公开(公告)号：HK1055470A1

公开(公告)日：2004-01-09

申请号：HK03107753

申请日：2003-10-28

Applicant: IBM

Inventor： CHAN BENSON ,  HALL RICHARD ,  LIN HOW TZU ,  SHERMAN JOHN

IPC: G02B6/24 ,  G02B6/42 ,  G02B

Abstract: Optical packages and a method of fabricating same, wherein an active optical device can be located relative to a substrate and coupler. The structure includes a substrate having electrical contact pads and alignment pads with precision aligned through-holes for at least one optical fiber. The optical fibers are supported by a housing, or coupler, having alignment pins that are precision located relative to the through-holes in the substrate and the optical fiber. A die, or active optical device, with one or more active optical elements on a first die surface and electrical contacts on a second die surface, is aligned with the electrical pads of the substrate and the active optical elements. The method incorporates the steps of grinding alignment pins into metallic pads and grinding optical fibers in one pass and then aligning the active optical device and the optical fibers by using the surface tension of conductive adhesive liquid. The fibers are then bonded.

公开(公告)号：AU5861001A

公开(公告)日：2001-12-03

申请号：AU5861001

申请日：2001-05-23

Applicant: IBM

Inventor： HALL RICHARD ,  LIN HOW TZU ,  SHERMAN JOHN

IPC: G02B6/24 ,  G02B6/42

Abstract: Optical packages and a method of fabricating same, wherein an active optical device can be located relative to a substrate and coupler. The structure includes a substrate having electrical contact pads and alignment pads with precision aligned through-holes for at least one optical fiber. The optical fibers are supported by a housing, or coupler, having alignment pins that are precision located relative to the through-holes in the substrate and the optical fiber. A die, or active optical device, with one or more active optical elements on a first die surface and electrical contacts on a second die surface, is aligned with the electrical pads of the substrate and the active optical elements. The method incorporates the steps of grinding alignment pins into metallic pads and grinding optical fibers in one pass and then aligning the active optical device and the optical fibers by using the surface tension of conductive adhesive liquid. The fibers are then bonded.

公开(公告)号：AT535832T

公开(公告)日：2011-12-15

申请号：AT01931923

申请日：2001-05-23

Applicant: IBM

Inventor： CHAN BENSON ,  HALL RICHARD ,  LIN HOW ,  SHERMAN JOHN

IPC: G02B6/24 ,  G02B6/42

Abstract: Optical packages and a method of fabricating same, wherein an active optical device can be located relative to a substrate and coupler. The structure includes a substrate having electrical contact pads and alignment pads with precision aligned through-holes for at least one optical fiber. The optical fibers are supported by a housing, or coupler, having alignment pins that are precision located relative to the through-holes in the substrate and the optical fiber. A die, or active optical device, with one or more active optical elements on a first die surface and electrical contacts on a second die surface, is aligned with the electrical pads of the substrate and the active optical elements. The method incorporates the steps of grinding alignment pins into metallic pads and grinding optical fibers in one pass and then aligning the active optical device and the optical fibers by using the surface tension of conductive adhesive liquid. The fibers are then bonded.