公开(公告)号：JPH08139132A

公开(公告)日：1996-05-31

申请号：JP27255194

申请日：1994-11-07

Applicant: IBM

Inventor： SAKAMOTO KAZUNORI ,  MORIMOTO MASAYUKI ,  NATSUYAMA YOSHIBUMI

IPC: H01L21/60

Abstract: PURPOSE: To provide a carrier tape which is used for a flexible printed wiring board implemented to apparatus by bending, wherein a lead wire does not snap at the bend, even if a lead wire width of TAB becomes fine. CONSTITUTION: A carrier tape is constituted so that subslits 16 to 22 are formed at a position with a TAB external form line 10 to be blanked out, which are spaced a predetermined distance from both ends of slits 6 and 7 on a lead wire bend.

公开(公告)号：JPH09113922A

公开(公告)日：1997-05-02

申请号：JP25602495

申请日：1995-10-03

Applicant: IBM

Inventor： SAKAMOTO KAZUNORI ,  NISHIMURA TORU

IPC: G02F1/1345 ,  G02F1/13 ,  H01L23/00

Abstract: PROBLEM TO BE SOLVED: To prevent the disconnection and shorting of the wiring formed on the array substrate on the outer side of a sealant for sealing the liquid crystals between counter substrates by forming black resin films on the wiring regions on the outer side of this sealant. SOLUTION: The wirings 10 formed on the array substrate 2 are formed by extending to OLB electrode parts from a display region by penetrating the sealant 6 sealing the liquid crystals 8. The color filter substrate 4 is stuck via the sealant 6 onto the array substrate 2. TCPs 12 are adhered by ACF (anisotropically conductive films) 14 onto the OLB electrode parts of the array substrate 2. The org. resin layers 20 dispersed with black pigments are formed on the wirings 10 between the color filter substrate 4 side ends of the ACFs 14 and the ACF 145 side end of the sealant 6. The black resin layers 20 are so formed as to embed their one ends into the lower part of the ACF 14 ends and function as the protective films for the wirings 10 so as to prevent the adhesion of foreign matter on the wirings 10 and to prevent dew condensation.

公开(公告)号：JPH07199207A

公开(公告)日：1995-08-04

申请号：JP29644293

申请日：1993-11-26

Applicant: IBM

Inventor： SAKAMOTO KAZUNORI ,  UMEMOTO KAZUHIRO

IPC: G02F1/1345 ,  G02F1/13 ,  H01L23/498 ,  H05K3/36

Abstract: PURPOSE: To prevent the damage of an input lead of a tape carrier due to distortion or creases which are caused on a TAB tape by the difference in thermal expansion coefficient between a printed circuit board and an LCD glass substrate with respect to an LCD driver package using the TAB tape carrier. CONSTITUTION: A TAB tape carrier 10 of the LCD driver package which has an input lead 12 connected to a printed circuit board 24, an output lead 14 connected to an LCD glass substrate 26, and a chip 22 is provided with at least a pair of anchor holes 40; and after the LCD driver package is mounted, anchor holes 40 are used to fix the tape carrier 10 to the circuit board 24 with solder or adhesive. By this fixing with anchor holes 40, distortion and creases of the tape are prevented from being propagated to the input lead 12.