公开(公告)号：EP1839468A4

公开(公告)日：2011-06-08

申请号：EP05810237

申请日：2005-10-19

Applicant: IBM

Inventor： GELORME JEFFREY D ,  GUHA SUPRATIK ,  LABIANCA NANCY C ,  MARTIN YVES ,  VAN KESSEL THEODORE G

IPC: H05K7/20

CPC classification number: H01L23/3733 ,  H01L23/4093 ,  H01L23/42 ,  H01L2924/0002 ,  H01L2924/00

公开(公告)号：JPH1145618A

公开(公告)日：1999-02-16

申请号：JP16024698

申请日：1998-06-09

Applicant: IBM

Inventor： GELORME JEFFREY D ,  SANG WON KANG ,  PURUSHOTHAMAN SAMPATH

IPC: C08L71/12 ,  H01B1/00 ,  H01B1/22 ,  H01R11/01 ,  H05K1/09 ,  H05K3/32

Abstract: PROBLEM TO BE SOLVED: To provide a conductive paste material that is environmentally safe and inexpensive, and that provides higher conductivity than an existing silver fill-up epoxy. SOLUTION: This conductive paste structure comprises a polymer material, a conductive film 32, e.g. a particle having tin or a mixture with copper. Films of adjacent particles are heated each other to be fused. A polymer material is styrene allylalcohol resin or thermoplastic phenoxy polymer. This structure is provided between two conductive surfaces, e.g. between a chip pad and a substrate pad, to give a mutual electric connection and mechanical adhesion.

公开(公告)号：JP2001291425A

公开(公告)日：2001-10-19

申请号：JP2001044645

申请日：2001-02-21

Applicant: IBM

Inventor： GELORME JEFFREY D ,  GANG SUN K ,  PAPATHOMAS KONSTANTINOS ,  PURUSHOTHAMAN SAMPATH

IPC: C09J9/02 ,  C09J163/00 ,  C09J171/10 ,  C09J191/00 ,  C09J201/00 ,  H01B1/00 ,  H01B1/22 ,  H01B13/00 ,  H01B17/64

Abstract: PROBLEM TO BE SOLVED: To provide a conductive adhesive having a wide property selective range by using micrometer size range particles of random size coated with a low-melting-point metal. SOLUTION: The coated particles are suspended in a vehicle consisting of a mixture of a thermosetting resin and a fusing agent resin selected for electrical and mechanical property in terms of viscosity, low contraction, screen printing ability and wide range specifications. The vehicle or resin system includes thermosetting alicyclic epoxy, thermosetting phenoxy polymer and thermosetting single-functional limonene oxide. A low-melting-point coating system for the particles contains In, Sn and In-Sn, Sn-Pb, Bi-Sn-In or InAg alloy. The micrometer size range particles contain Cu, Ni, Co, Ag, Pd, Pt, a polymer and a ceramic.

公开(公告)号：JP2002047375A

公开(公告)日：2002-02-12

申请号：JP2001181535

申请日：2001-06-15

Applicant: IBM

Inventor： AFZALI-ARDAKANI ALI ,  GELORME JEFFREY D ,  KOSBAR LAURA L

IPC: B32B27/00 ,  B32B27/16 ,  B32B27/18 ,  C08G59/40 ,  C08H3/00 ,  C08H6/00 ,  C08H7/00 ,  C08J5/04 ,  C08K3/00 ,  C08K5/1515 ,  C08K5/16 ,  C08L5/00 ,  C08L63/00 ,  C08L91/00 ,  C08L93/00 ,  C08L97/00 ,  C08L99/00 ,  H05K1/03

Abstract: PROBLEM TO BE SOLVED: To provide a crosslinked composition originated from living things and a manufacturing method for the same, and the structure thereof, and a manufacturing method for a printed circuit board originated from the living things using this composition. SOLUTION: A material originated from living things such as lignin, cereal oil, a wood resin, tannin, polysaccharides, and a mixture of these, etc., is cross- linked preferably using heat, a cross-linking agent and an initiator. The material thus produced has a property suitable for producing a printed circuit board. A cloth produced from glass fibers or from living things is impregnated with a mixture of the material originated from living things, the cross-linking agent, and the initiator, and then processed by a conventional method of obtain the printed circuit board.

公开(公告)号：JPH11176750A

公开(公告)日：1999-07-02

申请号：JP26220098

申请日：1998-09-17

Applicant: IBM

Inventor： AFZALI-ARDAKANI ALI ,  BRUNSVOLD WILLIAM ROSS ,  GELORME JEFFREY D ,  KOSBAR LAURA L ,  NANCY C RABIANKA ,  PATEL NIRANJAN M ,  PUSHUKARA RAAO VARAANASHII

IPC: G03F7/038 ,  G03F7/00 ,  H01L21/027

Abstract: PROBLEM TO BE SOLVED: To obtain high resolution which enables development by water base, by adding film formation polymer resin with phenol group by a specified formula, glycol uril derivative cross linking agent, radiolysis acid generation agent and organic base. SOLUTION: A photoresist composition comprises film formation polymer resin with phenol group. The phenol resin is copolymer of hydroxystyrene and hydroxycyclohexyl ethene shown by a formula I (n>1, 0

公开(公告)号：JP2002053699A

公开(公告)日：2002-02-19

申请号：JP2001181534

申请日：2001-06-15

Applicant: IBM

Inventor： AFZALI-ARDAKANI ALI ,  GELORME JEFFREY D ,  KOSBAR LAURA L

IPC: B32B27/00 ,  B32B27/16 ,  B32B27/18 ,  C08G59/40 ,  C08H3/00 ,  C08H6/00 ,  C08H7/00 ,  C08J5/04 ,  C08K3/00 ,  C08K5/1515 ,  C08K5/16 ,  C08L5/00 ,  C08L63/00 ,  C08L91/00 ,  C08L93/00 ,  C08L97/00 ,  C08L99/00 ,  H05K1/03

