公开(公告)号：JPH10270835A

公开(公告)日：1998-10-09

申请号：JP6967198

申请日：1998-03-19

Applicant: IBM

Inventor： GREGG JOSEPH ARUMETSUTSUAANI ,  ROBERT NICHOLAS IVES ,  PIERSON MARK V ,  TERRY ALAN TULL

IPC: H01L21/60 ,  H01L23/12 ,  H01L23/498 ,  H05K1/00 ,  H05K1/11 ,  H05K3/00 ,  H05K3/34

Abstract: PROBLEM TO BE SOLVED: To reduce deformation while using a mask reflow technology, by mounting a plurality of modules on a carrier by solder balls, which are on the first major surface of the flexible film carrier and are mutually connected to mutually connecting solder pads. SOLUTION: An electronic package includes a flexible film carrier 1 which has electronic circuits on the both major surfaces. The flexible film carrier 1 is made of a dielectric material, which may be thermoplastic resin or thermosetting organic resin. On a first major flat plate of the flexible film carrier 1, a plurality of interconnecting solder pads 8 are provided. Solder mask material 5 is arranged on the major surface of the flexible film crrier, and a solder mask layer 6 is arranged on a second major surface. A region without a solder mask 5 exists between the adjoining modules to be mounted later on the first major surface. Then, the module 2 having a solder ball 9 is mounted.

公开(公告)号：JPH10224012A

公开(公告)日：1998-08-21

申请号：JP1529898

申请日：1998-01-28

Applicant: IBM

Inventor： MICHAEL AXIAL ,  HALL RICHARD R ,  ROBERT NICHOLAS IVES

IPC: H05K3/22 ,  H01L21/48 ,  H01L23/12 ,  H01L23/498 ,  H01L23/538 ,  H05K1/00 ,  H05K3/00 ,  H05K3/34

Abstract: PROBLEM TO BE SOLVED: To place a flexible substrate to a stiffener with a high stiffness and to avoid a deterioration due to a crack by allowing the pressure-sensitive adhesive surface of the stiffener to oppose the reverse side of a flexible substrate with a solder ball with a space, sending vacuum and fixing the positions of the flexible substrate and the stiffener, and pressurizing an area around the solder ball. SOLUTION: A flexible substrate 10' is formed at a flexible tape with a circuit and a solder ball and is subjected to vacuum support at a specific position. A stiffener 29 has a pressure-sensitive adhesive 30 on a surface that faces the substrate 10'. An auxiliary support body 31 has a compliant block consisting of silicon rubber so that a support force to be given becomes uniform. A ram 34 gives an upward force and moves the stiffener 29 in a form where it faces the surface of the substrate 10' being opposite to the surface with the solder ball, so that the pressure-sensitive adhesive 30 places the stiffener 29 on the substrate l0'. When the stiffener 29 is engaged to the substrate 10' due to the move of the ram 34, the force reaches approximately 2,000 pound per square inch in a certain amount of time.