公开(公告)号：JPH05205526A

公开(公告)日：1993-08-13

申请号：JP20784592

申请日：1992-08-04

Applicant: IBM

Inventor： JIEIMUZU RAPUTON HEDORITSUKU ,  DONARUDO KURIFUOODO HOUFUAA ,  JIEFURII UIRIAMU RABADEII ,  ROBAATO BURUUSU PURAIMU ,  TOMASU POORU RATSUSERU

IPC: C08J9/02 ,  C08J9/26 ,  H01B3/30

Abstract: PURPOSE: To provide a foaming polymer which is used as a dielectric material and whose hole diameter is smaller than 1000 Å, and a manufacturing method therefor. CONSTITUTION: This foaming polymer is manufactured by the following process; (a) to generate a copolymer of a matrix polymer and a thermally decomposable polymer thermally decomposed at a temperature lower a decomposing temperature of the matrix polymer and (b) to generate a foaming polymer by heating the colpolymer to a decomposing temperature of the thermally decomposable polymer or a temperature not less than it and a temperature lower than a decomposing temperature of the matrix polymer.

公开(公告)号：JPH07233325A

公开(公告)日：1995-09-05

申请号：JP31944394

申请日：1994-11-30

Applicant: IBM

Inventor： MARII ANJIEROPOUROSU ,  JIEFURII DONARUDO JIEROOMU ,  JIEFURII UIRIAMU RABADEII ,  DEIBITSUDO ANDORUU RUISU ,  SARII AN SUWANSON ,  NANSHII KARORIN RABIANKA

IPC: G03F7/027 ,  C08G73/10 ,  C08L79/08 ,  G03F7/038

公开(公告)号：JPH03122124A

公开(公告)日：1991-05-24

申请号：JP22143890

申请日：1990-08-24

Applicant: IBM

Inventor： JIEIMUZU RAPUTON HEDORITSUKU J ,  DONARUDO KURIFUOODO HOUFUAA ,  JIEFURII UIRIAMU RABADEII ,  SARII AN SUUONSON ,  BUIRI FUORUKUZEN

IPC: C08G73/06 ,  C08G73/10

公开(公告)号：JPH0641305A

公开(公告)日：1994-02-15

申请号：JP27671092

申请日：1992-09-22

Applicant: IBM

Inventor： MARII ANJIEROPOUROSU ,  JIEFURII DONARUDO JIEROOMU ,  JIEFURII UIRIAMU RABADEII ,  DEIBITSUDO ANDORUU RUISU ,  SARII AN SUWANSON ,  NANSHII KARORIN RABIANKA

IPC: G03F7/027 ,  C08G73/10 ,  C08L79/08 ,  G03F7/038

公开(公告)号：JPH05197148A

公开(公告)日：1993-08-06

申请号：JP20638692

申请日：1992-08-03

Applicant: IBM

Inventor： JIEFURII UIRIAMU RABADEII ,  DENISU RICHIYAADO MATSUKIIN ,  UIRII FUORUKUSEN ,  GUREGORII MAIKERU UOORAFU

IPC: G03F7/004 ,  G03F7/038 ,  G03F7/039 ,  G03F7/38 ,  H01L21/027

Abstract: PURPOSE: To form a polylmide image on a substrate by incorporating a polyamic alkyl ester compsn. into a photosensitive negative or positive gradation compsn. CONSTITUTION: When a photosensitive negative gradation compsn. containing a polyamic alkylester and photosensitive base-producing agent is exposed, the photosensitive base-producing agent in the exposed area produces radical base. This acts as a catalyst to imidize the polyamic alkylester into insoluble partially imidized polyimide. When a photosensitive positive gradation compsn. containing polyamlc alkylester base or base precursor and a photosensitive acid-producing agent is exposed, the photosensitive acid producing agent in the positive gradation compsn. produces acid, which traps base in the exposed area of the film. By successively heating the positive gradation compsn. at low temp., partial imidization in the nonexposed area of the film is caused by the base catalyst. The positive gradation compsn. is developed by using a proper solvent.

公开(公告)号：JPH02235081A

公开(公告)日：1990-09-18

申请号：JP1513490

申请日：1990-01-26

Applicant: IBM

Inventor： JIEEMUZU EKONOMII ,  JIEEMUZU RAPUTON HEDORITSUKU J ,  JIEFURII UIRIAMU RABADEII

IPC: C08G65/48 ,  C08L71/00 ,  C08L71/10 ,  G03G15/20

Abstract: PURPOSE: To improve thermal stability by incorporating elastomer having a specified glass transition temp. and a specified structure as a matrix. CONSTITUTION: Elastomer having 80-180 deg.C glass transition temp. and a structure represented by formula I is incorporated as a matrix to obtain the objective hot roll fuser contg. elastomer for a fuser roll having high thermula stability. In the formula, Ar is an arom. cyclic structure, Y is O, S, C=O, SO2 , C(CH3 )2 , C(CF3 )2 , CH2 or (CF2 )n and X is a structure represented by formula II or III.