公开(公告)号：JP2000340712A

公开(公告)日：2000-12-08

申请号：JP2000109574

申请日：2000-04-11

Applicant: IBM

Inventor： INTERRANTE MARIO J ,  RAYMOND ALAN JACKSON ,  SUDEIPUTA KUMAA RAY ,  PAUL A ZUKKO ,  SCOTT R DWYER

IPC: H01L23/12 ,  H01L23/498 ,  H01L23/50 ,  H05K3/34

Abstract: PROBLEM TO BE SOLVED: To mechanically stabilize column grid wires on a substrate by coating column grid array wires with a polymer of low glass-transition temperature on a substrate, after their mounting. SOLUTION: A standard ceramic wire column grid array, which is to be mounted on a substrate is used to which a thin polymer coating 50 is added, in such a way as to cover fillets of a wire column 32. The polymer 50, having proper coating and temperature characteristics, is applicable to distributed or spin coating in order to obtain a thin conformed coating on fillets of the wire column 32. The substrate 30 is generally made of ceramic, but an organic substrate or a silicon substrate may be used, if satisfactory adhesion of the polymer can be made. The glass transition temperature of the polymer 50, at which the polymer softens, is lower than the melting point of a lead/tin alloy used to form the wire column 32. The polymer 50 adheres to the ceramic substrate 30 and to the lower side of a metal pad 34, and causes the wire column 32 to adhere to the surface of the lead/tin alloy solder.