公开(公告)号：JPH0817790A

公开(公告)日：1996-01-19

申请号：JP14194995

申请日：1995-06-08

Applicant: IBM

Inventor： SUTEIIBUN JIYOOJI BAABII ,  MADABU DATSUTA ,  TONII FUREDERITSUKU HAINTSU ,  REEPIN RII ,  YUUJIN HENRII RATSURAFU ,  RABUINDORA BUAAMAN SHIENOI

IPC: H01L21/66 ,  H01L21/306 ,  H01L21/3213

Abstract: PURPOSE: To provide a non-contact method and device for monitoring a chemical etching process in the device when etching a work in a wet-type chemical etching bath. CONSTITUTION: A method includes a stage for providing a base 14 with a reference surface, a stage for fixing a work 20 to the base removably, a stage for providing at least two sensors 24a and 24b so that they approach the outer periphery of the surface of the work 20 but do not contact it, and a stage for monitoring electrical characteristics between at least two sensors, thus enabling the change in the provisions of electrical characteristics to indicate the prescribed conditions of an etching process.