公开(公告)号：JP2010072993A

公开(公告)日：2010-04-02

申请号：JP2008240689

申请日：2008-09-19

Applicant: Internatl Business Mach Corp ,  インターナショナル・ビジネス・マシーンズ・コーポレーションInternational Business Maschines Corporation

Inventor： SCHMIDT ROGER R ,  TAKAYOSHI JUNJI ,  TSUKAMOTO TAKASHI ,  IMAI MASAAKI ,  INOUE YOSHINORI ,  KOUCHI MINORU ,  FUNATSU MASAYOSHI

IPC: G06F1/20 ,  H05K7/18 ,  H05K7/20

Abstract: PROBLEM TO BE SOLVED: To provide an apparatus and method for promoting cooling of an electronic apparatus rack. SOLUTION: A cooling apparatus for an electronic apparatus including a semiconductor device includes an evaporator which contains a refrigerant and makes the refrigerant vaporize under pressure lower than ambient pressure to generate a chilled refrigerant, a condenser which is communicated with the evaporator through a bypass line and reproduces the refrigerant from vapor of the refrigerant, and a circulating pump and a line which supply the cooled refrigerant to a heat exchange area of the electronic apparatus, cause heat exchange with an air flow that passes through the semiconductor device at a high temperature side of the electronic apparatus and return the refrigerant after the heat exchange to the condenser, and the pressure of the refrigerant is maintained lower than the ambient pressure in the area where heat is exchanged with the air flow. COPYRIGHT: (C)2010,JPO&INPIT

Abstract translation: 要解决的问题：提供一种用于促进电子设备机架的冷却的装置和方法。 解决方案：一种用于包括半导体器件的电子设备的冷却装置，包括含有制冷剂并使制冷剂在低于环境压力的压力下蒸发以产生冷冻制冷剂的蒸发器，冷凝器通过一个蒸发器与蒸发器连通 旁路管路并从制冷剂的蒸气中再生制冷剂，循环泵和将冷却的制冷剂供给到电子设备的热交换区域的管线，与通过半导体器件的空气流高度交换 并将热交换后的制冷剂返回到冷凝器，并且制冷剂的压力保持低于与空气流交换热量的区域中的环境压力。 版权所有（C）2010，JPO＆INPIT

公开(公告)号：JP2005191554A

公开(公告)日：2005-07-14

申请号：JP2004347711

申请日：2004-11-30

Applicant: Internatl Business Mach Corp ,  インターナショナル・ビジネス・マシーンズ・コーポレーションInternational Business Maschines Corporation

Inventor： RICHARD C CHUU ,  ELLSWORTH JR MICHAEL J ,  SCHMIDT ROGER R ,  SIMONS ROBERT E ,  TSUKAMOTO TAKESHI

IPC: F25D17/02 ,  F25D9/00 ,  G06F1/20 ,  H05K7/20

Abstract: PROBLEM TO BE SOLVED: To prevent a cooling system of a computer room from breaking down owing to heat exchanger failure or control valve failure, or loss of chilled water source. SOLUTION: A cooling system comprises at least two modular cooling units (MCU) and each MCU 310 provides system coolant to multiple electronics subsystems. The each MCU 310 comprises a heat exchanger 324, a first cooling loop 325 with at least one control valve 316, and a second cooling loop 327. The first cooling loop 325 receives chilled facility coolant from a source and passes at least a portion thereof through the heat exchanger. The second cooling loop supplies chilled system coolant to the multiple electronics subsystems and, in the heat exchanger 324, heat is expelled from the multiple electronics subsystems to the chilled facility coolant in the first cooling loop 325. At least one of control valve 316 controls flow and temperature of the facility coolant. COPYRIGHT: (C)2005,JPO&NCIPI

Abstract translation: 要解决的问题：防止计算机房的冷却系统由于热交换器故障或控制阀故障而损坏，或冷却水源的损失。 解决方案：冷却系统包括至少两个模块化冷却单元（MCU），并且每个MCU 310向多个电子子系统提供系统冷却剂。 每个MCU 310包括热交换器324，具有至少一个控制阀316的第一冷却回路325和第二冷却回路327.第一冷却回路325接收来自源的冷却设备冷却剂并使其至少一部分通过 热交换器。 第二冷却回路向多个电子子系统提供冷却系统冷却剂，并且在热交换器324中，热量从多个电子系统子系统排出到第一冷却回路325中的冷冻设备冷却剂。控制阀316中的至少一个控制流量 和设备冷却液的温度。 版权所有（C）2005，JPO＆NCIPI

