公开(公告)号：EP1704593A4

公开(公告)日：2010-06-23

申请号：EP05722439

申请日：2005-01-12

Applicant: IBM

Inventor： REDDY SRINIVASA N ,  FAROOQ MUKTA G ,  PRETTYMAN KEVIN M

IPC: H01L23/06 ,  H01L23/10 ,  H01L23/15 ,  H01L23/498 ,  H05K1/00 ,  H05K1/03 ,  H05K1/11

CPC classification number: H01L23/49811 ,  H01L23/49822 ,  H01L23/49827 ,  H01L2924/0002 ,  H01L2924/09701 ,  H05K1/0298 ,  H05K1/0306 ,  H05K1/113 ,  H05K2201/096 ,  H01L2924/00

公开(公告)号：WO2005067539A2

公开(公告)日：2005-07-28

申请号：PCT/US2005001367

申请日：2005-01-12

Applicant: IBM ,  REDDY SRINIVASA N ,  FAROOQ MUKTA G ,  PRETTYMAN KEVIN M

Inventor： REDDY SRINIVASA N ,  FAROOQ MUKTA G ,  PRETTYMAN KEVIN M

IPC: H01L23/06 ,  H01L23/10 ,  H01L23/15 ,  H01L23/498 ,  H05K1/00 ,  H05K1/03 ,  H05K1/11

CPC classification number: H01L23/49811 ,  H01L23/49822 ,  H01L23/49827 ,  H01L2924/0002 ,  H01L2924/09701 ,  H05K1/0298 ,  H05K1/0306 ,  H05K1/113 ,  H05K2201/096 ,  H01L2924/00

Abstract: A multilayer ceramic substrate in which an outer metal pad is anchored to the substrate by a single metal-filled via in the first ceramic layer adjacent to the metal pad. In turn, this single metal-filled via is anchored to the substrate by a larger, single metal-filled, via in the next ceramic layer adjacent to the first ceramic layer. Preferably, the metal filled vies and metal pad are 100 volume percent metal.

Abstract translation: 一种多层陶瓷基板，其中外金属焊盘通过与金属焊盘相邻的第一陶瓷层中的单个金属填充通孔锚定到基板。 反过来，这个单个金属填充的通孔在与第一陶瓷层相邻的下一个陶瓷层中通过更大的单个金属填充的通孔锚固到基底。 优选地，金属填充的金属和金属垫是100体积％的金属。

公开(公告)号：DE3787399D1

公开(公告)日：1993-10-21

申请号：DE3787399

申请日：1987-04-22

Applicant: IBM

Inventor： HERRON LESTER WYNN ,  LUSSOW ROBERT OTIS ,  NUFER ROBERT WOLFF ,  SCHWARTZ BERNARD ,  ACOCELLA JOHN ,  REDDY SRINIVASA N

IPC: H05K3/46 ,  H01L21/48 ,  H01L23/538 ,  H05K1/03 ,  H05K3/20 ,  H01L23/52

Abstract: A multilayered ceramic (MLC) substrate having embedded and exposed conductors suitable for mounting and interconnecting a plurality of electronic devices exterior thereof. The horizontal planar conductors comprise substantially a plurality of solid, non porous, homogeneous metal patterns (26), whereas the vertical interplanar connection conductors (26A) are substantially porous metal conductors that are formed by methods such as screening. The process to form the MLC substrate involves forming a pattern of solid, nonporous conductors to a backing sheet (24) having a release layer, then transferring the pattern to a ceramic green sheet (22). Zero X-Y shrinkage sintering processes allow the MLC substrate and solid metal conductors to be densified without distortion of the solid metal patterns or the ceramic.

公开(公告)号：DE3787993D1

公开(公告)日：1993-12-09

申请号：DE3787993

申请日：1987-04-22

Applicant: IBM

Inventor： FLAITZ PHILIP LEE ,  FLANAGAN ARLYNE MARIE ,  HARVILCHUCK JOSEPH MATTHEW ,  HERRON LESTER WYNN ,  KNICKERBOCKER JOHN ULRICH ,  NUFER ROBERT WOLFF ,  PERRY CHARLES HAMPTON ,  REDDY SRINIVASA N

IPC: C04B35/638 ,  C04B35/64 ,  H01L21/48

公开(公告)号：DE3787993T2

公开(公告)日：1994-05-19

申请号：DE3787993

申请日：1987-04-22

Applicant: IBM

Inventor： FLAITZ PHILIP LEE ,  FLANAGAN ARLYNE MARIE ,  HARVILCHUCK JOSEPH MATTHEW ,  HERRON LESTER WYNN ,  KNICKERBOCKER JOHN ULRICH ,  NUFER ROBERT WOLFF ,  PERRY CHARLES HAMPTON ,  REDDY SRINIVASA N

IPC: C04B35/638 ,  C04B35/64 ,  H01L21/48

公开(公告)号：DE3787399T2

公开(公告)日：1994-04-21

申请号：DE3787399

申请日：1987-04-22

Applicant: IBM

Inventor： HERRON LESTER WYNN ,  LUSSOW ROBERT OTIS ,  NUFER ROBERT WOLFF ,  SCHWARTZ BERNARD ,  ACOCELLA JOHN ,  REDDY SRINIVASA N

IPC: H05K3/46 ,  H01L21/48 ,  H01L23/538 ,  H05K1/03 ,  H05K3/20 ,  H01L23/52

Abstract: A multilayered ceramic (MLC) substrate having embedded and exposed conductors suitable for mounting and interconnecting a plurality of electronic devices exterior thereof. The horizontal planar conductors comprise substantially a plurality of solid, non porous, homogeneous metal patterns (26), whereas the vertical interplanar connection conductors (26A) are substantially porous metal conductors that are formed by methods such as screening. The process to form the MLC substrate involves forming a pattern of solid, nonporous conductors to a backing sheet (24) having a release layer, then transferring the pattern to a ceramic green sheet (22). Zero X-Y shrinkage sintering processes allow the MLC substrate and solid metal conductors to be densified without distortion of the solid metal patterns or the ceramic.