公开(公告)号：US3303046A

公开(公告)日：1967-02-07

申请号：US33432963

申请日：1963-12-30

Applicant: IBM

Inventor： PAUL CHEBINIAK ,  WILEY ROBERT T

IPC: B41M5/10 ,  C08J9/28

CPC classification number: B41M5/10 ,  C08J9/28 ,  C08J2201/0504 ,  Y10S264/13 ,  Y10S428/905 ,  Y10T428/249996 ,  Y10T428/31844 ,  Y10T428/31906

公开(公告)号：US3515590A

公开(公告)日：1970-06-02

申请号：US3515590D

申请日：1967-08-21

Applicant: IBM

Inventor： LAZZARINI DONALD J ,  SABAD JOSEPH J ,  WILEY ROBERT T

IPC: B41M5/10 ,  C08K13/02 ,  C09D5/23 ,  G11B5/702 ,  H01F10/02

CPC classification number: G11B5/7025 ,  B41M5/10 ,  C08K13/02 ,  Y10S428/90 ,  Y10T428/3179 ,  Y10T428/31935 ,  C08L1/10

公开(公告)号：FR2285047A1

公开(公告)日：1976-04-09

申请号：FR7525142

申请日：1975-08-07

Applicant: IBM

Inventor： HAINING FRANK W ,  RUBINO ROBERT V ,  WILEY ROBERT T

IPC: B32B15/04 ,  B29C63/00 ,  B32B15/08 ,  B32B37/00 ,  H01B19/00 ,  H05K1/03 ,  H05K3/00 ,  H05K3/22

Abstract: A process for stabilizing printed circuit board substrate or laminate through application of a number of laminate conditioning and baking cycles which function to provide the laminates with dimensional stability. This enables greater control and more precise drilling of the laminates in subsequent fabrication and assembly operations. The dimensional stability for a substrate becomes more critical as the substrate size is increased.

公开(公告)号：CA757992A

公开(公告)日：1967-05-02

申请号：CA757992D

Applicant: IBM

Inventor： CHEBINIAK PAUL ,  WILEY ROBERT T