公开(公告)号：JP2012190442A

公开(公告)日：2012-10-04

申请号：JP2012011998

申请日：2012-01-24

Applicant: Internatl Business Mach Corp ,  インターナショナル・ビジネス・マシーンズ・コーポレーションInternational Business Maschines Corporation

Inventor： SCHMIDT ROGER R ,  MADHUSUDAN K IYENGAR

IPC: G06Q50/06 ,  F24F11/02

CPC classification number: G06F17/5009 ,  G06Q10/04

Abstract: PROBLEM TO BE SOLVED: To provide a method, system and computer program for estimating the overall energy efficiency of a data center over a period of time.SOLUTION: Provided is a method for estimating by a computer the overall energy efficiency of a data center over a period of time. In one embodiment, a computer processor coupled to computer readable memory is configured to: receive time parameters indicating the period of time over which the overall energy efficiency of the data center is to be estimated; receive component parameters indicating the performance characteristics of data center components and the operational interactions between the data center components; simulate the operation and interaction of the data center components based at least in part on the component parameters for the period of time over which the energy efficiency is estimated; and output results of the simulation to estimate the overall energy efficiency of the data center.

Abstract translation: 要解决的问题：提供用于在一段时间内估计数据中心的整体能量效率的方法，系统和计算机程序。 解决方案：提供一种用于通过计算机估计数据中心在一段时间内的总能量效率的方法。 在一个实施例中，耦合到计算机可读存储器的计算机处理器被配置为：接收指示要估计数据中心的整体能量效率的时间段的时间参数; 接收指示数据中心组件的性能特征和数据中心组件之间的操作交互的组件参数; 至少部分地基于估计能效的时间段内的组件参数来模拟数据中心组件的操作和交互; 并输出模拟结果，估算数据中心的整体能源效率。 版权所有（C）2013，JPO＆INPIT

公开(公告)号：JP2009130358A

公开(公告)日：2009-06-11

申请号：JP2008293573

申请日：2008-11-17

Applicant: Internatl Business Mach Corp ,  インターナショナル・ビジネス・マシーンズ・コーポレーションInternational Business Maschines Corporation

Inventor： ELLSWORTH JR MICHAEL J ,  ROBERT K MULLADY ,  SEMINARO EDWARD J ,  FRANCIS R KRUG JR ,  SCHMIDT ROGER R

IPC: H05K7/20 ,  G06F1/20

CPC classification number: H05K7/2079 ,  H05K7/20772

Abstract: PROBLEM TO BE SOLVED: To provide a system and method of processing a large amount of heat loads generated from a plurality of electronics racks housed in a data center, or the like. SOLUTION: The systems and methods are provided for cooling the electronics rack. The rack includes a heat-generating electronics subsystem across which air flows from an air inlet to an air outlet side of the rack. First and second modular cooling units (MCUs) are associated with the rack and are configured, to provide a system coolant to the electronics subsystem for cooling thereof. System coolant supply and return manifolds are set in fluid communication with the MCUs for facilitating providing of system coolant to the electronics subsystem, and to an air-to-liquid heat exchanger, associated with the rack for cooling air passing through the rack. A controller monitors the system coolant and automatically shuts off flow of system coolant through the heat exchanger, using at least one isolation valve, upon detection of failure at one of the MCUs, while allowing the remaining operational MCU to provide system coolant to the electronics subsystem for liquid cooling thereof. COPYRIGHT: (C)2009,JPO&INPIT

Abstract translation: 要解决的问题：提供一种处理从容纳在数据中心等中的多个电子机架产生的大量热负荷的系统和方法。

解决方案：系统和方法用于冷却电子机架。 机架包括一个发热电子系统，空气从空气入口流到机架的空气出口侧。 第一和第二模块化冷却单元（MCU）与机架相关联并且被配置为向电子子系统提供系统冷却剂用于冷却。 系统冷却剂供应和返回歧管被设置成与MCU流体连通，以便于向电子子系统提供系统冷却剂，以及与用于冷却空气通过机架的机架相关联的空气 - 液体热交换器。 控制器监测系统冷却液，并且在检测到一个MCU的故障时，使用至少一个隔离阀自动关闭系统冷却剂流过热交换器的流量，同时允许剩余的操作MCU向系统冷却剂提供电子子系统 用于液体冷却。 版权所有（C）2009，JPO＆INPIT

