公开(公告)号：JPS61256689A

公开(公告)日：1986-11-14

申请号：JP5846186

申请日：1986-03-18

Applicant: IBM

Inventor： AMELIO WILLIAM JOSEPH ,  HUME DAVID WILLIAM ,  MC BRIDE DONALD GENE ,  RICKERT ROBERT GEORGE

IPC: H05K3/18 ,  C23C18/20 ,  C23C18/24 ,  H05K3/42

公开(公告)号：DE3681064D1

公开(公告)日：1991-10-02

申请号：DE3681064

申请日：1986-04-30

Applicant: IBM

Inventor： AMELIO WILLIAM JOSEPH ,  HUME DAVID WILLIAM ,  MC BRIDE DONALD GENE ,  RICKERT ROBERT GEORGE

IPC: H05K3/18 ,  C23C18/20 ,  C23C18/24 ,  H05K3/42

Abstract: A substrate is prepared for subsequent electroless deposition of a metal by contacting the substrate with a surfactant and with an organic carboxylic acid, and subsequently contacting the substrate with sulfuric acid.The process is reliable and simple and does not affect the substrate.

公开(公告)号：DE3363036D1

公开(公告)日：1986-05-22

申请号：DE3363036

申请日：1983-06-01

Applicant: IBM

Inventor： HUME DAVID WILLIAM ,  RASILE JOHN

IPC: H05K3/00 ,  H05K3/02 ,  H05K3/18 ,  H05K3/24 ,  H05K3/26 ,  H05K3/46