公开(公告)号：JPH05205526A

公开(公告)日：1993-08-13

申请号：JP20784592

申请日：1992-08-04

Applicant: IBM

Inventor： JIEIMUZU RAPUTON HEDORITSUKU ,  DONARUDO KURIFUOODO HOUFUAA ,  JIEFURII UIRIAMU RABADEII ,  ROBAATO BURUUSU PURAIMU ,  TOMASU POORU RATSUSERU

IPC: C08J9/02 ,  C08J9/26 ,  H01B3/30

Abstract: PURPOSE: To provide a foaming polymer which is used as a dielectric material and whose hole diameter is smaller than 1000 Å, and a manufacturing method therefor. CONSTITUTION: This foaming polymer is manufactured by the following process; (a) to generate a copolymer of a matrix polymer and a thermally decomposable polymer thermally decomposed at a temperature lower a decomposing temperature of the matrix polymer and (b) to generate a foaming polymer by heating the colpolymer to a decomposing temperature of the thermally decomposable polymer or a temperature not less than it and a temperature lower than a decomposing temperature of the matrix polymer.