Abstract:
A METHOD IS DISCLOSED FOR PRODUCING DEFECT-FREE ULTRATHIN ANODIC OXIDE FILMS OF LESS THAN APPROXIMATELY 50 A. THICKNESS. ILLUSTRATIVELY, A THIN INSULATING FILM IS FORMED ON A NIOBIUM SUBSTRATE. A RESIDUALL OXIDE HAVING A THICKNESS OF ABOUT 30 A. IS NORMALLY PRESENT ON THE NIOBIUM SUBSTRATE. THE RESIDUAL OXIDE FILM IS REMOVED PRIOR TO ANODIZING, LEAVING MORE UNIFORM NIOBIUM SUBSTRATE. BY ANODIZING UNDER CONTROLLED CONDITIONS ANY DESIRED OXIDE DIMENSION LESS THAN APPROXIMATELY 50 A. MAY BE ACHIEVED BY THE PRACTICE OF THIS DISCLOSURE. THE METHOD COMPRISES ANODIZING THE NIOBIUM SUBSTRATE IN A SUITABLE ELECTROLYTE WITH AN APPLIED POTENTIAL UP TO APPOXIMATELY 1 VOLT, AND SUBSEQUENTLY REMOVING THE RESULTANT OXIDE BY ETCHING WITH A SUITABLE ETCHANT, E.G., HF, AND HF+HNO3, THE ANODIZING-ETCHING STEPS ARE PREFERABLY REPEATED TO REMOVE SURFACE CAVITIES AND GROWTHS FOR OBTAINING A SURFACE ON THE NIOBIUM SUBSTRATE WITH DESIRED UNIFORMITY. ILLUSTRATIVELY, THE FINAL ANODIZATION OF THE NIOBIUM SURFACE IS ACHIEVED BY CONNECTING THE TWO ELECTRODES OF THE ELECTROLYTIC CELL (THE NIOBIUM SURFACE AND THE CATHODE) THROUGH A CONSTANT CURRENT SOURCE TO ACHIEVE THE DESIRED FINAL THICKNESS OF THE ANODIC FILM. ALTERNATIVELY, THE ELECTRODES MAY BE CONNECTED TO EACH OTHER THROUGH A RESISTOR FOR CONTROLLING THE RATE OF ANODIC FILM GROWTH.
Abstract:
A tunneling device, or array of such devices, having at least one electrode which is a single crystal. Tunnel devices having two or more electrodes are shown, as are thin film Josephson devices having two single crystal electrodes. The electrodes of any device can be of the same or different material, and the crystallographic orientations of these electrodes can be the same or different. Although the tunnel barrier is usually an insulator, it can be other materials, or even a vacuum. In a particular embodiment, the barrier is an epitaxial layer. Both in-line and crossed-stripe geometries are used.
Abstract:
The present invention relates to electrodes used for charging electrophotographic image surfaces in copying machines. More particularly, the disclosure is directed to the negative corona discharge electrodes which produce a negative charge that is applied to the photoconductive surface exposed to the corona discharge. In the present invention, the electrode structure includes a combination of a wire of valve metal with a high resistivity coating spread uniformly over the surface of the wire. The valve metal, one example being tantalum, may serve as the electrode wire itself or may surround an inner wire such as stainless steel. By providing an electrode for corona discharge having a uniform high resistive coating, the plasma glow produced will spread uniformly along the length of the wire. By using a valve metal, which forms a hard oxide under the high resistivity coating, the electrode is self-healing in that if cracks or imperfections occur in the coating, the exposed valve metal will oxidize and fill in the cracks and imperfections.
