公开(公告)号：DE3585437D1

公开(公告)日：1992-04-02

申请号：DE3585437

申请日：1985-12-13

Applicant: IBM

Inventor： GELORME JEFFREY DONALD ,  LAWRENCE WILLIAM HOWELL ,  SLOTA JR

IPC: C08J7/00 ,  C08J7/12 ,  C23C18/22 ,  H05K3/18 ,  H05K3/38 ,  H05K3/10

Abstract: The surface of a substrate is roughened by providing a substrate which comprises a resinous material and an inorganic particulate material; and etching a surface of the substrate to selectively etch the resinous material and thereby produce the roughened surface. The preferred etching process is a dry etching process.