公开(公告)号：JPH07235374A

公开(公告)日：1995-09-05

申请号：JP29632394

申请日：1994-11-30

Applicant: IBM

Inventor： JIEFURII KAATEISU HEDORITSUKU ,  DEEBUITSUDO ANDORIYUU RUISU ,  JIEEN MAAGARETSUTO SHIYOO ,  ARUFURETSUDO BUIIBETSUKU ,  SUTANREE JIYOOZEFU HOWAITOHEA

IPC: H05B6/80 ,  H05B6/62 ,  H05B6/78

Abstract: PURPOSE: To heat a sheet-like material web uniformly so as to removed surface volatile solvent by passing a web whose thickness is smaller than the wavelength of a microwave standing wave through a microwave standing wave area in which the wavelengths are shifted by 1/4 wavelength as causing carrier gas to flow. CONSTITUTION: Microwave standing waves 3, 4 of predetermined frequencies which are shifted by 1/4 wavelength along the moving direction 19 of a web 1 are supplied to two respective conduction rods in a processing step 2. By an electric field based on the same the web 1 having a smaller thickness than the wavelength of the microwave frequency is heated in the step. By standing waves 3, 4 shifted by 1/4 wavelength the standing waves 3, 4 are not coupled with each other so that the web is uniformly heated and volatile solvent on the surface of the web is excellently removed by carrier gas.

公开(公告)号：JPH06125519A

公开(公告)日：1994-05-06

申请号：JP8450393

申请日：1993-04-12

Applicant: IBM

Inventor： ARII AFUZAARI ARUDAKAANI ,  MARII ANGEROPUUROSU ,  JIYATSUKU ARUBUIN DEITSUKAASON ,  TOOMASU BEAADO PIRUSUBERII ,  KAARU JIYOOZEFU PATORITSUTSU ,  JIEEN MAAGARETSUTO SHIYOO ,  JIEFURII DONARUDO JIEROOMU

IPC: C08K3/22 ,  B05D5/02 ,  B05D5/12 ,  C08G61/12 ,  C08L101/00 ,  C09D5/24 ,  H01B1/12 ,  H01J29/86 ,  H01L23/29 ,  H01L23/498 ,  H01L23/60 ,  H04N5/65 ,  H05K9/00

Abstract: PURPOSE: To provide an abrasion-resistant and scratch-resistant conductive polymer composition which can be used as an electrostatic discharge layer having an abrasion resistance and light transmittance and, at the same time, can prevent the deposition of dusts and scratches due to static electricity. CONSTITUTION: An abrasion-resistant and scratch-resistant conductive polymer composition is manufactured by mixing an abrasion-resistant material with a conductive polymer material. The abrasion-resistant polymer material is composed of silicone, polysiloxane, acrylate, epoxy, methacrylate, epoxy acrylate, epoxy methacrylate, and styrene and a conductive polymer material is selected out of a group composed of substituted and nonsubstituted polyaniline, polyparaphenylene vinylene, substituted and nonsubstituted polythiophene, substituted and nonsubstituted poly-p-phenylene sulfide, substituted and nonsubstituted polyfuran, substituted and nonsubstituted polypyrrole, substituted and nonsubstituted polyselenophene, polyacetylene prepared from a soluble precursor, and their combinations. It is also possible to constitute the composition in such a laminated structure that an abrasion-resistance layer is provided on a layer of the conductive polymer.

公开(公告)号：JPH05211249A

公开(公告)日：1993-08-20

申请号：JP11070592

申请日：1992-04-03

Applicant: IBM

Inventor： GUNANARINGAMU AAJIYABARINGAMU ,  ARINA DOICHIE ,  FUADO ERIASU DOANII ,  BURUUSU KENESU FUAAMAN ,  DONARUDO JIYON HANTO ,  CHIYANDORASEKAA NARAYAN ,  MODESUTO MAIKERU OPURISUKO ,  SANPASU PURUSHIYOSAMAN ,  BINSENTO RANIERI ,  SUTEFUAN RENITSUKU ,  JIEEN MAAGARETSUTO SHIYOO ,  JIYANUSU SUTANISUROU UIRUKUJIN ,  DEBITSUTO FURANKU UITSUTOMAN

