公开(公告)号：JP2001242358A

公开(公告)日：2001-09-07

申请号：JP2001000074

申请日：2001-01-04

Applicant: IBM

Inventor： CHAN BENSON ,  COHEN MITCHELL S ,  FORTIER PAUL F ,  FREITAG LADD W ,  HALL RICHARD R ,  JOHNSON GLEN W ,  LIN HOW TZU ,  SHERMAN JOHN H

IPC: G02B6/44 ,  G02B6/38 ,  G02B6/42 ,  H01L31/0232 ,  H01S5/022 ,  H01S5/183 ,  H05K1/18

Abstract: PROBLEM TO BE SOLVED: To provide an improved assembly for joining between a horizontal optical fiber cable and a vertical optoelectronic die. SOLUTION: A package is provided in which an optical fiber cable of 12-channel width is joined to a 12-channel vertical resonator type surface emitting laser(VCSEL) transmitter and a multi-channel perpendicularly aligned integrated die(PAID) receiver. According to this package, the height of an assembly package may be lowered by vertically facing a certain die that is parallel to the optical fiber cable and by horizontally facing a certain other die. In this assembly, a vertical optoelectronic die may be vertically connected to a horizontal laminate through a flexible circuit.

公开(公告)号：JP2005055885A

公开(公告)日：2005-03-03

申请号：JP2004213302

申请日：2004-07-21

Applicant: Internatl Business Mach Corp ,  インターナショナル・ビジネス・マシーンズ・コーポレーションInternational Business Maschines Corporation

Inventor： ALAN F BENER ,  EVAN G COLGAN ,  LIN HOW TZU ,  MAGERLEIN JOHN H ,  FRANK L PONPEO ,  SHINDE SUBHASH L ,  STIGLIANI DANIEL J JR

IPC: G02B6/36 ,  G02B6/42 ,  G06F1/20 ,  G06F3/00

CPC classification number: G02B6/4201 ,  G02B6/4246 ,  G02B6/4249 ,  G02B6/4268 ,  G02B6/4281 ,  G02B6/4283 ,  G02B6/4292

Abstract: PROBLEM TO BE SOLVED: To provide an optoelectronic assembly for a computer system with respect to a mounting structure to establish optoelectronic communication between an electronic chip on a first level package and a high-density light transmitter-receiver. SOLUTION: The optoelectronic assembly includes an electronic chip 110, a substrate 120, an electric signaling medium 140, an optoelectronic transducer 160, and an optical coupling guide 170. The electronic chip is in communication with the substrate, which is in communication with a first end of the electric signaling medium. A second end of the electric signaling medium is in communication with the optoelectronic transducer. The optical coupling guide positions an optical signaling medium with respect to the optoelectronic transducer. An electric signal from the electronic chip is transmitted to the optoelectronic transducer via the substrate and the electric signaling medium. The electronic chip and the optoelectronic transducer share a common heat spreader. COPYRIGHT: (C)2005,JPO&NCIPI

Abstract translation: 要解决的问题：为相对于安装结构提供用于计算机系统的光电组件，以建立第一级封装上的电子芯片与高密度光收发器之间的光电连通。 解决方案：光电组件包括电子芯片110，基板120，电信号介质140，光电转换器160和光耦合引导件170.电子芯片与正在通信的基板连通 具有电信号介质的第一端。 电信号介质的第二端与光电转换器连通。 光耦合引导件相对于光电传感器定位光信号介质。 来自电子芯片的电信号通过基板和电信号介质传输到光电换能器。 电子芯片和光电传感器共享共用散热器。 版权所有（C）2005，JPO＆NCIPI

公开(公告)号：DE10065034B4

公开(公告)日：2006-01-19

申请号：DE10065034

申请日：2000-12-23

Applicant: IBM

Inventor： CHAN BENSON ,  COHEN MITCHELL S ,  FORTIER PAUL F ,  FREITAG LADD W ,  HALL RICHARD R ,  JOHNSON GLEN W ,  LIN HOW TZU ,  SHERMAN JOHN H

