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公开(公告)号：DE3577731D1
公开(公告)日：1990-06-21
申请号：DE3577731
申请日：1985-02-22
Applicant: IBM
Inventor： CHEBINIAK PAUL , KASCHAK RONALD ANTHONY , ROOT LOIS JEAN
Abstract: A metal is deposited onto a substrate from an electroless plating solution by plating an initial layer of metal onto the substrate, then contacting the metal-plated substrate with a solution of an acid; and plating an additional layer of metal onto the plated, acid-treated substrate. The process reduces the plating void defects.
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