公开(公告)号：JP2007173825A

公开(公告)日：2007-07-05

申请号：JP2006343466

申请日：2006-12-20

Applicant: Internatl Business Mach Corp ,  インターナショナル・ビジネス・マシーンズ・コーポレーションInternational Business Maschines Corporation

Inventor： PRABJIT SINGH ,  SCHMIDT ROGER R ,  JAIRO D PACHECO

IPC: H01L23/36 ,  H05K7/20

CPC classification number: H01L23/3733 ,  F28F13/00 ,  F28F2013/006 ,  H01L23/42 ,  H01L2924/0002 ,  Y10T428/12438 ,  H01L2924/00

Abstract: PROBLEM TO BE SOLVED: To provide a method of providing an improved thermal interface and a device for the method. SOLUTION: The interface 130 is formed by applying a structure or foil embedded in a solid alloy to between the surfaces of two devices 110, 120. When heat is generated through an ordinary operation of a device or the like, the alloy in which the foil or structure is embedded melts to form a desired interface. Meanwhile, the structure and foil prevents the alloy from leaking and oozing to surrounding areas. COPYRIGHT: (C)2007,JPO&INPIT

Abstract translation: 要解决的问题：提供一种提供改进的热界面的方法和该方法的装置。 解决方案：通过将嵌入固体合金中的结构或箔施加到两个装置110,120的表面之间来形成界面130.当通过装置等的普通操作产生热量时， 箔或结构被嵌入熔化以形成期望的界面。 同时，结构和箔片防止合金泄漏和渗出到周围区域。 版权所有（C）2007，JPO＆INPIT

公开(公告)号：JP2006019730A

公开(公告)日：2006-01-19

申请号：JP2005184662

申请日：2005-06-24

Applicant: Internatl Business Mach Corp ,  インターナショナル・ビジネス・マシーンズ・コーポレーションInternational Business Maschines Corporation

Inventor： BEZAMA RASCHID J ,  COLGAN EVAN GEORGE ,  MAGERLEIN JOHN H ,  SCHMIDT ROGER R

IPC: H01L23/473

CPC classification number: F28F3/04 ,  F28F3/12 ,  F28F2260/02 ,  H01L23/473 ,  H01L2924/0002 ,  H01L2924/00

Abstract: PROBLEM TO BE SOLVED: To provide an apparatus and a method of cooling an electronic device such as an IC chip or the like uneven in power density distribution, mounted on a package substrate upside down with efficiency and low operating pressure. SOLUTION: The invention comprises the apparatus and the method operated by microchannel cooling which locally improve cooling capability with respect to a (hot spot) region of the IC chip higher than an average in power density by operating a mechanism varying local cooling capability with respect to a high power density region (namely, "hot spot") of a semiconductor chip higher than the average in the power density. For example, an integrally formed microchannel cooling device (or a microchannel heat sink device) cooling the IC chip is designed so that the local cooling capability with respect to the high power density region (namely, "hot spot") of the IC chip higher than the average in the power density can vary in such a way that a cooling fluid flows and distributed uniformly, and that a pressure drop along a cooling liquid passage is suppressed to a minimum. COPYRIGHT: (C)2006,JPO&NCIPI

Abstract translation: 要解决的问题：提供一种以功率密度分布不​​均匀的电子器件如IC芯片等的冷却装置和方法，其以效率和低的操作压力上下颠倒地安装在封装衬底上。 解决方案：本发明包括通过微通道冷却操作的装置和方法，其通过操作改变局部冷却能力的机构来局部地提高相对于IC芯片的（热点）区域的功率密度的平均值的冷却能力 相对于高于功率密度的平均值的半导体芯片的高功率密度区域（即，“热点”）。 例如，设计冷却IC芯片的整体形成的微通道冷却装置（或微通道散热装置），使得相对于IC芯片的高功率密度区域（即，“热点”）的局部冷却能力更高 功率密度的平均值可以以冷却流体均匀流动并分布的方式变化，并且沿着冷却液通道的压降被抑制到最小。 版权所有（C）2006，JPO＆NCIPI

