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公开(公告)号:JPH05247198A
公开(公告)日:1993-09-24
申请号:JP28270692
申请日:1992-10-21
Applicant: IBM
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公开(公告)号:JPH02286222A
公开(公告)日:1990-11-26
申请号:JP8764290
申请日:1990-04-03
Applicant: IBM
Inventor: NETSUDO JIEI CHIYOU , RONARUDO DEIIN GOORUDOBURATSUT , JIYON EDOWAADO HAIDENRITSUCHI , SUTEIBUN EERU MOORISU , RUISU MIIGEERU FUEREIRO
IPC: B29C65/00 , B29C65/52 , B29L9/00 , B44C1/22 , C08J5/12 , C08J7/00 , H05K1/03 , H05K3/38 , H05K3/46
Abstract: PURPOSE: To improve the peel strength and promote the adhesion between the surfaces of polymers by treating at least, the surface of one of the polymers with water vapor plasma. CONSTITUTION: The peel strength is improved by treating the surface of at least, one of the polymer layers with water vapor plasma prior to the arrangement of a second polymer layer on a first polymer layer. A gas plasma is formed by the action of an electric field upon gas, and for example, the electric field is generated by a wireless frequency generator. That is, the electric field required for an action on the gas is applied in order to generate radical species mainly by an electron-induced ionization. And these species interact with the outermost atom of a polymer material to make a surface which bonds with a layer to be bonded next more firmly than before.
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公开(公告)号:JPH04234437A
公开(公告)日:1992-08-24
申请号:JP20900291
申请日:1991-08-21
Applicant: IBM
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公开(公告)号:JPH02299291A
公开(公告)日:1990-12-11
申请号:JP9782090
申请日:1990-04-16
Applicant: IBM
Abstract: PURPOSE: To fill up the cavity of a substrate or to coat the the walls of the cavity by providing a material on the substrate having the cavity inside and allowing the material to flow and adhere to the internal surface of the cavity, and then, giving such an environment that presses the material against the internal surface of the cavity. CONSTITUTION: After surfaces 2 and 4 of a substrate 10 are respectively covered with material layers 6 and 8, a through-hole 12 is formed in a structure 14, so that the materials 6 and 8 can flow and an environment that presses the materials 6 and 8 covering sidewalls 18 of the cavity 12 against the sidewalls 18 and forms the materials 6 and 8 in a thick layer for a long time is given. The materials 6 and 8 start to flow along the sidewalls of the through-hole 12 and becomes thicker as the materials 6 and 8 move toward the center of the hole 12 and, as a result, the hole 12 is completely filled up with the materials 6 and 8. Therefore, the sidewalls 18 of the cavity 12 of the substrate 10 can be coated, or the cavity 12 can be filled up completely with the materials 6 and 8.
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