Method for fabricating anodic films
    1.
    发明授权
    Method for fabricating anodic films 失效
    方法制作阳极膜

    公开(公告)号:US3806430A

    公开(公告)日:1974-04-23

    申请号:US4667770

    申请日:1970-06-16

    Applicant: IBM

    CPC classification number: C25D11/02

    Abstract: A METHOD IS DISCLOSED FOR PRODUCING DEFECT-FREE ULTRATHIN ANODIC OXIDE FILMS OF LESS THAN APPROXIMATELY 50 A. THICKNESS. ILLUSTRATIVELY, A THIN INSULATING FILM IS FORMED ON A NIOBIUM SUBSTRATE. A RESIDUALL OXIDE HAVING A THICKNESS OF ABOUT 30 A. IS NORMALLY PRESENT ON THE NIOBIUM SUBSTRATE. THE RESIDUAL OXIDE FILM IS REMOVED PRIOR TO ANODIZING, LEAVING MORE UNIFORM NIOBIUM SUBSTRATE. BY ANODIZING UNDER CONTROLLED CONDITIONS ANY DESIRED OXIDE DIMENSION LESS THAN APPROXIMATELY 50 A. MAY BE ACHIEVED BY THE PRACTICE OF THIS DISCLOSURE. THE METHOD COMPRISES ANODIZING THE NIOBIUM SUBSTRATE IN A SUITABLE ELECTROLYTE WITH AN APPLIED POTENTIAL UP TO APPOXIMATELY 1 VOLT, AND SUBSEQUENTLY REMOVING THE RESULTANT OXIDE BY ETCHING WITH A SUITABLE ETCHANT, E.G., HF, AND HF+HNO3, THE ANODIZING-ETCHING STEPS ARE PREFERABLY REPEATED TO REMOVE SURFACE CAVITIES AND GROWTHS FOR OBTAINING A SURFACE ON THE NIOBIUM SUBSTRATE WITH DESIRED UNIFORMITY. ILLUSTRATIVELY, THE FINAL ANODIZATION OF THE NIOBIUM SURFACE IS ACHIEVED BY CONNECTING THE TWO ELECTRODES OF THE ELECTROLYTIC CELL (THE NIOBIUM SURFACE AND THE CATHODE) THROUGH A CONSTANT CURRENT SOURCE TO ACHIEVE THE DESIRED FINAL THICKNESS OF THE ANODIC FILM. ALTERNATIVELY, THE ELECTRODES MAY BE CONNECTED TO EACH OTHER THROUGH A RESISTOR FOR CONTROLLING THE RATE OF ANODIC FILM GROWTH.

    Single crystal tunnel devices
    2.
    发明授权
    Single crystal tunnel devices 失效
    单晶隧道装置

    公开(公告)号:US3816845A

    公开(公告)日:1974-06-11

    申请号:US18322571

    申请日:1971-09-23

    Applicant: IBM

    Abstract: A tunneling device, or array of such devices, having at least one electrode which is a single crystal. Tunnel devices having two or more electrodes are shown, as are thin film Josephson devices having two single crystal electrodes. The electrodes of any device can be of the same or different material, and the crystallographic orientations of these electrodes can be the same or different. Although the tunnel barrier is usually an insulator, it can be other materials, or even a vacuum. In a particular embodiment, the barrier is an epitaxial layer. Both in-line and crossed-stripe geometries are used.

    Abstract translation: 具有至少一个电极是单晶的隧道装置或这种装置的阵列。 示出了具有两个或更多个电极的隧道装置,以及具有两个单晶电极的薄膜约瑟夫逊装置。 任何器件的电极可以是相同或不同的材料,并且这些电极的晶体取向可以相同或不同。 虽然隧道屏障通常是绝缘体,但它可以是其他材料,甚至是真空。 在特定实施例中,势垒是外延层。 使用在线和横条纹几何形状。

    Self-healing electrode for uniform negative corona
    3.
    发明授权
    Self-healing electrode for uniform negative corona 失效
    用于均匀负离子的自愈电极

    公开(公告)号:US3813549A

    公开(公告)日:1974-05-28

    申请号:US31797372

    申请日:1972-12-26

    Applicant: IBM

    CPC classification number: G03G15/0291 H05F3/04

    Abstract: The present invention relates to electrodes used for charging electrophotographic image surfaces in copying machines. More particularly, the disclosure is directed to the negative corona discharge electrodes which produce a negative charge that is applied to the photoconductive surface exposed to the corona discharge. In the present invention, the electrode structure includes a combination of a wire of valve metal with a high resistivity coating spread uniformly over the surface of the wire. The valve metal, one example being tantalum, may serve as the electrode wire itself or may surround an inner wire such as stainless steel. By providing an electrode for corona discharge having a uniform high resistive coating, the plasma glow produced will spread uniformly along the length of the wire. By using a valve metal, which forms a hard oxide under the high resistivity coating, the electrode is self-healing in that if cracks or imperfections occur in the coating, the exposed valve metal will oxidize and fill in the cracks and imperfections.

