公开(公告)号：JPS62274737A

公开(公告)日：1987-11-28

申请号：JP9108687

申请日：1987-04-15

Applicant: IBM

Inventor： ROBAATO JIYOSEFU KUREMENTEI ,  CHIYAARUZU EDOWAADO GAZUDEITSU ,  UIRIAMU REIFUAA ,  ROI RUISU RABUSUKII ,  DONARUDO JIIN MAKUBURAIDO ,  JIYOORU BUAAN MANSON ,  YUUJIN PIITAA SUKAABUINKO

IPC: H01L21/60 ,  H01L21/48 ,  H01L23/498 ,  H01L23/538 ,  H05K1/00 ,  H05K3/00 ,  H05K3/38

公开(公告)号：JPH05110225A

公开(公告)日：1993-04-30

申请号：JP5532892

申请日：1992-03-13

Applicant: IBM

Inventor： SUTANREI MAIKERU ARUBUREKUTA ,  ROBAATO JIYOSEFU KUREMENTEI ,  TOMAASU ETOWAADO KAINDORU

IPC: H01B5/02 ,  C23F1/28 ,  G11B5/48 ,  H01B7/04 ,  H05K1/00 ,  H05K1/05 ,  H05K3/06 ,  H05K3/44

Abstract: PURPOSE: To obtain a manufacturing method for flexible circuit members, containing stainless steel base members, dielectric layers on the base members (polyimide) and conductive circuits (copper) on the dielectric layers. CONSTITUTION: A dielectric polyimide is covered on a stainless steel, and a circuit member is formed as a laminated structure appropriately treated (hardened). Next, a copper circuit is formed using the techniques of resist-coating and exposure. A circuit element containing copper and stainless steel base member are etched at the same time by using a copper chloride (II) etching solution, and desired portions of these metal materials are removed effectively and a desired flexible circuit member can be formed.