公开(公告)号：DE3063949D1

公开(公告)日：1983-08-04

申请号：DE3063949

申请日：1980-04-25

Applicant: IBM

Inventor： KRUMM HORST DR ,  SCHETTLER HELMUT ,  STAHL RAINER ,  ZUHLKE RAINER DR

IPC: H01L23/52 ,  H01L23/538 ,  H05K1/00 ,  H05K1/02 ,  H05K1/14

Abstract: Disclosed is a multi-layer module structure having a constant characteristic impedance. In each conductor line plane, two signal lines are arranged between a ground and a voltage supply line. This line sequence: ground/signal/signal/voltage supply line, is repeated several times in each conductor line plane. The spacing between the signal line and the adjacent ground and voltage supply line, respectively, is identical in each case. Adjacent conductor line planes, nth and (n+1)th have conductor lines arranged orthogonally. The lines of the nth and the (n+2)th plane are preferably staggered to each other such that when the nth plane is projected relative to the (n+2)th plane, the ground line of the (n+2)th plane is arranged in between the voltage supply lines (e.g. a voltage supply line and a ground line) of the nth plane.