公开(公告)号：CA2368950A1

公开(公告)日：2000-11-30

申请号：CA2368950

申请日：2000-05-15

Applicant: IBM

Inventor： MCGAHAY VINCENT ,  NYE HENRY A III ,  OTTEY BRIAN G R ,  EDELSTEIN DANIEL C ,  PRICE WILLIAM H

IPC: H01L23/52 ,  H01L21/3205 ,  H01L21/60 ,  H01L23/485 ,  H01L23/532

Abstract: A structure comprising a layer of copper (1), a barrier layer (10), a layer of AlCu (9), and a pad-limiting layer (7), wherein the layer of AlCu and barrie r layer are interposed between the layer of copper and pad-limiting layer.

公开(公告)号：CA2368950C

公开(公告)日：2012-10-02

申请号：CA2368950

申请日：2000-05-15

Applicant: IBM

Inventor： EDELSTEIN DANIEL C ,  MCGAHAY VINCENT ,  NYE HENRY A III ,  OTTEY BRIAN G R ,  PRICE WILLIAM H

IPC: H01L23/485 ,  H01L23/52 ,  H01L21/3205 ,  H01L21/60 ,  H01L23/532

Abstract: A structure comprising a layer of copper (1), a barrier layer (10), a layer of AlCu (9), and a pad-limiting layer (7), wherein the layer of AlCu and barrier layer are interposed between the layer of copper and pad-limiting layer.

公开(公告)号：MY118419A

公开(公告)日：2004-10-30

申请号：MYPI20001978

申请日：2000-05-08

Applicant: IBM

Inventor： EDELSTEIN DANIEL CHARLES ,  MCGAHAY VINCENT ,  NYE HENRY A III ,  OTTEY BRIAN R ,  PRICE WILLIAM H

IPC: H01L21/4763 ,  H01L23/52 ,  H01L21/3205 ,  H01L21/60 ,  H01L23/485

Abstract: A STRUCTURE COMPRISING A LAYER OF COPPER, A BARRIER LAYER, A LAYER OF ALCU, AND A PAD-LIMITING LAYER, WHEREIN THE LAYER OF ALCU AND BARRIER LAYER ARE INTERPOSED BETWEEN THE LAYER OF COPPER AND PAD-LIMITING LAYER. (FIGURE 2)