公开(公告)号：JPH06106678A

公开(公告)日：1994-04-19

申请号：JP26425492

申请日：1992-09-07

Applicant: IBM

Inventor： EREFUZERIOSU ADAMOPOUROSU ,  YUNGIIRU KIMU ,  KANNUUKU RII ,  TAE SUN OO ,  TERENSU ROBAATO OTOUURU ,  SANPASU PURUSHIYOTSUTAMAN ,  JIYON JIEIMUZU RITOSUKO ,  JIEEN MAAGARETSUTO SHIYOO ,  ARUFURETSUDO BUIEBETSUKU ,  JIYOOJI FUREDERITSUKU UOOKAA

IPC: B32B7/10 ,  B32B15/08 ,  B32B15/088 ,  B32B27/00 ,  C08G73/00 ,  C08G73/10 ,  H01B3/30 ,  H01L21/52 ,  H05K1/03 ,  H05K3/46

Abstract: PURPOSE: To enhance the mutual adhesion of polyimide layers and the adhesion of polyimide and a metal substrate in a multilayered product in electronic mounting. CONSTITUTION: A multilayered product 10 contains terminal unsaturated adhesive polyimide 16 bonded to itself and the surface of the adhesive polyimide opposite to a substrate is bonded to polyimide 18. Further, one set or plural sets of the alternate layers of terminal unsaturated adhesive polyimide 16 and polyimide are provided. Novel adhesive polyimide is adhesive polyimide such as ODPA-APB having a terminal unsaturated heterocyclic group such as azaadenine, aminobenzotriazole, aminopurine or aminopyrazolopyrimidine.