公开(公告)号：JPH1145618A

公开(公告)日：1999-02-16

申请号：JP16024698

申请日：1998-06-09

Applicant: IBM

Inventor： GELORME JEFFREY D ,  SANG WON KANG ,  PURUSHOTHAMAN SAMPATH

IPC: C08L71/12 ,  H01B1/00 ,  H01B1/22 ,  H01R11/01 ,  H05K1/09 ,  H05K3/32

Abstract: PROBLEM TO BE SOLVED: To provide a conductive paste material that is environmentally safe and inexpensive, and that provides higher conductivity than an existing silver fill-up epoxy. SOLUTION: This conductive paste structure comprises a polymer material, a conductive film 32, e.g. a particle having tin or a mixture with copper. Films of adjacent particles are heated each other to be fused. A polymer material is styrene allylalcohol resin or thermoplastic phenoxy polymer. This structure is provided between two conductive surfaces, e.g. between a chip pad and a substrate pad, to give a mutual electric connection and mechanical adhesion.