公开(公告)号：DE3787772D1

公开(公告)日：1993-11-18

申请号：DE3787772

申请日：1987-07-24

Applicant: IBM

Inventor： BRADY MICHAEL JOHN ,  KANG SUNG KWON ,  MOSKOWITZ PAUL ANDREW ,  RYAN JAMES GARDNER ,  REILEY TIMOTHY CLARK ,  WALTON ERICK GREGORY ,  BICKFORD HARRY RANDALL ,  PALMER MICHAEL JOHN

IPC: H01L21/60 ,  H01L23/485 ,  H01L23/48

公开(公告)号：DE69324959T2

公开(公告)日：1999-12-02

申请号：DE69324959

申请日：1993-03-29

Applicant: IBM

Inventor： BRADY MICHAEL JOHN ,  FARRELL CURTIS EDWARD ,  KANG SUNG KWON ,  MARINO JEFFREY ROBERT

IPC: H01L21/60 ,  C23C18/50 ,  C25D3/54 ,  H01L21/288 ,  H01L21/603 ,  H01L21/768 ,  H01L23/495 ,  H01L23/498 ,  H01L23/532 ,  H01L23/485

Abstract: Silicon and germanium containing materials are used at surface of conductors in electronic devices. Solder can be fluxlessly bonded and wires can be wire bonded to these surfaces. These material are used as a surface coating for lead frames for packaging integrated circuit chips. These materials can be decal transferred onto conductor surfaces or electrolessly or electrolytically disposed thereon.

公开(公告)号：DE69003333T2

公开(公告)日：1994-04-21

申请号：DE69003333

申请日：1990-07-07

Applicant: IBM

Inventor： KANG SUNG KWON ,  PALMER MICHEAL JON ,  REILEY TIMOTHY CLARK ,  TOPA ROBERT DAVID

IPC: B23K20/02 ,  B23K20/233 ,  B23K33/00 ,  H01L21/60 ,  H01L21/603 ,  H01L21/00

Abstract: A contact member for thermocompression bonding in integrated circuit packaging has on a conductor end a uniform texture deformable layer with a hardness value in the range of that of soft gold which is approximately 90 on the Knoop scale and with a rough surface morphology having ridges with approximately 1 micrometer modulation frequency and a depth between ridges of from 1/4 to 1/2 that of the average integrated circuit pad. The deformable layer is produced by plating gold in a strong electronegative plating bath within a range of 0.03 to 0.05 mA/sq.cm. current density. Plating apparatus, for plating different areas, with different electronegative conditions, with separate independently powered anodes, is provided.

公开(公告)号：DE68913823D1

公开(公告)日：1994-04-21

申请号：DE68913823

申请日：1989-04-27

Applicant: IBM

Inventor： CUOMO JEROME JOHN ,  KANG SUNG KWON ,  KIM JUNGIHL ,  LAURO PAUL ,  MIERSCH EKKEHARD FRITZ ,  RITSKO JOHN JAMES ,  SAXENMEYER GEORGE JOHN ,  WALKER GEORGE FREDERICK

IPC: H01R13/02 ,  H01R4/26 ,  H01R4/58 ,  H01R13/22 ,  H05K3/32

公开(公告)号：DE69003333D1

公开(公告)日：1993-10-21

申请号：DE69003333

申请日：1990-07-07

Applicant: IBM

Inventor： KANG SUNG KWON ,  PALMER MICHEAL JON ,  REILEY TIMOTHY CLARK ,  TOPA ROBERT DAVID

IPC: B23K20/02 ,  B23K20/233 ,  B23K33/00 ,  H01L21/60 ,  H01L21/603 ,  H01L21/00

Abstract: A contact member for thermocompression bonding in integrated circuit packaging has on a conductor end a uniform texture deformable layer with a hardness value in the range of that of soft gold which is approximately 90 on the Knoop scale and with a rough surface morphology having ridges with approximately 1 micrometer modulation frequency and a depth between ridges of from 1/4 to 1/2 that of the average integrated circuit pad. The deformable layer is produced by plating gold in a strong electronegative plating bath within a range of 0.03 to 0.05 mA/sq.cm. current density. Plating apparatus, for plating different areas, with different electronegative conditions, with separate independently powered anodes, is provided.