IPC: G02B6/44 ,  G02B6/38 ,  G02B6/42 ,  G02B6/43 ,  H01L31/0232 ,  H01S5/022 ,  H01S5/183 ,  H05K1/18

Abstract: A package is described that couples a twelve channel wide fiber optic cable to a twelve channel Vertical Cavity Surface Emitting Laser (VCSEL) transmitter and a multiple channel Perpendicularly Aligned Integrated Die (PAID) receiver. The package allows for reduction in the height of the assembly package by vertically orienting certain dies parallel to the fiber optic cable and horizontally orienting certain other dies. The assembly allows the vertically oriented optoelectronic dies to be perpendicularly attached to the horizontally oriented laminate via a flexible circuit.

公开(公告)号：DE10065034A1

公开(公告)日：2001-08-09

申请号：DE10065034

申请日：2000-12-23

Applicant: IBM

Inventor： CHAN BENSON ,  COHEN MITCHELL S ,  FORTIER PAUL F ,  FREITAG LADD W ,  HALL RICHARD R ,  JOHNSON GLEN W ,  LIN HOW TZU ,  SHERMAN JOHN H

IPC: G02B6/44 ,  G02B6/38 ,  G02B6/42 ,  H01L31/0232 ,  H01S5/022 ,  H01S5/183 ,  H05K1/18 ,  G02B6/26

Abstract: The module is operatively connected to a host card, and includes a laminate for carrying optoelectronic components, an amplifier chip and a flexible circuit for receiving the amplified electrical signals from the amplifier chip. An optoelectronic chip is electrically connected to the flexible circuit and receives the amplified electrical signals generated by the amplifier chip, and produces optical signals in response. Independent claims are included for an optoelectronic sub-module, a compact module article, a transmitting optoelectric sub-module, an electronic compact sub-module, and a method of coupling a fibre-optical cable to a converter chip.

公开(公告)号：HK1055470A1

公开(公告)日：2004-01-09

申请号：HK03107753

申请日：2003-10-28

Applicant: IBM

Inventor： CHAN BENSON ,  HALL RICHARD ,  LIN HOW TZU ,  SHERMAN JOHN

IPC: G02B6/24 ,  G02B6/42 ,  G02B

Abstract: Optical packages and a method of fabricating same, wherein an active optical device can be located relative to a substrate and coupler. The structure includes a substrate having electrical contact pads and alignment pads with precision aligned through-holes for at least one optical fiber. The optical fibers are supported by a housing, or coupler, having alignment pins that are precision located relative to the through-holes in the substrate and the optical fiber. A die, or active optical device, with one or more active optical elements on a first die surface and electrical contacts on a second die surface, is aligned with the electrical pads of the substrate and the active optical elements. The method incorporates the steps of grinding alignment pins into metallic pads and grinding optical fibers in one pass and then aligning the active optical device and the optical fibers by using the surface tension of conductive adhesive liquid. The fibers are then bonded.

公开(公告)号：AU5861001A

公开(公告)日：2001-12-03

申请号：AU5861001

申请日：2001-05-23

Applicant: IBM

Inventor： HALL RICHARD ,  LIN HOW TZU ,  SHERMAN JOHN

IPC: G02B6/24 ,  G02B6/42

Abstract: Optical packages and a method of fabricating same, wherein an active optical device can be located relative to a substrate and coupler. The structure includes a substrate having electrical contact pads and alignment pads with precision aligned through-holes for at least one optical fiber. The optical fibers are supported by a housing, or coupler, having alignment pins that are precision located relative to the through-holes in the substrate and the optical fiber. A die, or active optical device, with one or more active optical elements on a first die surface and electrical contacts on a second die surface, is aligned with the electrical pads of the substrate and the active optical elements. The method incorporates the steps of grinding alignment pins into metallic pads and grinding optical fibers in one pass and then aligning the active optical device and the optical fibers by using the surface tension of conductive adhesive liquid. The fibers are then bonded.