公开(公告)号：JPH0853781A

公开(公告)日：1996-02-27

申请号：JP14773295

申请日：1995-06-14

Applicant: IBM

Inventor： MADABU DATSUTA ,  RABUINDORA BUAMAN SHIENOI

IPC: C23F1/26 ,  C23F1/44 ,  H01L21/28 ,  H01L21/306 ,  H01L21/3213 ,  H01L21/60 ,  H01L23/485

公开(公告)号：JPH0874100A

公开(公告)日：1996-03-19

申请号：JP22486095

申请日：1995-09-01

Applicant: IBM

Inventor： MADABU DATSUTA ,  TERENSU ROBAATO OTOUURU

IPC: C25F7/00 ,  B23H3/08 ,  C25F3/02 ,  C25F3/16 ,  H01L21/28

公开(公告)号：JPH083794A

公开(公告)日：1996-01-09

申请号：JP13626695

申请日：1995-06-02

Applicant: IBM

Inventor： DENISU JIYON BUROFUII ,  MADABU DATSUTA ,  DEREKU BURENTO HARISU ,  FURANKU SABUIJI RAIAN ,  FURANKU ANSONII SUPERA

IPC: C25F3/14 ,  C25F7/00 ,  H05K3/07

公开(公告)号：JPH09181125A

公开(公告)日：1997-07-11

申请号：JP29996296

申请日：1996-11-12

Applicant: IBM

Inventor： PANAYOTEISU KONSUTANTEINUU AND ,  MADABU DATSUTA ,  HARIKURIA DERIJIYANNI ,  UIRUMA JIYAN HOOKANZU ,  SUN KUON KAN ,  KIISU TOMASU KUFUIETONIYAKU ,  GANGADAARA SUWAMI MATADO ,  SANPASU PURUSHIYOTAMAN ,  RIIZEN SHII ,  TON HOO MIN

IPC: B23K35/26 ,  B23K35/00 ,  B32B15/01 ,  C22C13/00 ,  C22C13/02 ,  H01L21/60 ,  H01L23/485 ,  H01L21/321

Abstract: PROBLEM TO BE SOLVED: To provide a connecting structure suitable for connecting a very small electronic circuit chip with a package. SOLUTION: This mutual connecting structure contains the following in order; an adhesion/barrier layer stuck on a passivated board (e.g. silicon wafer), an adhesion layer which is arbitrarily selected and added, a layer to which metal selected out of a group composed of Ni, Co, Fe, NiFe, NiCo, CoFe, NiCoFe can be soldered, and a leadless solder ball which contains a kind or a plurality of kinds of alloy elements selected out of tin, Bi, Ag and Sb which are main components and a kind or a plurality of kinds of elements arbitrarily selected out of a group composed of Zn, In, Ni, Co and Cu.

公开(公告)号：JPH0817790A

公开(公告)日：1996-01-19

申请号：JP14194995

申请日：1995-06-08

Applicant: IBM

Inventor： SUTEIIBUN JIYOOJI BAABII ,  MADABU DATSUTA ,  TONII FUREDERITSUKU HAINTSU ,  REEPIN RII ,  YUUJIN HENRII RATSURAFU ,  RABUINDORA BUAAMAN SHIENOI

IPC: H01L21/66 ,  H01L21/306 ,  H01L21/3213

Abstract: PURPOSE: To provide a non-contact method and device for monitoring a chemical etching process in the device when etching a work in a wet-type chemical etching bath. CONSTITUTION: A method includes a stage for providing a base 14 with a reference surface, a stage for fixing a work 20 to the base removably, a stage for providing at least two sensors 24a and 24b so that they approach the outer periphery of the surface of the work 20 but do not contact it, and a stage for monitoring electrical characteristics between at least two sensors, thus enabling the change in the provisions of electrical characteristics to indicate the prescribed conditions of an etching process.

公开(公告)号：JPH083799A

公开(公告)日：1996-01-09

申请号：JP16230291

申请日：1991-06-07

Applicant: IBM

Inventor： JIYOZEFU CHIYAARUZU ANDORESHIY ,  MADABU DATSUTA ,  RUBOMIRU TARASU ROMANKIU ,  RUISU FUANOA BIIGA

IPC: C25F3/24 ,  B41J1/20 ,  C25F7/00

公开(公告)号：JPH04341772A

公开(公告)日：1992-11-27

申请号：JP28728191

申请日：1991-10-08

Applicant: IBM

Inventor： MADABU DATSUTA ,  DEEBUIDO AANESUTO KINGU ,  ARAN DAGURASU NAITO ,  KARUROSU JIYUAN SANBUCHIETSUTE

IPC: H01H1/06 ,  H01L21/60 ,  H01R12/04 ,  H01R12/55 ,  H01R13/03 ,  H01R13/22 ,  H01R43/16 ,  H05K1/11 ,  H05K3/06 ,  H05K3/07 ,  H05K3/24 ,  H05K3/38 ,  H05K3/40

Abstract: PURPOSE: To obtain a conical connector with high economical efficiency which makes a contact between high-frequency, redundancy, fine tip and high performance pad and a pad by forming a conical metal projection in a neutral salt solution by electrochemical working. CONSTITUTION: When photoresist is applied to a metal film or the like and developed after exposure through a high polymer mask, points which become plural conical contacs are formed. When in such a state, the metal film is taken as anode, and an electric current is let flow in a neutral solution in a space up to the cathode, many conical contacts are continuously formed on the metal film by anode dissolution corresponding to an unexposed part to become a connector coming into contact with the similar conical contacts or the metal material flat surface. This creation method forms a conical connector with high economical efficiency which becomes a contact between pads with high-frequency, redundancy, fine tip and high performance.