IPC: B23K26/00 ,  B32B37/00 ,  H01L21/68 ,  H01L23/12 ,  H01L23/15 ,  H05K3/00 ,  H05K3/46

Abstract: PURPOSE: To enable simultaneous manufacture of a multi-layered thin-film interconnection structure and a ceramic substrate with a good yield by forming on a transmitting substrate a separation layer which is less formed, when reacted with a predetermined electromagnetic radiation. CONSTITUTION: A polymer layer 2 is cut off by applying an ultraviolet light 10 from a scanning layer, via a transmitting substrate 1 to the polymer layer 2. Since a metallic layer 3 acts as a reflecting layer, the ultraviolet light 10 cannot reach an interconnection structure 4. As a result of the laser cut-off, monomer pieces, that is, an emitted substance gas is trapped between the substrate 1 and reflecting metal layer 3, thus forming voids 15 within the polymer layer 2. The polymer layer 2 is formed less due to the voids 15, and thus can be separated (removed) from the substrate 1. After the structure 4 has been removed from the substrate 1, the structure 4 is supported by a metal ring (frame) 5. At this time point, the structure can be applied to an electrically good glass ceramic substrate.

公开(公告)号：JPH04215069A

公开(公告)日：1992-08-05

申请号：JP4411291

申请日：1991-02-18

Applicant: IBM

Inventor： BURAIAN SAMIYUERU BIIMAN ,  KEISU EDOWAADO FUOOGERU ,  JIANGIRU KIMU ,  URUFUGIYANGU MEIA ,  JIEEN MAAGARETSUTO SHIYOO ,  JIYOOJI FUREDERITSUKU UOKAA

IPC: G01R1/067 ,  G01R1/04 ,  G01R1/073 ,  G01R31/26 ,  H01R4/26 ,  H01R13/24

Abstract: PURPOSE: To provide an electric connector using a contact which is rigid and easy to position. CONSTITUTION: The invention relates to an electric connector for connecting with a plurality of deformable protruding contacts 40, 42, 46 on an electronic device. The electric connector has a substrate 16 including a plurality of conductors 10, 12, 14. A tip of the conductor protrudes from a surface of the substrate. A polymer layer 20 is attached to the surface of the substrate, and an opening for exposing the tip of the conductor is formed. Each opening accepts the contact of the electronic device for electrically connecting with the conductor. A mechanism 30 for pressing against the conductor with the deformable contact of the electronic device exposed is provided, and if a sufficient pressure is applied by it, the contact is deformed by the rigid conductor thereby attaining good electric connection between them.

公开(公告)号：JPH05303993A

公开(公告)日：1993-11-16

申请号：JP27228792

申请日：1992-09-14

Applicant: IBM

Inventor： MAIKERU HATSUTSUAKISU JIYUNIA ,  DEIBITSUDO ANDORIYUU RUISU ,  JIEEN MAAGARETSUTO SHIYOO

IPC: C08G73/10 ,  H01P7/06 ,  H01P11/00 ,  H05B6/68 ,  H05B6/80

Abstract: PURPOSE: To recognize almost the exact time of a reaction in a minimum time and easily and exactly obtain a product of desired quality by watching the increase of temperature versus time of a workpiece in a cavity, and controlling intensity of the radiation. CONSTITUTION: A precuror material of polyamide acid is dissolved in a solvent, and a base is coated with it. This coated part is arranged in a cavity of device 2, microwave is radiated on it from a probe 22. Power is controlled by a controller 54 which responds to a sample temperature measured by a pyrometer 68 and to a cavity temperature monitored by an IR pyrometer 66. A power reflected from the device 2 is measured by an output meter and a sensor 44, 46, and this information is relayed to a controller 54. The controller 54 transmits the programmed response to a motor 50, which moves the probe 22 to the inside or the outside of the cavity. Thus, the reflected power is minimized, and the critical coupling of the system is achieved.

