公开(公告)号：GB2578413B

公开(公告)日：2020-08-19

申请号：GB202002809

申请日：2018-07-26

Applicant: IBM

Inventor： AKIHIRO HORIBE ,  TAKAHITO WATANABE ,  KUNIAKI SUEOKA

IPC: H01M10/0585 ,  H01M2/20 ,  H01M10/04 ,  H01M10/0562

Abstract: A technique relating to a battery structure is disclosed. A base substrate and a battery layer having a support substrate are prepared. The battery layer includes a protection layer formed on the support substrate, a film battery element formed on the protection layer and an insulator covering the film battery element. The battery layer is placed onto the base substrate with the bottom of the support substrate facing up. The support substrate is then removed from the battery layer at least in part by etching while protecting the film battery element by the protection layer. A stacked battery structure including the base substrate and the two or more battery layers is also disclosed.

公开(公告)号：GB2581684A

公开(公告)日：2020-08-26

申请号：GB202006247

申请日：2018-09-28

Applicant: IBM

Inventor： SEIJI MUNETOH ,  CHITRA SUBRAMANIAN ,  AKIHIRO HORIBE ,  KUNIAKI SUEOKA ,  YASUTERU KOHDA

IPC: H01L21/66

Abstract: A chip intermediate body includes a semiconductor region including plural chip areas. The chip areas respectively are cut out as semiconductor chips. A cut region is provided along edges of the chip areas, the cut region being cut to cut out the semiconductor chips. A contact region is provided opposite to the chip areas across the cut region, the contact region being configured to be contacted by a probe of a test unit to test the chip areas, and electric wiring is provided continuously with the cut region to connect the chip areas and the contact region.

公开(公告)号：GB2578413A

公开(公告)日：2020-05-06

申请号：GB202002809

申请日：2018-07-26

Applicant: IBM

Inventor： AKIHIRO HORIBE ,  TAKAHITO WATANABE ,  KUNIAKI SUEOKA

IPC: H01M10/0585 ,  H01M2/20 ,  H01M10/04 ,  H01M10/0562

Abstract: A technique relating to a battery structure is disclosed. A base substrate and a battery layer having a support substrate are prepared. The battery layer includes a protection layer formed on the support substrate, a film battery element formed on the protection layer and an insulator covering the film battery element. The battery layer is placed onto the base substrate with the bottom of the support substrate facing up. The support substrate is then removed from the battery layer at least in part by etching while protecting the film battery element by the protection layer. A stacked battery structure including the base substrate and the two or more battery layers is also disclosed.