percent aluminum nitride and 40 to 70 volume percent tungsten and/or molybdenum while the second layer includes 90 to 100 volume percent of tungsten and/or molybdenum and 0 to 10 volume percent of aluminum nitride.

公开(公告)号：SG83119A1

公开(公告)日：2001-09-18

申请号：SG1999001619

申请日：1997-09-15

Applicant: IBM

Inventor： FASANO BENJAMIN V ,  PRETTYMAN KEVIN M

IPC: H01R12/57 ,  H01R24/50 ,  H01R43/00 ,  H05K1/02 ,  H05K1/14 ,  H05K3/32 ,  H05K3/34 ,  H05K3/40 ,  H01B13/20

Abstract: A surface mounted electronic interconnect device. The device includes a coaxial electrical pad comprising a plurality of conductive surfaces on a substrate corresponding to the conductor arrangement of a coaxial connector; and, a coaxial connector comprising a dielectric material having a center opening and isolated electrically conductive interior and exterior surfaces that are planar with the ends of the connector. The dielectric separates the inner conductive surface from the outer conductive surface and is tubularly shaped having an inner wall for the electrically conductive interior surface. The coaxial connector inner and outer conductors may alternatively be comprised of microsprings. The coaxial connector has first and second ends, the first end for attachment to an electronic package and the second end for pluggable attachment to a PC board. A socket for mating with the coaxial connector second end is demonstrated, comprising a body and inner and outer conductors and configured so as to contact the interior and exterior surfaces of the coaxial connector at different times. The inner conductor of the socket is adapted to be received within the electrically conductive interior surface of the coaxial connector.

公开(公告)号：SG64445A1

公开(公告)日：1999-04-27

申请号：SG1997003419

申请日：1997-09-15

Applicant: IBM

Inventor： FASANO BENJAMIN V ,  PRETTYMAN KEVIN M

IPC: H01R12/57 ,  H01R24/50 ,  H01R43/00 ,  H05K1/02 ,  H05K1/14 ,  H05K3/32 ,  H05K3/34 ,  H05K3/40 ,  H01R23/68 ,  H01R23/302 ,  H01R13/11 ,  H01R13/301 ,  H05K1/11

Abstract: A surface mounted electronic interconnect device. The device includes a coaxial electrical pad comprising a plurality of conductive surfaces on a substrate corresponding to the conductor arrangement of a coaxial connector; and, a coaxial connector comprising a dielectric material having a center opening and isolated electrically conductive interior and exterior surfaces that are planar with the ends of the connector. The dielectric separates the inner conductive surface from the outer conductive surface and is tubularly shaped having an inner wall for the electrically conductive interior surface. The coaxial connector inner and outer conductors may alternatively be comprised of microsprings. The coaxial connector has first and second ends, the first end for attachment to an electronic package and the second end for pluggable attachment to a PC board. A socket for mating with the coaxial connector second end is demonstrated, comprising a body and inner and outer conductors and configured so as to contact the interior and exterior surfaces of the coaxial connector at different times. The inner conductor of the socket is adapted to be received within the electrically conductive interior surface of the coaxial connector.