公开(公告)号：JPH05218654A

公开(公告)日：1993-08-27

申请号：JP23912992

申请日：1992-09-08

Applicant: IBM

Inventor： DEIBITSUDO ANDORIYUU RUISU ,  JIEEN MAAGARETSUTO SHIYOO

IPC: H05K3/46 ,  C04B35/638

Abstract: PURPOSE: To completely burn out organic binder resin with almost no oxidation of copper paste metal without decomposing of a ceramic layer by sintering a laminated non-sintered green complex, containing a copper paste metal by microwaves. CONSTITUTION: This composite material containing thermoplastic organic binder, wherein particles selected from a group comprising glass particles and the mixture of the glass particles and crystalline particles are dispersed, is used, and a green sheet, which forms a patterned metallic layer and has the sintering temperature less than the melting point of a conductor, is formed. Then, after a conductor-forming structure pattern is formed on the surface of the green sheet, a second green sheet is overlapped on the surface of this green sheet, so as to hold the pattern. Then, the overlapped and laminated sheets are laminated together, and the laminated body is heated by microwaves to a burn-out temperature. Thus, a binder in the green sheet is decomposed and removed. Thereafter, the laminated body is sintered, and the desired ceramic composite structure is obtained.

公开(公告)号：JPH06106678A

公开(公告)日：1994-04-19

申请号：JP26425492

申请日：1992-09-07

Applicant: IBM

Inventor： EREFUZERIOSU ADAMOPOUROSU ,  YUNGIIRU KIMU ,  KANNUUKU RII ,  TAE SUN OO ,  TERENSU ROBAATO OTOUURU ,  SANPASU PURUSHIYOTSUTAMAN ,  JIYON JIEIMUZU RITOSUKO ,  JIEEN MAAGARETSUTO SHIYOO ,  ARUFURETSUDO BUIEBETSUKU ,  JIYOOJI FUREDERITSUKU UOOKAA

IPC: B32B7/10 ,  B32B15/08 ,  B32B15/088 ,  B32B27/00 ,  C08G73/00 ,  C08G73/10 ,  H01B3/30 ,  H01L21/52 ,  H05K1/03 ,  H05K3/46

Abstract: PURPOSE: To enhance the mutual adhesion of polyimide layers and the adhesion of polyimide and a metal substrate in a multilayered product in electronic mounting. CONSTITUTION: A multilayered product 10 contains terminal unsaturated adhesive polyimide 16 bonded to itself and the surface of the adhesive polyimide opposite to a substrate is bonded to polyimide 18. Further, one set or plural sets of the alternate layers of terminal unsaturated adhesive polyimide 16 and polyimide are provided. Novel adhesive polyimide is adhesive polyimide such as ODPA-APB having a terminal unsaturated heterocyclic group such as azaadenine, aminobenzotriazole, aminopurine or aminopyrazolopyrimidine.

公开(公告)号：JPH04305148A

公开(公告)日：1992-10-28

申请号：JP14426091

申请日：1991-04-18

Applicant: IBM

Inventor： JIEROOMU JIYON KUOMO ,  JIEFURII DONARUDO GEROORUMU ,  MAIKERU HATSUAKISU JIYUNIA ,  DEIBUITSUDO ANDORIYUU RUISU ,  JIEEN MAAGARETSUTO SHIYOO ,  SUTANREI JIYOSEFU HOWAITOHEAA

IPC: B01J19/12 ,  C08G73/10 ,  G01N22/00 ,  H01L21/312 ,  H05B6/68 ,  H05B6/80 ,  H05K1/03 ,  H05K3/46

Abstract: PURPOSE: To make it possible to obtain a product having no defect in the shortest time by emitting microwave power for expediting a physical process or chemical reaction. CONSTITUTION: To perform the maximum resonance of a system varying with time during reaction, a tuning type microwave resonance cavity 2 is tuned by vertically moving a short bar 10 and inserting or drawing a microwave probe 22 into or from the cavity. For example, power of level P1 to P4 is emitted to solvent dissolved polyamic acid precursor covering the plate arranged at the bottom wall 8 of the cavity 2. First, the solvent is evaporated from a thin film, then to sequentially increase the Q value (quality factor) so that the imide rate is increased to become complete imide compound, the power is emitted for four time intervals.