公开(公告)号：JP2005167248A

公开(公告)日：2005-06-23

申请号：JP2004347678

申请日：2004-11-30

Applicant: Internatl Business Mach Corp ,  インターナショナル・ビジネス・マシーンズ・コーポレーションInternational Business Maschines Corporation

Inventor： RICHARD C CHUU ,  ELLSWORTH JR MICHAEL J ,  SCHMIDT ROGER R ,  SIMONS ROBERT E ,  ZOODSMA RANDY J

IPC: G06F1/20 ,  H01L23/473 ,  H05K7/20

CPC classification number: H05K7/2079

Abstract: PROBLEM TO BE SOLVED: To provide a liquid cooling system using a plurality of coolant temperature controlling units (CCUs) such that a function is not stopped because of the trouble of a heat exchanger, a control valve, the loss of a cooling water source or the like. SOLUTION: Each CCU 310 of a plurality of the coolant temperature controlling units (CCU) out of a plurality of electronic racks that should be cooled is coupled to one electronics rack 330 that is different and incidental to, and is provided with the heat exchanger, first cooling loops provided with the control valve and second cooling loops 315, 316. The first cooling loops receive an objective cooling facility coolant from the source, and at least a part of the coolant is allowed to pass through the heat exchanger through the control valve. The second cooling loops 315, 316 supply an objective system coolant to the incidental electronics rack 330, and in the heat exchanger, the heat is diffused in the objective cooling facility coolant in the first cooling loops from the electronics rack 330. COPYRIGHT: (C)2005,JPO&NCIPI

Abstract translation: 要解决的问题：为了提供一种使用多个冷却剂温度控制单元（CCU）的液体冷却系统，使得由于热交换器，控制阀的故障，功能不会停止，冷却的损失 水源等。 解决方案：应当冷却的多个电子机架中的多个冷却剂温度控制单元（CCU）的每个CCU 310被耦合到一个电子机架330，该电子机架330不同于并附带并提供有 热交换器，设置有控制阀和第二冷却回路315,316的第一冷却回路。第一冷却回路从源接收目标冷却设备冷却剂，并且允许至少一部分冷却剂通过热交换器通过 控制阀。 第二冷却回路315,316将物理系统冷却剂提供给附带的电子机架330，并且在热交换器中，热量在目标冷却设备中从电子机架330扩散到第一冷却回路中的冷却剂中。 （C）2005，JPO＆NCIPI

公开(公告)号：DE60323668D1

公开(公告)日：2008-10-30

申请号：DE60323668

申请日：2003-10-10

Applicant: IBM

Inventor： CHU RICHARD C ,  ELLSWORTH MICHAEL J ,  FUREY EDWARD ,  SCHMIDT ROGER R ,  SIMONS ROBERT E

IPC: H05K7/20

Abstract: An enclosure apparatus provides for combined air and liquid cooling of rack mounted stacked electronic components. A heat exchanger is mounted on the side of the stacked electronics and air flows side to side within the enclosure, impelled by air-moving devices mounted behind the electronics. Auxiliary air-moving devices may be mounted within the enclosure to increase the air flow. In an alternative embodiment, air-to-liquid heat exchangers are provided across the front and back of the enclosure, and a closed air flow loop is created by a converging supply plenum, electronics drawers through which air is directed by air-moving devices, diverging return plenum, and a connecting duct in the bottom. In a variant of this embodiment, connecting ducts are in both top and bottom, and supply and return ducts are doubly convergent and doubly divergent, respectively. Auxiliary blowers may be added to increase total system air flow. The enclosure also may be provided with automatically opening vent panels to allow room air to circulate and cool in the event of an over-temperature condition. The design of the enclosure permits it to be constructed apart from the rack-mounted apparatus and subsequently attached to the rack, if desired, at the facility at which the rack had been previously operating.

