公开(公告)号：JP2004119371A

公开(公告)日：2004-04-15

申请号：JP2003305398

申请日：2003-08-28

Applicant: Internatl Business Mach Corp ,  インターナショナル・ビジネス・マシーンズ・コーポレーションInternational Business Maschines Corporation

Inventor： BRODSKY WILLIAM L ,  BUCHLER JR WILLIAM ,  CHAN BENSON

IPC: H01R33/76 ,  H01L23/32 ,  H01R12/04 ,  H01R13/514 ,  H05K3/32 ,  H05K7/10

CPC classification number: H05K7/1061 ,  H05K3/325 ,  H05K2201/09972 ,  H05K2201/10378 ,  H05K2201/10719

Abstract: PROBLEM TO BE SOLVED: To provide a land grid array (LGA) connector maximizing the quantity of I/O contacts, and to provide its forming method.
SOLUTION: Each LGA section includes at least one set of fingers. Each finger set forms this LGA connector by being connected with a finger set of another section. By forming the LGA connector by this method, the maximum quantity of input/output (I/O) contacts can be provided. Typically, the LGA connector is formed with a plurality (for instance, four) of the individual sections. Each section usually has at least one set (for instance, two sets) of fingers disposed along its outer edge part. Each set of fingers located at a specific section forms the LGA connector by being connected with the finger set of an adjacent different section.
COPYRIGHT: (C)2004,JPO

公开(公告)号：JP2005004214A

公开(公告)日：2005-01-06

申请号：JP2004172726

申请日：2004-06-10

Applicant: Internatl Business Mach Corp ,  インターナショナル・ビジネス・マシーンズ・コーポレーションInternational Business Maschines Corporation

Inventor： CHAN BENSON ,  FORTIER PAUL FRANCIS ,  FRANCOIS M GINDON ,  JOHNSON GLEN WALDEN ,  MARSHALL A RUTOONEOO ,  SHERMAN JOHN H ,  REALE TETORAATO

IPC: H01L21/56 ,  B29C45/14 ,  G02B6/42 ,  H01L23/28

CPC classification number: B29C45/14655 ,  B29C45/14065 ,  G02B6/4201 ,  G02B6/421 ,  G02B6/423 ,  G02B6/4231 ,  G02B6/4239 ,  G02B6/4255 ,  G02B6/4277 ,  G02B6/4281 ,  G02B6/4283 ,  G02B6/4292

Abstract: PROBLEM TO BE SOLVED: To precisely align a laminated substrate and other substrates on a mold base.
SOLUTION: An alignment system has overmolded chip carriers and precisely aligns the substrate within a mold. Cooperating standoff pads on an overmold frame and on a retainer assembly provide a precise gap to receive an adhesive. The retainer assembly carries optoelectronic components, including a flexible circuit, and a tip portion of the flexible circuit and a wall of a receiving cavity within the overmold frame have a cooperating feature, to precisely register a distal electrical lead of the flexible circuit with an array of an electrical pad on the board. A permanent shroud at an approximate end portion of the flexible circuit protects and helps to register approximate electrical leads with the electrical pad on optic dye and on these carriers.
COPYRIGHT: (C)2005,JPO&NCIPI

Abstract translation: 要解决的问题：将层压基板和其他基板精确对准在模具基座上。 解决方案：对准系统包覆成型芯片载体并精确地将基板对准模具内。 包覆模制框架和保持器组件上的配合支座提供精确的间隙以接收粘合剂。 保持器组件携带光电子部件，包括柔性电路，柔性电路的尖端部分和覆盖模制框架内的接收腔的壁具有配合特征，以精确地将柔性电路的远端电引线与阵列 的板上的电垫。 在柔性电路的大致端部处的永久性护罩保护并有助于将近似的电引线与光学染料上的电焊盘和这些载体对准。 版权所有（C）2005，JPO＆NCIPI

公开(公告)号：JP2002026441A

公开(公告)日：2002-01-25

申请号：JP2001137713

申请日：2001-05-08

Applicant: IBM

Inventor： CHAN BENSON ,  FORTIER PAUL FRANCIS ,  FREITAG LADD WILLIAM ,  GARY T GARY ,  FRANCOIS M GINDON ,  JOHNSON GLEN WALDEN ,  MARSHALL A RUTOONEOO ,  SHERMAN JOHN H ,  REALE TETORAATO

