公开(公告)号：GB2504343A

公开(公告)日：2014-01-29

申请号：GB201213365

申请日：2012-07-27

Applicant: IBM

Inventor： BRUNSCHWILER THOMAS J ,  GOICOCHEA JAVIER V ,  OGGIONI STEFANO ,  SCHLOTTIG GERD

IPC: H01L21/56

Abstract: A method for manufacturing an underfill in a semiconductor chip stack having a cavity 4 between a first surface (2, figure 1) and a second surface (3). The cavity has multiple access 109 and vent 110 holes in at least one of the said surfaces. Viscous filling material (13) is applied through the access hole into the cavity thereby squeezing air or gas through the vent holes. The filler material may comprise of a carrier fluid 16 and filler particles 17, and be applied to the access holes by way of a dispenser tube 14. The filler material occupies the space within the cavity such that it surrounds solder balls 7. Once the filler material fills the cavity between a particular access hole and vent hole the filler material may instead be inserted through said vent hole. The vent holes may also comprise a filter element which restricts the filler particles 17 from exiting the cavity.

公开(公告)号：GB2520952A

公开(公告)日：2015-06-10

申请号：GB201321370

申请日：2013-12-04

Applicant: IBM

Inventor： BRUNSCHWILER THOMAS J ,  SCHLOTTIG GERD ,  OGGIONI STEFANO

IPC: H01L23/36 ,  H01L23/488

Abstract: An electronic device 200 of flip-chip type comprises at least one chip carrier 110 having a carrier surface 135, the carrier comprising one or more contact elements 140s,140p of electrically conductive material on the carrier surface, at least one integrated circuit chip 105 having a chip surface 120, the chip comprising one or more terminals 125s,125p of electrically conductive material on the chip surface each one facing a corresponding contact element, solder material 150 soldering each terminal to the corresponding contact element, and restrain means 210s,210p around the contact elements for restraining the solder material during a soldering of the terminals to the contact elements, wherein the carrier comprises one or more heat dissipation elements 205s,205p of thermally conductive material on the carrier surface facing the chip surface displaced from the terminals, the dissipation elements being free of any solder mask. The restrain means 210s,210p may have a surface phobic to solder material.