Abstract:
A METHOD FOR REDUCING ELECTROMIGRATION DAMAGE AT METAL INTERFACES BETWEEN INTERCONNECTION LINES AN SEMICONDUCTOR CONTACT MATERIALS IS TAUGHT. THE ACCUMULATION OF EXCESS VACANCIES IN AN INTERFACE REGION BETWEEN TWO DIFFERENT METALS IS LIMITED BY CONTROLLING THE FLOW OF IONS AT THE INTERFACE REGION IN THE PRESENCE OF ELECTRON FLOW SUCH THAT THE RATIO OF THE RATES AT WHICH IONS ENTER AND LEAVE THE INTERFACE REGION APPROCHES UNITY. BY ELIMINATING THE ACCUMULATION OF VACANCIES (WHICH RESULTS IN VOID FORMATION) IN THE INTERFACE REGION, FAILURE OF THE METAL WHERE VACANCIES WOULD OTHERWISE APPEAR IS AVOIDED. THE ACCUMULATION OF EXCESS VACANCIES IS CONTROLLED IN THE OPERATING ENVIRONMENT WHERE THE TWO METALS MUST CARRY CURRENT OF RELATIVELY HIGH DENSITY BY ADJUSTMENT OF THE GRAIN SIZE OF THE DIFFERENT METALS; BY FORMING AN ADDITIONAL REGION OF ANOTHER METAL IN THE INTERFACE REGION WHICH IS CHARACTERIZED BY THE PRESENCE OF LATTICE DIFFUSION AT A DESIRED TEMPERATURE; BY INTRODUCING A SOLUTE HAVING A HIGHER DIFFUSIVITY INTO ONE OF THE METALS HAVING A LOWER DIFFUSIVITY; AND BY INCREASING THE THICKNESS OF THE INTERFACE REGION BY EITHER GRADING ONE METAL INTO THE OTHER OR BY INTRODUCING ANOTHER METAL WHICH ADDS TO THE THICKNESS OF THE INTERFACE REGION. WHERE VACANCIES OCCUR AS A RESULT OF INTERDIFFUSION AT HIGH TEMPERATURE DURING BONDING OF TWO METALS, DIRECTING THE ELECTRON FLOW IN A DIRECTION OPPOSITE TO THE DIRECTION OF DIFFUSION OF THE METAL HAVING THE HIGHER DIFFUSIVITY CONTROLS THE APPEARANCE OF VACANCIES. CONTROLLING THE CURRENT DENSITY ALSO CONTROLS THE APPEARANCE OF THESE VACANCIES WHICH ULTIMATELY LEAD TO CATASTROPHIC CRACKING AT EITHER THE METAL INTERCONNECTION OR AT THE METAL CONTACT MATERIAL.
Abstract:
A SPUTTERING PROCESS FOR DEPOSITING THIN, SINGLE CRYSTAL FILMS HAVING BULK PROPERTIES. THE PROCESS IS CHARACTERIZED BY AN EXTREMELY LOW PRE-SPUTTERING TIME, A SUBSTRATE BIAS OF AT LEAST APPROXIMATELY -30 VOLTS, AND LOW DEPOSITION TEMPERATURES. BOTH RF AND DC SPUTTERING ARE USED. IMPROVIDED THIN FILMS HAVING BULK PROPERTIES ARE PRODUCED. SAID THIN FILMS IN PARTICULAR BEING SUPERCONDUCTING MATERIALS, SUCH AS NIOBIUM. THE FILMS HAVE EXCELLENT CHEMICAL PURITY AND LOW DEFECT DENSITY, AND ARE SINGLE CRYSTALS.
Abstract:
1395738 Records INTERNATIONAL BUSINESS MACHINES CORP 25 Oct 1972 [30 Dec 1971] 49105/72 Heading G5R [Also in Division C7] A wear resistant surface is provided on a first component, e.g. a magnetic disc or tape of granular material having a predetermined grain size, for sliding mechanical contact by a second component, e.g. a magnetic transducer head movable over the surface, by forming on the first component a layer of granular polycrystalline material, e.g. Au or Ni having a grain size of 10 to 1000, less than that of the first component, to reduce the development of a wear track caused by an asperity of the face of the second component. A polycrystalline Ni layer may-be electroplated from a solution comprising 218 g/l NiCl 2 .6H 2 O, 25 g/l H 3 BO 3 , 1À64 g/l Na saccharin and 10 drops of saturated 2- butyne 1,4 diol.