IPC: H01S5/024 ,  G02B6/42 ,  H01L23/373

Abstract: PROBLEM TO BE SOLVED: To provide an optoelectronic module having a miniaturized package size by improving the heat removal from optoelectronic chips and eliminating the crosstalk between the chips by means of a simplified structure, and then, using a simple and sure assembling method. SOLUTION: A heat sink for the transceiver optoelectronic module contains a double direct heat route, a structure surrounding many chips, and a central web which electrically separates a transmitter chip and a receiver chip from each other. A retainer used for an optical coupler has a port into which an epoxy is injected. On the over-molded base of the optoelectronic module, an epoxy flow managing member is formed. The assembling method of the optoelectronic module includes gap setting and a modified TAB bonding process.

公开(公告)号：JP2002043342A

公开(公告)日：2002-02-08

申请号：JP2001137796

申请日：2001-05-08

Applicant: IBM

Inventor： CHAN BENSON ,  FORTIER PAUL FRANCIS ,  FRANCOIS M GINDON ,  JOHNSON GLEN WALDEN ,  MARSHALL A RUTOONEOO ,  SHERMAN JOHN H ,  REALE TETORAATO

IPC: H01L21/56 ,  B29C45/14 ,  G02B6/42 ,  H01L23/28

Abstract: PROBLEM TO BE SOLVED: To provide a method by which positioning of a laminate substrate or other substrates on a mold base is improved. SOLUTION: This alignment system of a photoelectric module has an overmolded chip carrier 26 and positions a substrate in a mold precisely to form an overmold frame 18 on the substrate. Co-operating stand-off pads 70, 71, 72 in a retainer assembly on the overmold frame stabilize an assembly of these components, and provide precise gaps to bond these two components permanently. The retainer assembly 36 has a co-operating feature for positioning an end electric lead of a flexible circuit in an electric pad array on the substrate. A nearby electric lead is protected by a permanent enclosing plate on a nearby edge portion of the flexible circuit and positioned by optic dies and an electric pad on their carriers.

公开(公告)号：JP2001242358A

公开(公告)日：2001-09-07

申请号：JP2001000074

申请日：2001-01-04

Applicant: IBM

Inventor： CHAN BENSON ,  COHEN MITCHELL S ,  FORTIER PAUL F ,  FREITAG LADD W ,  HALL RICHARD R ,  JOHNSON GLEN W ,  LIN HOW TZU ,  SHERMAN JOHN H

IPC: G02B6/44 ,  G02B6/38 ,  G02B6/42 ,  H01L31/0232 ,  H01S5/022 ,  H01S5/183 ,  H05K1/18

Abstract: PROBLEM TO BE SOLVED: To provide an improved assembly for joining between a horizontal optical fiber cable and a vertical optoelectronic die. SOLUTION: A package is provided in which an optical fiber cable of 12-channel width is joined to a 12-channel vertical resonator type surface emitting laser(VCSEL) transmitter and a multi-channel perpendicularly aligned integrated die(PAID) receiver. According to this package, the height of an assembly package may be lowered by vertically facing a certain die that is parallel to the optical fiber cable and by horizontally facing a certain other die. In this assembly, a vertical optoelectronic die may be vertically connected to a horizontal laminate through a flexible circuit.

公开(公告)号：GB2402100B

公开(公告)日：2005-01-19

申请号：GB0417609

申请日：2001-05-03

Applicant: IBM

Inventor： CHAN BENSON ,  FORTIER PAUL F ,  GUINDON FRANCOIS M ,  JOHNSON GLEN W ,  LETOURNEAU MARTIAL A ,  SHERMAN JOHN H ,  TETREAULT REAL

IPC: B29C45/14 ,  G02B6/42 ,  H01L23/31 ,  H01L25/16 ,  H05K7/02 ,  H05K13/00

公开(公告)号：AT535832T

公开(公告)日：2011-12-15

申请号：AT01931923

申请日：2001-05-23

Applicant: IBM

Inventor： CHAN BENSON ,  HALL RICHARD ,  LIN HOW ,  SHERMAN JOHN

IPC: G02B6/24 ,  G02B6/42

Abstract: Optical packages and a method of fabricating same, wherein an active optical device can be located relative to a substrate and coupler. The structure includes a substrate having electrical contact pads and alignment pads with precision aligned through-holes for at least one optical fiber. The optical fibers are supported by a housing, or coupler, having alignment pins that are precision located relative to the through-holes in the substrate and the optical fiber. A die, or active optical device, with one or more active optical elements on a first die surface and electrical contacts on a second die surface, is aligned with the electrical pads of the substrate and the active optical elements. The method incorporates the steps of grinding alignment pins into metallic pads and grinding optical fibers in one pass and then aligning the active optical device and the optical fibers by using the surface tension of conductive adhesive liquid. The fibers are then bonded.

