公开(公告)号：GB2581684A

公开(公告)日：2020-08-26

申请号：GB202006247

申请日：2018-09-28

Applicant: IBM

Inventor： SEIJI MUNETOH ,  CHITRA SUBRAMANIAN ,  AKIHIRO HORIBE ,  KUNIAKI SUEOKA ,  YASUTERU KOHDA

IPC: H01L21/66

Abstract: A chip intermediate body includes a semiconductor region including plural chip areas. The chip areas respectively are cut out as semiconductor chips. A cut region is provided along edges of the chip areas, the cut region being cut to cut out the semiconductor chips. A contact region is provided opposite to the chip areas across the cut region, the contact region being configured to be contacted by a probe of a test unit to test the chip areas, and electric wiring is provided continuously with the cut region to connect the chip areas and the contact region.