公开(公告)号：ES2131080T3

公开(公告)日：1999-07-16

申请号：ES93105142

申请日：1993-03-29

Applicant: IBM

Inventor： BRADY MICHAEL JOHN ,  FARRELL CURTIS EDWARD ,  KANG SUNG KWON ,  MARINO JEFFREY ROBERT

IPC: H01L21/60 ,  C23C18/50 ,  C25D3/54 ,  H01L21/288 ,  H01L21/603 ,  H01L21/768 ,  H01L23/495 ,  H01L23/498 ,  H01L23/532 ,  H01L23/485

Abstract: Silicon and germanium containing materials are used at surface of conductors in electronic devices. Solder can be fluxlessly bonded and wires can be wire bonded to these surfaces. These material are used as a surface coating for lead frames for packaging integrated circuit chips. These materials can be decal transferred onto conductor surfaces or electrolessly or electrolytically disposed thereon.

公开(公告)号：AT180357T

公开(公告)日：1999-06-15

申请号：AT93105142

申请日：1993-03-29

Applicant: IBM

Inventor： BRADY MICHAEL JOHN ,  FARRELL CURTIS EDWARD ,  KANG SUNG KWON ,  MARINO JEFFREY ROBERT

IPC: H01L21/60 ,  C23C18/50 ,  C25D3/54 ,  H01L21/288 ,  H01L21/603 ,  H01L21/768 ,  H01L23/495 ,  H01L23/498 ,  H01L23/532 ,  H01L23/485

Abstract: Silicon and germanium containing materials are used at surface of conductors in electronic devices. Solder can be fluxlessly bonded and wires can be wire bonded to these surfaces. These material are used as a surface coating for lead frames for packaging integrated circuit chips. These materials can be decal transferred onto conductor surfaces or electrolessly or electrolytically disposed thereon.

公开(公告)号：IE960846A1

公开(公告)日：1997-09-24

申请号：IE960846

申请日：1996-12-02

Applicant: IBM

Inventor： ANDRICACOS PANAYOTIS CONSTANTI ,  DATTA MADAV ,  DELIGIANNI HARIKLIA ,  HORKANS WILMA JEAN ,  KANG SUNG KWON ,  KWIETNIAK KEITH THOMAS ,  MATHAD GANGADHARA SWAMI ,  PURUSHOTHAMAN SAMPATH ,  SHI LEATHEN ,  TONG HO-MING

IPC: B23K35/26 ,  B23K35/00 ,  B32B15/01 ,  C22C13/00 ,  C22C13/02 ,  H01L21/60 ,  H01L23/485 ,  H01L23/488

Abstract: An interconnection structure suitable for the connection of microelectronic circuit chips to packages is provided by this invention. In particular, the invention pertains to the area-array or flip-chip technology often called C4 (controlled collapse chip connection). The structure comprises an adhesion/barrier layer deposited on a passivated substrate (e.g., a silicon wafer), optionally an additional adhesion layer, a solderable layer of a metal selected from the group consisting of Ni, Co, Fe, NiFe, NiCo, CoFe, and NiCoFe on the adhesion/barrier layer, and lead free solder ball comprising tin as the predominate component and one or more alloying elements selected from Bi, Ag, and Sb, and further optionally including one or more elements selected from the group consisting of Zn, In, Ni, Co and Cu.

