1.
    发明专利
    未知

    公开(公告)号:DE3585437D1

    公开(公告)日:1992-04-02

    申请号:DE3585437

    申请日:1985-12-13

    Applicant: IBM

    Abstract: The surface of a substrate is roughened by providing a substrate which comprises a resinous material and an inorganic particulate material; and etching a surface of the substrate to selectively etch the resinous material and thereby produce the roughened surface. The preferred etching process is a dry etching process.

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