公开(公告)号：JPH1092983A

公开(公告)日：1998-04-10

申请号：JP19097497

申请日：1997-07-16

Applicant: IBM

Inventor： DOCKERTY ROBERT CHARLES ,  FRAGA RONALD MAURICE ,  RAMIREZ CIRO NEAL ,  RAY SUDIPTA KUMAR ,  ROBBINS GORDON JAY

IPC: H05K7/20 ,  H01L23/12 ,  H01L23/32 ,  H01L23/40 ,  H01L23/498 ,  H05K3/34 ,  H05K3/36

Abstract: PROBLEM TO BE SOLVED: To provide a method and a structure for enhancing solder column grid array joint of a ceramic substrate to a printed circuit board. SOLUTION: A significantly large solder column 14 is formed along the periphery of a substrate simultaneously with an array of fine electric interconnection solder columns 7 on the substrate. Reinforcing columns and electrical signal columns are positioned and jointed, by solder reflow, to corresponding patterns of pads 4, 16 on a printed circuit board 6. A heat sink 9 is connected thermally with a structural element of the substrate 1 through bonding or mechanical pressing. According to the structure, stress to be generated in the solder column 14 due to bending induced by the pressing force of the heat sink 9 or vibration can be reduced significantly without requiring any complicated or special manufacturing process additionally.

公开(公告)号：MY127824A

公开(公告)日：2006-12-29

申请号：MYPI20020370

申请日：2002-02-04

Applicant: IBM

Inventor： RAY SUDIPTA KUMAR ,  SARKHEL AMIT K

IPC: B23K1/00 ,  H01L21/44 ,  B23K35/02 ,  B23K35/14 ,  B23K35/26 ,  H01L21/60 ,  H01L23/485 ,  H01L23/488 ,  H01L23/498 ,  H05K3/34

Abstract: A METHOD AND STRUCTURE FOR SOLDERABLY COUPLING AN ELECTRONIC MODULE (E.G.A CERAMIC OR PLASTIC BALL GRID ARRAY MODULE) TO A CIRCUIT BOARD.A LEAD-FREE SOLDER BALL IS SOLDERED TO THE MODULE WITHOUT USING A JOINING SOLDER TO EFFECTUATE THE SOLDERING.THE SOLDER BALL COMPRISES A TIN-ANTIMONY ALLOY THAT INCLUDES ABOUT 3TO ABOUT 15% ANTIMONY BY WEIGHT. THE SOLDER BALL IS SOLDERED TO THE CIRCUIT BOARD WITH A LEAD-FREE JOINER SOLDER. THE JOINER SOLDER COMPRISES A TIN-SILVER-COPPER ALLOY THAT INCLUDES BY WEIGHT ABOUT 95.5-96.0% TIN, ABOUT 3.5-4.0% SILVER, AND ABOUT 0.5-1.0% COPPER.THE RESULTANT SOLDER CONNECTION BETWEEN THE MODULE AND THE CIRCUIT BOARD HAS A FATIGUE LIFE OF AT LEAST ABOUT 90% OF A FATIGUE LIFE OF A REFERENCE STRUCTURE. THE REFERENCE STRUCTURE HAS A 90Pb/10Sn SOLDER BALL JOINED TO BOTH THE MODULE AND THE CIRCUIT CARD BY A 63Sn/37Pb JOINER SOLDER.(FIGURE 2)

公开(公告)号：MY116990A

公开(公告)日：2004-04-30

申请号：MYPI9704897

申请日：1997-10-17

Applicant: IBM

Inventor： DOCKERTY ROBERT CHARLES ,  FRAGA RONALD MAURICE ,  RAMIREZ CIRO NEAL ,  RAY SUDIPTA KUMAR ,  REYNOLDS CHARLES LEVERN JR ,  ROBBINS GORDON JAY

