公开(公告)号：DE68925596D1

公开(公告)日：1996-03-21

申请号：DE68925596

申请日：1989-04-25

Applicant: IBM

Inventor： FEILCHENFELD NATALIE BARBARA ,  FUERNISS STEPHEN JOSEPH ,  GLENNING JOHN JOSEPH ,  PAWLOWSKI WALTER PAUL ,  PHELAN GIANA MARRONE ,  RICKERL PAUL GEORGE

IPC: H05K3/06 ,  G03F7/038 ,  G03F7/16 ,  G03F7/32 ,  H01L21/768 ,  H01L23/522 ,  H05K1/03 ,  H05K3/46

Abstract: A polyimide pattern is formed on a substrate by providing a layer of photosensitive polyimide precursor containing the polyimide precursor and a compound having a photosensitive group on the substrate and prebaking the layer. The layer is then exposed imagewise to actinic radiation through a photomask to form an exposed image pattern of the polyimide precursor in the layer. The unexposed areas of the layer are removed using a liquid developer and the exposed image pattern is cured by heating. In one aspect of the present invention, the prebaking step employs a judicious selection of times and temperatures to eliminate the problem of formation of a white residue that occurs from using prior art prebake procedures. In another aspect of the present invention, a particular liquid developer composition is employed to facilitate the formation of sloped vias in the polyimide. In another aspect of the present invention, a particular range of exposure wavelength(s) is employed to obtain smooth walled vias.