    Abstract translation: 本发明涉及用于在复印机中对电子照相图像表面进行充电的电极。 更具体地,本公开涉及产生施加到暴露于电晕放电的光电导表面的负电荷的负电晕放电电极。 在本发明中,电极结构包括在金属丝的表面均匀扩散的阀金属线与高电阻率涂层的组合。 阀金属,一个例子是钽,可以用作电极线本身,或者可以包围诸如不锈钢的内部线。 通过提供具有均匀的高电阻涂层的电晕放电用电极,产生的等离子体辉光将沿导线的长度均匀扩散。 通过使用在高电阻率涂层下形成硬质氧化物的阀金属,电极是自愈的,因为如果涂层中出现裂纹或缺陷,暴露的阀金属将氧化并填充裂纹和缺陷。

    Method for reducing electromigration damage at metal interfaces
    4.
    发明授权
    Method for reducing electromigration damage at metal interfaces 失效
    用于减少金属接口电磁损伤的方法

    公开(公告)号:US3813263A

    公开(公告)日:1974-05-28

    申请号:US21686472

    申请日:1972-01-10

    Applicant: IBM

    Inventor: ROSENBERG R

    Abstract: A METHOD FOR REDUCING ELECTROMIGRATION DAMAGE AT METAL INTERFACES BETWEEN INTERCONNECTION LINES AN SEMICONDUCTOR CONTACT MATERIALS IS TAUGHT. THE ACCUMULATION OF EXCESS VACANCIES IN AN INTERFACE REGION BETWEEN TWO DIFFERENT METALS IS LIMITED BY CONTROLLING THE FLOW OF IONS AT THE INTERFACE REGION IN THE PRESENCE OF ELECTRON FLOW SUCH THAT THE RATIO OF THE RATES AT WHICH IONS ENTER AND LEAVE THE INTERFACE REGION APPROCHES UNITY. BY ELIMINATING THE ACCUMULATION OF VACANCIES (WHICH RESULTS IN VOID FORMATION) IN THE INTERFACE REGION, FAILURE OF THE METAL WHERE VACANCIES WOULD OTHERWISE APPEAR IS AVOIDED. THE ACCUMULATION OF EXCESS VACANCIES IS CONTROLLED IN THE OPERATING ENVIRONMENT WHERE THE TWO METALS MUST CARRY CURRENT OF RELATIVELY HIGH DENSITY BY ADJUSTMENT OF THE GRAIN SIZE OF THE DIFFERENT METALS; BY FORMING AN ADDITIONAL REGION OF ANOTHER METAL IN THE INTERFACE REGION WHICH IS CHARACTERIZED BY THE PRESENCE OF LATTICE DIFFUSION AT A DESIRED TEMPERATURE; BY INTRODUCING A SOLUTE HAVING A HIGHER DIFFUSIVITY INTO ONE OF THE METALS HAVING A LOWER DIFFUSIVITY; AND BY INCREASING THE THICKNESS OF THE INTERFACE REGION BY EITHER GRADING ONE METAL INTO THE OTHER OR BY INTRODUCING ANOTHER METAL WHICH ADDS TO THE THICKNESS OF THE INTERFACE REGION. WHERE VACANCIES OCCUR AS A RESULT OF INTERDIFFUSION AT HIGH TEMPERATURE DURING BONDING OF TWO METALS, DIRECTING THE ELECTRON FLOW IN A DIRECTION OPPOSITE TO THE DIRECTION OF DIFFUSION OF THE METAL HAVING THE HIGHER DIFFUSIVITY CONTROLS THE APPEARANCE OF VACANCIES. CONTROLLING THE CURRENT DENSITY ALSO CONTROLS THE APPEARANCE OF THESE VACANCIES WHICH ULTIMATELY LEAD TO CATASTROPHIC CRACKING AT EITHER THE METAL INTERCONNECTION OR AT THE METAL CONTACT MATERIAL.

    Sputtering process for producing single crystal thin films
    5.
    发明授权
    Sputtering process for producing single crystal thin films 失效
    用于生产单晶薄膜的溅射工艺

    公开(公告)号:US3726776A

    公开(公告)日:1973-04-10

    申请号:US3726776D

    申请日:1969-06-30

    Applicant: IBM

    CPC classification number: C30B23/06 Y10S505/816

    Abstract: A SPUTTERING PROCESS FOR DEPOSITING THIN, SINGLE CRYSTAL FILMS HAVING BULK PROPERTIES. THE PROCESS IS CHARACTERIZED BY AN EXTREMELY LOW PRE-SPUTTERING TIME, A SUBSTRATE BIAS OF AT LEAST APPROXIMATELY -30 VOLTS, AND LOW DEPOSITION TEMPERATURES. BOTH RF AND DC SPUTTERING ARE USED. IMPROVIDED THIN FILMS HAVING BULK PROPERTIES ARE PRODUCED. SAID THIN FILMS IN PARTICULAR BEING SUPERCONDUCTING MATERIALS, SUCH AS NIOBIUM. THE FILMS HAVE EXCELLENT CHEMICAL PURITY AND LOW DEFECT DENSITY, AND ARE SINGLE CRYSTALS.

    6.
    发明专利
    未知

    公开(公告)号:BE793406A

    公开(公告)日:1973-04-16

    申请号:BE793406D

    Applicant: IBM

    Abstract: 1395738 Records INTERNATIONAL BUSINESS MACHINES CORP 25 Oct 1972 [30 Dec 1971] 49105/72 Heading G5R [Also in Division C7] A wear resistant surface is provided on a first component, e.g. a magnetic disc or tape of granular material having a predetermined grain size, for sliding mechanical contact by a second component, e.g. a magnetic transducer head movable over the surface, by forming on the first component a layer of granular polycrystalline material, e.g. Au or Ni having a grain size of 10 to 1000Š, less than that of the first component, to reduce the development of a wear track caused by an asperity of the face of the second component. A polycrystalline Ni layer may-be electroplated from a solution comprising 218 g/l NiCl 2 .6H 2 O, 25 g/l H 3 BO 3 , 1À64 g/l Na saccharin and 10 drops of saturated 2- butyne 1,4 diol.

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