公开(公告)号：EP0097157A4

公开(公告)日：1985-03-08

申请号：EP82900586

申请日：1981-12-29

Applicant: IBM

Inventor： HASSAN JAVATHU K ,  OKTAY SEVGIN ,  PAIVANAS JOHN A ,  SPECTOR CLARENCE J

IPC: H01L23/36 ,  H01L23/373 ,  H01L23/433 ,  H01L23/02 ,  H01L23/12 ,  H01L25/04

CPC classification number: H01L23/3736 ,  H01L23/4338 ,  H01L2224/16 ,  H01L2224/73253

Abstract: A cooling means (18) for a circuit chip device (10) employs a noneutectic metal alloy (22) to form a low thermal resistance bridging interface between the surface of the chip device and a heat sink (18). The alloy has a solidus-liquidus temperature range such that the solidus is slightly below the maximum operating temperature of the chip, and thus has the capability to reestablish and maintain the interface at a low thermal resistance if stressed during circuit operation, even with a low contact load at the interface of the chip device and the heat sink. In addition to the chip interface, the above cooling means is also used at other interfacial regions of the heat sink, dependent on design, to achieve very low thermal resistance.

公开(公告)号：DE3176475D1

公开(公告)日：1987-11-05

申请号：DE3176475

申请日：1981-12-29

Applicant: IBM

Inventor： HASSAN JAVATHU K ,  OKTAY SEVGIN ,  PAIVANAS JOHN A ,  SPECTOR CLARENCE J

IPC: H01L23/36 ,  H01L23/373 ,  H01L23/433 ,  H01L23/02 ,  H01L23/12 ,  H01L25/04

Abstract: Semiconductor assembly comprises (a) a substrate(12); (b) a semiconductor chip(10) having one surface bonded to the substrate, (c) a heat transfer element closely adjacent the second surface of the chip; (d) a thin layer(22) of heat conductive noneutectic alloy at the interface between heat transfer element and chip, pref. an alloy contg. Bi; and pref. (e) a spring type piston providing a load force to the heat transfer element, increasing contact between element and chip. The assembly pref. also includes a hat(20) providing a cover for the assembly and diffusing heat. A thin layer(22) of conductive noneutectic alloy is pref. provided at the interface between heat transfer element and hat surface. A diagonal spring type piston(16) pref. provides a load force increasing contact between heat transfer element and hat and chip surfaces. The thermal resistance of the chip interface is pref. 0.1-0.2 deg.C./W and of the heat interface is pref. 0.01-0.02 deg.C./W, both for contact load of 100g. The alloy allows resistance loads 5-7 times less than those obtd. using thermal grease.