公开(公告)号：JPH10270835A

公开(公告)日：1998-10-09

申请号：JP6967198

申请日：1998-03-19

Applicant: IBM

Inventor： GREGG JOSEPH ARUMETSUTSUAANI ,  ROBERT NICHOLAS IVES ,  PIERSON MARK V ,  TERRY ALAN TULL

IPC: H01L21/60 ,  H01L23/12 ,  H01L23/498 ,  H05K1/00 ,  H05K1/11 ,  H05K3/00 ,  H05K3/34

Abstract: PROBLEM TO BE SOLVED: To reduce deformation while using a mask reflow technology, by mounting a plurality of modules on a carrier by solder balls, which are on the first major surface of the flexible film carrier and are mutually connected to mutually connecting solder pads. SOLUTION: An electronic package includes a flexible film carrier 1 which has electronic circuits on the both major surfaces. The flexible film carrier 1 is made of a dielectric material, which may be thermoplastic resin or thermosetting organic resin. On a first major flat plate of the flexible film carrier 1, a plurality of interconnecting solder pads 8 are provided. Solder mask material 5 is arranged on the major surface of the flexible film crrier, and a solder mask layer 6 is arranged on a second major surface. A region without a solder mask 5 exists between the adjoining modules to be mounted later on the first major surface. Then, the module 2 having a solder ball 9 is mounted.