IPC: H01L23/48 ,  H01L21/60 ,  H01L23/498 ,  H05K1/11 ,  H05K3/34

Abstract: SUPPORTING STRUCTURE FOR A BAL1 GRID ARRAY SURFACE MOUNTED INTEGRATED CIRCUIT DEVICE (3, 24, 26) COMPOSED OF SUPPORT SOLDER (6, 16-18, 33) FORMED AT SELECTIVE CORNER LOCATIONS (19, 31, 32) ON THE BALL GRID ARRAY SURFACE OF THE INTEGRATED CIRCUIT DEVICE. IN ONE FORM, L-SHAPED PATTERNS OF HIGH MELTING TEMPERATURE SOLDER ARE FORMED ALONG THE AXES DEFINED BY THE BALL GRID ARRAY AND ARE CHARACTERIZED IN THAT CROSS SECTIONS OF THE L-SHAPED PATTERN MATCH THAT OF THE SOLDER BALLS ALONG ONE AXIS, AND REPRESENT A CONTINUUM OF SOLDER BETWEEN SOLDER BALL LOCATIONS ALONG THE OTHER AXIS. SUPPORT SOLDER CAN BE ADDED WHERE NECESSARY TO PROVIDE BOTH STRUCTURAL REINFORCEMENT AND THERMAL CONDUCTION. CONTROL OF THE CROSS SECTION OF THE SUPPORT SOLDER ENSURES THAT SURFACE TENSION EFFECTS OF THE MOLTEN LOW TEMPERATURE REFLOW SOLDER (12, 29) USED TO CONNECT THEINTEGRATED CIRCUIT DEVICE DOES NOT MATERIAL1Y CHANGE THE FINAL RELATIVE SPACING BETWEEN THE INTEGRATED CIRCUIT DEVICE BALLS (11) AND THE UNDERLYING PRINTED CIRCUIT BOARD CONTACTS (2).

公开(公告)号：DE69721148D1

公开(公告)日：2003-05-28

申请号：DE69721148

申请日：1997-07-09

Applicant: IBM

Inventor： DOCKERTY ROBERT CHARLES ,  FRAGA RONALD MAURICE ,  RAMIREZ CIRO NEAL ,  RAY SUDIPTA KUMAR ,  ROBBINS GORDON JAY

IPC: H05K7/20 ,  H01L23/12 ,  H01L23/32 ,  H01L23/40 ,  H01L23/498 ,  H05K3/34 ,  H05K3/36

Abstract: Structure and method for reinforcing a solder column grid array attachment of a ceramic or the like substrate to a printed circuit board, the reinforcement providing support for a heat sink which is bonded or affixed by pressure to a structural element of the substrate. In one form, the invention involves the concurrent formation of materially larger solder columns along the perimeter of the substrate in conjunction with the array of thin electrically interconnecting solder columns on the substrate. The reinforcing and electrical signal columns are thereafter aligned and attached by solder reflow to a corresponding pattern of pads on the printed circuit board. The heat sink is thermally connected to a structural element of the substrate by bonding or mechanical compression. Stresses in the solder columns caused by heat sink compressive forces or vibration induced flexing are materially decreased without adding complex or unique manufacturing operations.

公开(公告)号：DE3276982D1

公开(公告)日：1987-09-17

申请号：DE3276982

申请日：1982-11-05

Applicant: IBM

Inventor： CHANCE DUDLEY AUGUSTUS ,  PLATT ALAN ,  HO CHUNG WEN ,  RAY SUDIPTA KUMAR

IPC: H01L23/52 ,  H01L23/538 ,  H05K1/00 ,  H05K3/22

Abstract: A chip carrying module includes a number of engineering change lines (ECX, ECY) buried below the surface of the module. The engineering change lines are interrupted periodically to provide a set of vias (48, 84; 49, 53; 54, 58) extending up to the upper surface of the module between each set of chips (10-15) where the vias are connected by dumbbell-shaped pads (45-47, 50-52, 55-57) including a narrow link (46, 51, 56) which permits laser deletion or the like. In addition, the dumbbell-shaped pads are located adjacent to the fan-out pads (41, 75) for the chips. Thus, the fan-out pads can be connected to the dumbbell-shaped pads (45, 70) by means of fly-wires (44, 74). In addition, individual engineering change lines can be connected together to reach every region of the module by connecting a fly-wire (59) from one dumbbell-shaped pad (55) to another (60). In addition, by deleting the links (46, 56, 83, 71) at such dumbbell-shaped pads, the engineering change connections are limited to the particular path required.