Abstract: PROBLEM TO BE SOLVED: To provide a biobased cross-linked composition derived from organism, a method for producing the crosslinked composition, a structure prepared therefrom, a biobased printed wiring board using the above composition and a method for producing the above structure. SOLUTION: Biobased materials such as lignin, crop oils, wood resins, tannins, polysaccharides and combinations thereof are cross-linked, preferably using heat, a cross-linking agent, and an initiator. The materials fabricated have suitable characteristics for printed wiring boards. A glass fiber or biobased cloth is impregnated with an admixture of the biobased material cross-linking agent and initiator and the impregnated material is processed by conventional methods to produce a printed wiring board.

公开(公告)号：JP2002049152A

公开(公告)日：2002-02-15

申请号：JP2001164184

申请日：2001-05-31

Applicant: IBM

Inventor： AFZALI-ARKDAKANI ALI ,  TORISHIA LIN BREEN ,  GELORME JEFFREY D ,  DAVID BRIAN MITSUI ,  MICHAEL JOSEPH LUX

IPC: G03F7/038 ,  H01L21/027

Abstract: PROBLEM TO BE SOLVED: To provide a high sensitivity and high resolution photoresist composition developable with an organic solvent for use in E(electron) beam lithography. SOLUTION: The composition includes a high sensitivity soluble film forming photoresist composition of a dendrimer calix [4] arene derivative of formula (1) and forms a lithographic pattern together with a crosslinker selected from glycoluril derivatives capable of reacting with such dendrimers under the action of an acid catalyst, a photo-acid generating agent and an organic solvent. The composition is particularly useful for forming a high resolution (

公开(公告)号：JPH10168329A

公开(公告)日：1998-06-23

申请号：JP16405297

申请日：1997-06-20

Applicant: IBM

Inventor： ANGELOPOULOS MARIE ,  GELORME JEFFREY D ,  NEWMAN THOMAS H ,  PATEL NIRANJAN M ,  SEEGER DAVID E

IPC: C08G61/12 ,  C08G61/10 ,  C08G75/02 ,  C08G75/04 ,  C08J3/28 ,  C08L33/00 ,  C08L33/02 ,  C08L41/00 ,  C08L79/00 ,  C08L101/00 ,  C08L101/02 ,  C08L101/12 ,  G03F7/038 ,  G03F7/09 ,  H01B1/12

Abstract: PROBLEM TO BE SOLVED: To obtain a conductive polymer composition containing a specific polyacid and a specific polymer, capable of being cross-linked, improved in solubility in water, and useful for conductive electron beam resists, photoresists, etc. SOLUTION: This water-soluble conductive polymer composition comprises (A) a polyacid having acid groups selected from carboxyl groups, phosphate groups, phosphate groups, borate groups, sulfate groups and sulfonate groups, such as poly(styrenesulfonic acid), and (B) a polymer selected from the (non) substituted homopolymers or (non)substituted copolymers of aniline, thiophene, pyrrole or p-phenylene sulfide, having one or more conjugated parts constituting conjugated basic atom-containing repeating units. Therein, the number of acidic groups in the polyacid is larger than the number of proton-addable basic atoms in the polymer. An aqueous solution containing the composition in a concentration of 5-10wt.% is preferably prepared and further mixed with an oxidizing agent/a polymerization initiator.

公开(公告)号：DE69220163D1

公开(公告)日：1997-07-10

申请号：DE69220163

申请日：1992-09-04

Applicant: IBM

Inventor： BABICH EDWARD D ,  GALLIGAN EILEEN A ,  GELORME JEFFREY D ,  MCGOUEY RICHARD P ,  NUNES SHARON L ,  PARASZCZAK JURIJ R ,  SERINO RUSSELL J ,  WITMAN DAVID F

IPC: G03F7/004 ,  G03F7/029 ,  G03F7/038 ,  G03F7/075 ,  H01L21/027 ,  H01L21/30

公开(公告)号：CA1334566C

公开(公告)日：1995-02-28

申请号：CA611439

申请日：1989-09-14

Applicant: IBM

Inventor： DAY RICHARD A ,  GELORME JEFFREY D ,  RUSSELL DAVID J ,  WITT STEVEN J

IPC: C08G59/00 ,  C08G59/20 ,  C08G59/30 ,  C08G59/62 ,  C08G59/68 ,  C08L63/00 ,  G03F7/038

Abstract: An improved photoimagable cationically polymerizable epoxy based coating material is provided. The material includes an epoxy resin system consisting essentially of between about 10% and about 80% by weight of a polyol resin which is a condensation product of epichlorohydrin and bisphenol A having a molecular weight of between about 40,000 and 130,000; between about 20% and about 90% by weight of an epoxidized octafunctional bisphenol A formaldehyde novolak resin having a molecular weight of 4,000 to 10,000; and if flame retardancy is required between about 35% and 50% by weight of an epoxidized glycidyl ether of tetrabromo bisphenol A having a softening point of between about 60.degree.C and about 110.degree.C and a molecular weight of between about 600 and 2,500. To this resin system is added about 0.1 to about 15 parts by weight per 100 parts of resin of a cationic photoinitiator capable of initiating polymerization of said epoxidized resin system upon exposure to actinic radiation; the system being further characterized by having an absorbance of light in the 330 to 700 nm region of less than 0.1 for a 2.0 mil thick film. Optionally a photosensitizer such as perylene and its derivatives or anthracene and its derivatives may be added.