公开(公告)号：FR2285047A1

公开(公告)日：1976-04-09

申请号：FR7525142

申请日：1975-08-07

Applicant: IBM

Inventor： HAINING FRANK W ,  RUBINO ROBERT V ,  WILEY ROBERT T

IPC: B32B15/04 ,  B29C63/00 ,  B32B15/08 ,  B32B37/00 ,  H01B19/00 ,  H05K1/03 ,  H05K3/00 ,  H05K3/22

Abstract: A process for stabilizing printed circuit board substrate or laminate through application of a number of laminate conditioning and baking cycles which function to provide the laminates with dimensional stability. This enables greater control and more precise drilling of the laminates in subsequent fabrication and assembly operations. The dimensional stability for a substrate becomes more critical as the substrate size is increased.