公开(公告)号：HK1055470A1

公开(公告)日：2004-01-09

申请号：HK03107753

申请日：2003-10-28

Applicant: IBM

Inventor： CHAN BENSON ,  HALL RICHARD ,  LIN HOW TZU ,  SHERMAN JOHN

IPC: G02B6/24 ,  G02B6/42 ,  G02B

Abstract: Optical packages and a method of fabricating same, wherein an active optical device can be located relative to a substrate and coupler. The structure includes a substrate having electrical contact pads and alignment pads with precision aligned through-holes for at least one optical fiber. The optical fibers are supported by a housing, or coupler, having alignment pins that are precision located relative to the through-holes in the substrate and the optical fiber. A die, or active optical device, with one or more active optical elements on a first die surface and electrical contacts on a second die surface, is aligned with the electrical pads of the substrate and the active optical elements. The method incorporates the steps of grinding alignment pins into metallic pads and grinding optical fibers in one pass and then aligning the active optical device and the optical fibers by using the surface tension of conductive adhesive liquid. The fibers are then bonded.

公开(公告)号：DE10065034B4

公开(公告)日：2006-01-19

申请号：DE10065034

申请日：2000-12-23

Applicant: IBM

Inventor： CHAN BENSON ,  COHEN MITCHELL S ,  FORTIER PAUL F ,  FREITAG LADD W ,  HALL RICHARD R ,  JOHNSON GLEN W ,  LIN HOW TZU ,  SHERMAN JOHN H

IPC: G02B6/44 ,  G02B6/38 ,  G02B6/42 ,  G02B6/43 ,  H01L31/0232 ,  H01S5/022 ,  H01S5/183 ,  H05K1/18

Abstract: A package is described that couples a twelve channel wide fiber optic cable to a twelve channel Vertical Cavity Surface Emitting Laser (VCSEL) transmitter and a multiple channel Perpendicularly Aligned Integrated Die (PAID) receiver. The package allows for reduction in the height of the assembly package by vertically orienting certain dies parallel to the fiber optic cable and horizontally orienting certain other dies. The assembly allows the vertically oriented optoelectronic dies to be perpendicularly attached to the horizontally oriented laminate via a flexible circuit.

公开(公告)号：GB2370012B

公开(公告)日：2004-11-03

申请号：GB0110833

申请日：2001-05-03

Applicant: IBM

Inventor： CHAN BENSON ,  FORTIER PAUL F ,  GUINDON FRANCOIS M ,  JOHNSON GLEN W ,  LETOURNEAU MARTIAL A ,  SHERMAN JOHN H ,  TETREAULT REAL

IPC: H01L21/56 ,  B29C45/14 ,  G02B6/42 ,  H01L23/28 ,  H01L23/31 ,  H01L25/16 ,  H05K7/02 ,  H05K13/00

Abstract: Alignment systems for optoelectronic modules with overmolded chip carriers include drilled or milled substrate corners for engaging dowel pins to precisely align the substrate in a mold for molding an overmold frame on the substrate. The overmold frame includes slot and trilobe holes for receiving retainer posts to precisely align a retainer assembly on the overmold frame. Cooperating standoff pads on the overmold frame and on the retainer assembly stabilize the assembly of these components and provide a precise gap for receiving an adhesive to permanently attach these two components. The retainer assembly carries optoelectronic components that include a flexible circuit, and a distal end portion of this flexible circuit and walls of a receiving cavity in the overmold frame have cooperating features for precisely aligning distal electrical leads of the flexible circuit with an array of electrical pads on the substrate. A permanent shroud on a proximate end portion of the flexible circuit protects and helps align proximate electrical leads with electrical pads on optic dies and their carriers.