公开(公告)号：MY134716A

公开(公告)日：2007-12-31

申请号：MYPI9300721

申请日：1993-04-21

Applicant: IBM

Inventor： BRADY MICHAEL JOHN ,  RIELEY SHELDON COLE ,  WALKER GEORGE FREDERICK ,  FARRELL CURTIS EDWARD ,  KANG SUNG KWON ,  MARINO JEFFREY ROBERT ,  MIKALSEN DONALD JOSEPH ,  MOSKOWITZ PAUL ANDREW ,  O'SULLIVAN EUGENE JOHN ,  O'TOOLE TERRENCE ROBERT ,  PURUSHOTHAMAN SAMPATH

IPC: H01L21/60 ,  H01L23/485 ,  C23C18/50 ,  C25D3/54 ,  H01L21/288 ,  H01L21/603 ,  H01L21/768 ,  H01L23/495 ,  H01L23/498 ,  H01L23/532

Abstract: SILICON AND GERANIUM CONTAINING MATERIALS ARE USED AT SURFACE OF CONDUCTORS IN ELECTRONIC DEVICES. SOLDER CAN BE FLUXLESSLY BONDED AND WIRES CAN BE WIRED BONDED TO THESE SURFACES. THESE MATERIAL ARE USED AS A SURFACE COATING FOR LEAD FRAMES FOR PACKAGING INTEGRATED CIRCUIT CHIPS. THESE MATERIALS CAN BE DECAL TRANSFERRED ONTO CONDUCTOR SURFACES OR ELECTROLESSLY OR ELECTROLYTICALLY DISPOSED THEREON.(FIG. 1)

公开(公告)号：SG76544A1

公开(公告)日：2000-11-21

申请号：SG1998001183

申请日：1998-06-02

Applicant: IBM

Inventor： KANG SUNG KWON ,  PURUSHOTHAMAN SAMPATH ,  RAI RAJINDER SINGH

IPC: B23K1/20 ,  B23K35/24 ,  H01B1/22 ,  H01L21/60

Abstract: WHAT IS DESCRIBED IS NEW ELECTRODEPOSITED POWDER MATERIALS TO BE USED FOR THE ELECTRICALLY CONDUCTIVE PASTE FORMULATIONS, IN SEVERAL TYPES OF THEIR STRUCTURES AS FOLLOWS: ELECTRODEPOSITED POWDER CONSISTING OF SN(UNDERCOAT)/CU(DENDRITE)/SN(BARRIER)/IN(OVERCOAT.THE SN (BARRIER) LAYER CAN BE REPLACED BY ONE OF THE FOLLOWING METALS AND THEIR ALLOYS; Sn, Ni, Co, Cr, Fe, AND Pd.THE UNDERCOAT SN LAYER CAN BE REPLACED BY ONE OF THE FOLLOWING METALS AND THEIR ALLOYS; Sn IN, Zn, Sb, Bi AND Ag. ELECTRODEPOSITED POWDER CONSISTING OF Sn (UNDERCOAT)/CU(DENDRITE)/Bi-Sn (OVERCOAT).WHAT IS ADDITIONALLY CLAIMED IS THE USAGE OF THIS ELECTRODEPOSITED POWDER MATERIALS TO MAKE FILLED POLYMER PASTES FOR MAKING CONDUCTING LINES, GROUND PLANES, AND VIA FILLS IN THE CONVENTIONAL PRINTED CIRCUIT BOARDS BY REPLACING EITHER THE ADDITIVE OR SUBTRACTIVE CU TECHNOLOGY. THIS WILL FACILITATE THE ELIMINATION OF PROCESS STEPS AND CHEMICALS THUS REDUCING COST AND THE ENVIRONMENTAL IMPACT ASSOCIATED WITH PRINTED CIRCUIT BOARD MANUFACTURING. IT IS ALSO CLAIMED THAT THE PASTE CAN BE USED TO ATTACH ELECTRONIC COMPONENTS SUCH AS CHIPS AND CHIP CARRIER TAPES TO SUBSTRATES SUCH AS CHIP CARRIERS THAT PANEL DISPLAY GLASS AND PRINTED WIRING BOARDS.(FIG. 5)