公开(公告)号：JP2009278089A

公开(公告)日：2009-11-26

申请号：JP2009113560

申请日：2009-05-08

Applicant: Internatl Business Mach Corp ,  インターナショナル・ビジネス・マシーンズ・コーポレーションInternational Business Maschines Corporation

Inventor： COLGAN EVAN GEORGE ,  MAGERLEN JOHN HAROLD ,  SCHMIDT ROGER R ,  GAYNES MICHAEL ANTHONY ,  MARSTON KENNETH CHARLES ,  HILTON T TOY

IPC: H01L23/473 ,  H01L25/04 ,  H01L25/18

CPC classification number: H01L23/473 ,  F28F3/086 ,  F28F3/12 ,  F28F2260/02 ,  H01L2224/16 ,  H01L2224/73253 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/00

Abstract: PROBLEM TO BE SOLVED: To provide a multi-chip module having a liquid-cooling module which provides a thermal conductive path having a different thermal resistance for each chip, and minimizes a stress at a thermally conductive adhesive portion by heat in order to dissipate effectively heat from the plurality of chips having cooling requirements different from each other, and to provide a method for manufacturing the same. SOLUTION: An electronic apparatus is thermally conductively connected to a first chip 12 and a second chip 13, and includes a cooling liquid inlet, a cooling liquid outlet, and a cooling module 20 having a cooling liquid flow path extending from the cooling liquid inlet to the cooling liquid outlet. The first chip is thermally conductively connected to a first portion to be cooled by a cooling liquid flowing in the cooling liquid flow path in the cooling module, and the second chip is thermally conductively connected to a second portion to be cooled by the cooling liquid being warmed as a result of cooling the first chip and flowing in the cooling liquid flow path in the cooling module. COPYRIGHT: (C)2010,JPO&INPIT

Abstract translation: 要解决的问题：提供一种具有液体冷却模块的多芯片模块，其为每个芯片提供具有不同热阻的导热路径，并且通过热量按顺序将热导电粘合剂部分处的应力最小化 有效地散热来自具有彼此不同的冷却要求的多个芯片的热量，并提供其制造方法。 解决方案：电子设备与第一芯片12和第二芯片13导热连接，并包括冷却液入口，冷却液出口和冷却模块20，冷却模块20具有从冷却 冷却液出口的液体入口。 第一芯片与通过在冷却模块中的冷却液流路中流动的冷却液冷却的第一部分导热连接，第二芯片与第二部分导热连接，第二部分被冷却液冷却 由于冷却第一芯片并在冷却模块中的冷却液流动路径中流动而加热。 版权所有（C）2010，JPO＆INPIT

公开(公告)号：JP2009123212A

公开(公告)日：2009-06-04

申请号：JP2008290523

申请日：2008-11-13

Applicant: Internatl Business Mach Corp ,  インターナショナル・ビジネス・マシーンズ・コーポレーションInternational Business Maschines Corporation

Inventor： SCHMIDT ROGER R ,  HOWARD P WELZ ,  MADHUSUDAN K IYENGAR

IPC: G06F1/20 ,  H05K7/18 ,  H05K7/20

CPC classification number: H05K7/2079 ,  H05K7/20781 ,  Y10T24/1412

Abstract: PROBLEM TO BE SOLVED: To process a large amount of thermal loads generated from a plurality of electronics racks housed in a data center or the like. SOLUTION: An apparatus for facilitating cooling of an electronics rack is provided. The apparatus includes an air-to-liquid heat exchanger and system coolant inlet and outlet plenums mounted to a door of an electronics rack. The system coolant inlet and outlet plenums are in fluid communication with the heat exchanger and respectively include a coolant inlet and coolant outlet in the top portions thereof. System coolant supply and return hoses are disposed above the electronics rack and respectively couple in fluid communication the inlet plenum to a system coolant supply header and the outlet plenum to a system coolant return header. The hoses are each flexible, partially looped and of sufficient length to allow for opening and closing of the door. Stress-relief structures are coupled to at least one end of the hoses to relieve stress on the ends of the hoses during opening or closing of the door. COPYRIGHT: (C)2009,JPO&INPIT

Abstract translation: 要解决的问题：处理从容纳在数据中心等中的多个电子机架产生的大量热负荷。 提供一种用于促进电子机架的冷却的装置。 该装置包括安装到电子机架的门的空气 - 液体热交换器和系统冷却剂入口和出口增压室。 系统冷却剂入口和出口增压室与热交换器流体连通，并且在其顶部分别包括冷却剂入口和冷却剂出口。 系统冷却剂供应和返回软管设置在电子机架的上方，并分别将进气室与系统冷却剂供应集管和出口增压室流体连通地连接到系统冷却剂返回集管。 软管各自是柔性的，部分环形的并且具有足够的长度以允许门的打开和关闭。 应力消除结构联接到软管的至少一端，以在门的打开或关闭期间减轻软管的端部上的应力。 版权所有（C）2009，JPO＆INPIT