公开(公告)号：DE69208415T2

公开(公告)日：1996-09-19

申请号：DE69208415

申请日：1992-09-11

Applicant: IBM

Inventor： BHATIA HARSARAN SINGH ,  INTERRANTE MARIO JOHN ,  KADAKIA SURESH DAMONDARDAS ,  STOLLER HERBERT IVAN ,  MALAVIYA SHASHI DHAR ,  MCLEOD MARK HARRISON ,  RAY SUDIPTA KUMAR

IPC: H01L23/12 ,  H01L21/48 ,  H01L23/538 ,  H05K3/00 ,  H05K3/32 ,  H05K3/40

Abstract: A direct distribution wiring system is provided which facilitates the effecting of repair or engineering change in a Multi-chip module (MCM) while eliminating the need for redistribution and/or buried connections between IC attachment pads and engineering change pads, thus eliminating the need for patterned conductor layers corresponding to such functions. The operation of the MCM is improved by the wiring system allowing the reduction of lumped capacitances by disconnection of defective conductors, accomplished by providing severable connectors in a direct distribution structure, as well as the elimination of redistribution wiring layers and increased IC density on the MCM. Full potential fault coverage as well as full discretion in reversible engineering changes is provided by forming all elements of the wiring system on the surface of the device.

公开(公告)号：DE68925375T2

公开(公告)日：1996-07-11

申请号：DE68925375

申请日：1989-02-28

Applicant: IBM

Inventor： AGARWALA BIRENDRA NATH ,  BECKHAM KEITH FOWLER ,  COOPER-JOSELOW ALICE HAVEN ,  NARAYAN CHANDRASEKHAR ,  PURUSHOTHAMAN SAMPATH ,  RAY SUDIPTA KUMAR

IPC: H01L21/60 ,  H01L23/498 ,  H01L23/532 ,  H05K3/24 ,  H01L23/48 ,  H01L23/52

公开(公告)号：DE68925375D1

公开(公告)日：1996-02-22

申请号：DE68925375

申请日：1989-02-28

Applicant: IBM

Inventor： AGARWALA BIRENDRA NATH ,  BECKHAM KEITH FOWLER ,  COOPER-JOSELOW ALICE HAVEN ,  NARAYAN CHANDRASEKHAR ,  PURUSHOTHAMAN SAMPATH ,  RAY SUDIPTA KUMAR

IPC: H01L21/60 ,  H01L23/498 ,  H01L23/532 ,  H05K3/24 ,  H01L23/48 ,  H01L23/52

公开(公告)号：DE3379323D1

公开(公告)日：1989-04-13

申请号：DE3379323

申请日：1983-11-03

Applicant: IBM

Inventor： LEWIS ROBERT KENNETH ,  RAY SUDIPTA KUMAR

IPC: H01L21/60 ,  B23K35/38 ,  C23C26/00 ,  H01L21/48 ,  H05K1/03 ,  H05K1/09 ,  H05K3/22 ,  H05K3/24 ,  H05K3/34 ,  B32B15/01

Abstract: The formation of metal oxide contaminants on the surfaces of thin metal films by outdiffusion primarily through the grain boundaries of metal from an underlayer is inhibited by conducting heat cycling of such layered metal structures in an ambient gas mixture composed of inert gas, such as, nitrogen, containing a sufficient amount of active gas, such as hydrogen, carbon monoxide, or the like, at a concentration of up to 5%, preferably 2,5%, substantially to suppress such outdiffusion.

公开(公告)号：DE69721148T2

公开(公告)日：2003-12-11

申请号：DE69721148

申请日：1997-07-09

Applicant: IBM

Inventor： DOCKERTY ROBERT CHARLES ,  FRAGA RONALD MAURICE ,  RAMIREZ CIRO NEAL ,  RAY SUDIPTA KUMAR ,  ROBBINS GORDON JAY

IPC: H05K7/20 ,  H01L23/12 ,  H01L23/32 ,  H01L23/40 ,  H01L23/498 ,  H05K3/34 ,  H05K3/36

Abstract: Structure and method for reinforcing a solder column grid array attachment of a ceramic or the like substrate to a printed circuit board, the reinforcement providing support for a heat sink which is bonded or affixed by pressure to a structural element of the substrate. In one form, the invention involves the concurrent formation of materially larger solder columns along the perimeter of the substrate in conjunction with the array of thin electrically interconnecting solder columns on the substrate. The reinforcing and electrical signal columns are thereafter aligned and attached by solder reflow to a corresponding pattern of pads on the printed circuit board. The heat sink is thermally connected to a structural element of the substrate by bonding or mechanical compression. Stresses in the solder columns caused by heat sink compressive forces or vibration induced flexing are materially decreased without adding complex or unique manufacturing operations.