公开(公告)号：DE3576431D1

公开(公告)日：1990-04-12

申请号：DE3576431

申请日：1985-05-07

Applicant: IBM

Inventor： AMENDOLA ALBERT ,  SCHMECKENBECHER ARNOLD FRIEDRI ,  SOBON JOSEPH THOMAS

IPC: H05K3/46 ,  H01L21/48 ,  H05K1/03 ,  H05K1/09 ,  H05K1/11 ,  H05K3/06 ,  H05K3/10 ,  H05K3/14 ,  H05K3/38

Abstract: A process for forming a top surface metallurgy pattern on a green unsintered ceramic substrate (30) including the steps of forming indented lines (40) on the surface of the substrate, sintering the substrate, depositing a blanket layer (42) over the top surface of the substrate with a thickness less than the depth of the indented lines, applying a masking layer (46) over the metal layer, removing the masking layer over all portions except the indented lines, removing the exposed areas of the metal layer, and removing the remaining portions of the masking layer.