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公开(公告)号：JPH0641763A
公开(公告)日：1994-02-15
申请号：JP16230391
申请日：1991-06-07
Applicant: IBM
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公开(公告)号：JPH03132089A
公开(公告)日：1991-06-05
申请号：JP22143690
申请日：1990-08-24
Applicant: IBM
IPC: C08G73/10 , C23C18/16 , C23C18/31 , C25D5/02 , C25D5/54 , C25D7/00 , H01L21/48 , H01L23/12 , H05K1/03 , H05K3/00 , H05K3/10 , H05K3/18 , H05K3/24
Abstract: PURPOSE: To reduce an electrically active substance object selectively by enabling the oxidation reduction potentials of first and second electrically active substance objects to differ and forming one of the electrically active substance objects in the other pattern. CONSTITUTION: The structure of a different electrically active substance has a first layer 32 of an electrically active substance. A second layer 34 of an electrically active substance is provided on it, has a pattern 36 formed in it, and exposes a surface 38 of the electrically active layer 32. A surface 40 that is not provided for a patterned electrically active layer of the electrically active layer 32 of a structure 35 can be provided on an electrochemically conductive substance, that is suited for forming a cathode for an electrochemical circuit, thus performing selective reduction of an electrically active object.
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公开(公告)号：JPH04231474A
公开(公告)日：1992-08-20
申请号：JP10819191
申请日：1991-04-15
Applicant: IBM
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公开(公告)号：JPH0874100A
公开(公告)日：1996-03-19
申请号：JP22486095
申请日：1995-09-01
Applicant: IBM
Inventor： MADABU DATSUTA , TERENSU ROBAATO OTOUURU
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Patent Agency Ranking6.发明专利
公开(公告)号：JPH0621140A
公开(公告)日：1994-01-28
申请号：JP5843993
申请日：1993-03-18
Applicant: IBM
Inventor： MAIKERU JIYON BURADEII , KAACHISU EDOWAADO FUARERU , SUN KUON KAN , JIEFURII ROBAATO MARINO , DONARUDO JIYOOZEFU MIKARUSEN , POORU ANDORIYUU MOSUKOUITSUTSU , YUUJIN JIYON OSARIBAN , TERENSU ROBAATO OTOUURU , SANPASU PURUSHIYOTAMAN , SHIERUDON KOORU RIIREI , JIYOOJI FUREDERITSUKU UOOKAA
IPC: H01L21/60 , C23C18/50 , C25D3/54 , H01L21/288 , H01L21/603 , H01L21/768 , H01L23/495 , H01L23/498 , H01L23/532 , H01L21/321
Abstract: PURPOSE: To replace a structural material for forming an electric mutual connection with a semiconductor chip for an inexpensive substitute for gold by providing a metallurgical structure, including a material containing silicon and germanium. CONSTITUTION: For example, it is desired that a pad is provided with surface metallurgically wetted by solder for bonding, so that a chip with solder mound such as C4 can be connected with a substrate like the pad on a package substrate. Then, a passivation state layer 8 constituted of an organic material or an inorganic material is formed in the surrounding of an electric conductor 4 made of an Al/Cu material, while an exposed region 10 of the electric conductor 4 is left. A layer constituted of a material 12, including silicon or germanium, is arranged on the passivation state layer 8 so as to be brought in contact with the exposed region 10. Thus, aluminum oxide or copper oxide can be removed from the surface of the contact pad, the increase in a contact resistance can be suppressed, and Cu can be prevented from being dispersed in a silicon substrate 2.
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公开(公告)号：JPH059792A
公开(公告)日：1993-01-19
申请号：JP1988992
申请日：1992-02-05
Applicant: IBM
Inventor： TERENSU ROBAATO OTOUURU , ARUFURETSUDO BIIBETSUKU
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公开(公告)号：JPH07173637A
公开(公告)日：1995-07-11
申请号：JP24634794
申请日：1994-10-12
Applicant: IBM
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公开(公告)号：JPH06106678A
公开(公告)日：1994-04-19
申请号：JP26425492
申请日：1992-09-07
Applicant: IBM
Inventor： EREFUZERIOSU ADAMOPOUROSU , YUNGIIRU KIMU , KANNUUKU RII , TAE SUN OO , TERENSU ROBAATO OTOUURU , SANPASU PURUSHIYOTSUTAMAN , JIYON JIEIMUZU RITOSUKO , JIEEN MAAGARETSUTO SHIYOO , ARUFURETSUDO BUIEBETSUKU , JIYOOJI FUREDERITSUKU UOOKAA
IPC: B32B7/10 , B32B15/08 , B32B15/088 , B32B27/00 , C08G73/00 , C08G73/10 , H01B3/30 , H01L21/52 , H05K1/03 , H05K3/46
Abstract: PURPOSE: To enhance the mutual adhesion of polyimide layers and the adhesion of polyimide and a metal substrate in a multilayered product in electronic mounting. CONSTITUTION: A multilayered product 10 contains terminal unsaturated adhesive polyimide 16 bonded to itself and the surface of the adhesive polyimide opposite to a substrate is bonded to polyimide 18. Further, one set or plural sets of the alternate layers of terminal unsaturated adhesive polyimide 16 and polyimide are provided. Novel adhesive polyimide is adhesive polyimide such as ODPA-APB having a terminal unsaturated heterocyclic group such as azaadenine, aminobenzotriazole, aminopurine or aminopyrazolopyrimidine.
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公开(公告)号：JPH03242626A
公开(公告)日：1991-10-29
申请号：JP33085790
申请日：1990-11-30
Applicant: IBM
Inventor： SUTEIIBUN RESURII BUTSUKUUOORU , MAATEIN JIYOZEFU GOORUDOBAAGU , REBATEI IIIENGAA , DANIERU PIITAA MORISU , TERENSU ROBAATO OTOUURU , ARUFURETSUDO BIIBETSUKU
Abstract: PURPOSE: To obtain a display which changes in colors in a wide range and is bright with small consumption of electric power without any limit of the observation angle by using an electrochemical color-changing cell having a specified inner-molecule charge transfer salt as a color-changing agent for a display panel. CONSTITUTION: This electrochemical color-changing cell consists of a cell 2 at least a part of which is transparent and is filled with a color-changing agent 4 comprising an inner-molecule charge transfer salt of a soln. in a liquid, gel or solid phase. The cell has an indicating electrode 6 and a counter electrode 8 which face each other with a separation zone 12 between these and are connected to a variable DC power supply 10. The material 4 consists of a covalent compd. having at least one radical cationic part which makes a covalent bond with at least one radical anionic part or a material containing carbonyl groups which make conjugates with violene or cyanine part or aromatic part. In the obtd. color-changing cell, changes in colors in a wide range can be obtd. by changing the voltage applied on electrodes 6, 8.
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