公开(公告)号：JPH05163467A

公开(公告)日：1993-06-29

申请号：JP28959691

申请日：1991-11-06

Applicant: IBM

Inventor： CHIYAARUZU ROBAATO DEIBISU ,  ASHITO AABINDO MEETA ,  KONSUTANTEINOSU PAPATOMASU ,  RII POORU SUPURINGAA ,  UIRIAMU JIYOZEFU SUMA ,  DEIBITSUDO UEI WAN

IPC: C09J7/02 ,  C09J163/00 ,  C09J163/02 ,  C09J179/00 ,  C09J179/04 ,  H01L23/12 ,  H01L23/14 ,  H05K3/38 ,  H05K3/46

公开(公告)号：JPH04226544A

公开(公告)日：1992-08-17

申请号：JP13162591

申请日：1991-05-08

Applicant: IBM

Inventor： CHIYAARUZU ROBAATO DEIBISU ,  RONARUDO DEIIN GOORUDOBURATSUT ,  YAE MIYUN PARUKU

IPC: B29C41/12 ,  B29K79/00 ,  B29L7/00 ,  B32B27/06 ,  B32B27/34 ,  C08G73/10 ,  C08J5/18 ,  C09D179/08 ,  H01B3/30 ,  H05K1/03

公开(公告)号：JPH0613495A

公开(公告)日：1994-01-21

申请号：JP25563591

申请日：1991-10-03

Applicant: IBM

Inventor： RORENSU MAAKU BURAUN ,  SUTEIIBUN RESURII BUTSUKUUOORU ,  CHIYAARUZU ROBAATO DEIBISU ,  RIISA JIYANIIN HIMAARESU ,  ASHITO AABINDO MEETA ,  YUUJIIN ROOMAN SUKARUBINKO

IPC: C08L27/12 ,  C08L79/08 ,  H01L23/08 ,  H01L23/14 ,  H05K1/03 ,  H05K3/00

Abstract: PURPOSE: To provide perfluoro carbon composition of a polymer having thermal stability at the temperature at the laser processing and printed-circuit-board manufacturing at 308 nanometers. CONSTITUTION: This polymer composition has a main amount of perfluoro carbon composition, which is substantially transparent to ultraviolet rays, and a second polymer such as polyimide, which is thermally stable for imparting ultraviolet-ray processing. This is the manufacturing method for providing a forming method of the polymer composition, a through-hole for the polymer composition and the printed circuit board, including the laser removal of a via.

公开(公告)号：JPH05247198A

公开(公告)日：1993-09-24

申请号：JP28270692

申请日：1992-10-21

Applicant: IBM

Inventor： SUTEIIBUN RESURII BUTSUKUUOORU ,  CHIYAARUZU ROBAATO DEIBISU ,  RONARUDO DEIIN GOORUDOBURATSUT ,  RICHIYAADO RONARUDO TOMASU

IPC: C08G18/40 ,  B05D3/14 ,  B29C59/14 ,  C08F8/00 ,  C08F255/00 ,  C08F283/00 ,  C08G59/18 ,  C08G64/40 ,  C08G65/00 ,  C08G83/00 ,  C08G85/00 ,  C08J7/18 ,  H01L23/02

公开(公告)号：JPH0870186A

公开(公告)日：1996-03-12

申请号：JP13523995

申请日：1995-06-01

Applicant: IBM

Inventor： CHIYAARUZU ROBAATO DEIBISU ,  FURANKU DANIERU EJITSUTO ,  YUUJIIN ROMAN SUKAABINKO

IPC: H05K1/03 ,  H01L21/48 ,  H01L23/14 ,  H01L23/498 ,  H01L23/538 ,  H05K1/00 ,  H05K3/00 ,  H05K3/46 ,  H01L23/522

Abstract: PURPOSE: To provide a method of solving problems such as a positional deviation, without sacrificing the electrical and mechanical non-defectiveness of a structure and solving troubles present in conventional techniques by providing a material where a design consideration is taken, and a method of manufacturing a high-density structure. CONSTITUTION: A multilayer electronic circuit package is possessed of an electrically conductive plane 1, an organic high-molecular dielectric material 8 possessed of a first absorbance with respect to the cutting wavelength of a laser beam, and an organic high-molecular dielectric material 7 possessed of a second absorbance with respect to the cutting wavelength of a laser beam. The first and second absorbance are set different from each other. When a hole is bored in the dielectric body 7 with a laser beam, the hole is restrained from penetrating through the dielectric body 8, because the dielectric body 8 does not absorb a laser beam, and a short circuit is prevented from occurring between metal layers 1 and 5 in a plating process.

公开(公告)号：JPH04234437A

公开(公告)日：1992-08-24

申请号：JP20900291

申请日：1991-08-21

Applicant: IBM

Inventor： RIINA PAIBITSUKI BUTSUKUUOORUT ,  SUTEIIBUN RESURII BUTSUKUUOORU ,  CHIYAARUZU ROBAATO DEIBISU ,  RONARUDO DEIIN GOORUDOBURATSUT ,  JIYON EDOWAADO HAIDENRAIKU ZAS ,  SHIYARON RUIIZU NIYUUNZU ,  YAE MIYUNGU PARUKU ,  RICHIYAADO RONARUDO TOMASU ,  DOMEENIKO TORUTORETSURA ,  RUIISU MIGERU FUEREIRO

IPC: C08J3/28 ,  C23C18/20 ,  C23C18/22 ,  C23C18/30 ,  H05K1/03 ,  H05K3/18 ,  H05K3/38